MTFC64GAPALBH-IT - 64GB eMMC 5.1 Industrial NAND | Micron
Référence : MTFC64GAPALBH-IT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $36.5 | $36,50 |
| 10 | $32.85 | $328,50 |
| 100 | $28.2 | $2 820,00 |
| 500 | $24.95 | $12 475,00 |
| 1 000 | $22.4 | $22 400,00 |
MTFC64GAPALBH-IT Présentation
An eMMC (embedded MultiMediaCard) is a managed-NAND package that combines raw MLC/TLC NAND flash with an onboard controller handling wear-leveling, bad-block management, and ECC. eMMC belongs to the managed NAND product family, which sits between raw NAND (requiring an external controller) and UFS (a faster, more advanced managed-NAND interface). The integration of controller + NAND + firmware dramatically simplifies host firmware, allowing even resource-constrained microcontrollers and Linux SoCs to add reliable mass storage with minimal driver development.
Key features of the MTFC64GAPALBH-IT include an operating temperature range of -40C to +85C (industrial grade, indicated by the -IT suffix), HS400 bus interface mode, advanced 12-signal bus features, and an 8-bit data width organized as 8G x 8. The -IT ordering code designates industrial temperature and a specific firmware/feature set optimized for long-life industrial designs rather than consumer or automotive.
Architecturally, the device embeds a MultiMediaCard controller that arbitrates access to four 128 Gb MLC NAND dice behind a standard MMC bus, exposing boot partitions, RPMB, and user-area partitions to the host. The controller also implements background operations like garbage collection and wear-leveling, offloading these from the application processor. The HS400 interface mode pushes the bus to 200 MHz DDR, achieving sequential read speeds substantially higher than legacy HS200 mode.
Typical applications include industrial IoT gateways, factory automation HMIs, point-of-sale terminals, medical instrumentation data loggers, and Linux-based single-board computers. The 64 GB capacity is well-suited to storing operating system images, application data, and multimedia assets in a compact, soldered-down footprint. Designers should note the power-loss protection guidance from Micron application notes, as sudden VCC collapse during write operations can cause data corruption if decoupling and write-abort firmware handling are inadequate.
When laying out the PCB, place the MTFC64GAPALBH-IT on a clean inner or outer ground plane with the VCCQ decoupling capacitors within 2 mm of the balls. Avoid routing noisy switching signals under the package and follow Micron's reference layout for the 153-ball TFBGA escape. The -IT grade's wide temperature range enables deployment in outdoor enclosures, but the design must still account for the thermal derating curve of the MLC NAND endurance at high temperature.
This page synthesizes distributor pricing, drop-in alternatives, application companion parts, and design notes not found in the manufacturer datasheet alone, providing engineers with a one-stop reference for sourcing, designing, and qualifying the MTFC64GAPALBH-IT in production.
Alternatives de remplacement direct pour MTFC64GAPALBH-IT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MTFC64GAPALBH-AAT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MTFC64GAPALBH-AIT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MTFC64GAPALBH-I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MTFC64GAPALBH-AAT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MTFC128GAPALBH-IT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MTFC64GAPALBH-IT Valeurs maximales et caractéristiques électriques
| Type de mémoire | Non-Volatile FLASH - NAND (eMMC Managed NAND) |
| Memory Format | eMMC |
| Density | 64 Gbit (64 GB) |
| Organisation de la mémoire | 8G x 8 |
| Type d'interface | MMC (MultiMediaCard) |
| JEDEC Standard | eMMC 5.1 (JESD84-B51) |
| NAND Die Composition | 4x L05B MLC 128 Gb dice |
| Bus Width | Advanced 12-signal bus |
| Maximum Bus Mode | HS400 (200 MHz DDR) |
| VCC Supply Voltage | 2.7 V to 3.6 V |
| VCCQ I/O Voltage | 1.70 V to 1.95 V or 2.7 V to 3.6 V (dual voltage) |
| Plage de température de fonctionnement | -40 C to +85 C (Industrial) |
| Boîtier | 153-ball TFBGA (11.5 mm x 13 mm) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Ordering Suffix | -IT (Industrial Temperature) |
Guide de configuration des broches du MTFC64GAPALBH-IT 153-ball tfbga (11.5 mm x 13 mm)
Configuration des broches du MTFC64GAPALBH-IT (boîtier 153-ball tfbga (11.5 mm x 13 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MTFC64GAPALBH-IT.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MTFC64GAPALBH-IT convient pour 6 applications: Industrial IoT Gateways, Factory Automation HMIs and Panel PCs, Point-of-Sale Terminals, Medical Data Loggers, Linux Single-Board Computers, Surveillance and Video Recorders.
Industrial IoT Gateways
The MTFC64GAPALBH-IT's 64 GB eMMC 5.1 capacity and -40C to +85C industrial temperature range make it a strong fit for industrial IoT gateways that must run embedded Linux or Azure RTOS alongside data buffering for uplink. Its HS400 bus mode sustains 200 MHz DDR transfers, which is critical when the gateway aggregates sensor streams at hundreds of kilobits per second and writes them to non-volatile storage before forwarding to the cloud. Compared with raw NAND, the integrated MMC controller offloads wear-leveling and bad-block management from the gateway's application processor, freeing CPU cycles for protocol stacks like MQTT or OPC-UA. The 153-ball TFBGA footprint also allows the part to be placed on a compact 4-layer PCB typical of DIN-rail mounted gateways.
Recommandé
Factory Automation HMIs and Panel PCs
Human-machine interfaces and industrial panel PCs need reliable non-volatile storage that survives vibration, temperature swings, and continuous read/write cycles. The MTFC64GAPALBH-IT's 64 GB capacity comfortably stores the HMI runtime, multilingual asset databases, recipe libraries, and trending logs typical of SCADA panel applications. Its managed-NAND architecture with built-in wear-leveling extends write endurance well beyond what a raw NAND design would offer, and the industrial -40C to +85C temperature range matches the IEC 60068-2-1/2 environmental test profiles used in factory automation qualification. The HS400 bus mode keeps the HMI responsive even while logging to a local SQLite database at 50 ms intervals.
Recommandé
Point-of-Sale Terminals
Point-of-sale terminals require compact, soldered-down storage that holds the OS, payment application, transaction logs, and periodic receipt archives. The MTFC64GAPALBH-IT's 64 GB eMMC 5.1 density supports years of transaction records without external SD cards, and its managed-NAND wear-leveling is designed for the mixed read/write workload of POS workloads. The 153-ball TFBGA package is small enough to fit beneath a 5-inch capacitive touchscreen carrier board, and the industrial temperature range suits semi-outdoor retail deployments. Compliance to JEDEC JESD84-B51 ensures the Linux or Android BSP for the payment processor supports the device out of the box, reducing software certification effort for PCI-PTS approval.
Recommandé
Medical Data Loggers
Medical instrumentation such as patient monitors, infusion pumps, and diagnostic analyzers must log clinical data to non-volatile storage with high reliability. The MTFC64GAPALBH-IT's industrial temperature range supports clinical environments from refrigerated storage to operating theatres, and its managed-NAND controller provides predictable write latency required for synchronized physiological data capture. While the part is not AEC-Q100 qualified, it is widely used in IEC 60601-1 medical electrical equipment designs where automotive-grade qualification is not mandatory. The 64 GB capacity supports months of high-resolution waveform logging in compact ambulatory monitors, reducing the frequency of data offload cycles.
Recommandé
Linux Single-Board Computers
Linux single-board computers used in industrial and maker applications need eMMC storage to boot the OS and hold user data without relying on a fragile SD card socket. The MTFC64GAPALBH-IT is supported by mainline Linux kernel drivers and U-Boot for the major SoC platforms including NXP i.MX, Texas Instruments Sitara, and STMicro STM32MP1, allowing a designer to solder the part directly to a carrier PCB and treat it as a fixed boot medium. The 64 GB capacity is the sweet spot for Yocto or Buildroot-based root filesystems with application data, and the eMMC 5.1 HS400 bus mode eliminates the I/O bottleneck typical of SD card boot. The industrial -40C to +85C temperature range suits fanless enclosures in industrial cabinets.
Recommandé
Surveillance and Video Recorders
Network video recorders and edge-AI surveillance cameras need compact, high-throughput non-volatile storage for short video clips, AI metadata, and firmware updates. The MTFC64GAPALBH-IT's HS400 bus mode at 200 MHz DDR sustains the multi-megabyte-per-second write workload of H.265 video pre-roll buffers, while its 64 GB capacity supports 24-72 hours of edge-event clips before offload to NAS. The managed-NAND controller handles the highly random write pattern of surveillance metadata far better than raw NAND, extending endurance and reducing firmware complexity on the camera SoC. The industrial temperature rating allows deployment in outdoor IP66 camera housings without thermal shutdown, and the small TFBGA package fits the constrained camera main board.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MTFC64GAPALBH-IT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MTFC64GAPALBH-AAT | MTFC64GAPALBH-AIT | MTFC64GAPALBH-I | MTFC128GAPALBH-IT |
|---|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Package | 153-ball TFBGA (11.5x13 mm) | 153-ball TFBGA (11.5x13) - same | 153-ball TFBGA (11.5x13) - same | 153-ball TFBGA (11.5x13) - same | 153-ball TFBGA (11.5x13) - same |
| Density | 64 Gbit (64 GB) | 64 Gbit (64 GB) - same | 64 Gbit (64 GB) - same | 64 Gbit (64 GB) - same | 128 Gbit (128 GB) - +100% |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +105 C (Automotive) | -40 C to +85 C (Automotive/Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) |
| JEDEC Standard | eMMC 5.1 (JESD84-B51) | eMMC 5.1 (JESD84-B51) - same | eMMC 5.1 (JESD84-B51) - same | eMMC 5.1 (JESD84-B51) - same | eMMC 5.1 (JESD84-B51) - same |
| Maximum Bus Mode | HS400 (200 MHz DDR) | HS400 - same | HS400 - same | HS400 - same | HS400 - same |
| VCC Supply | 2.7 V to 3.6 V | 2.7 V to 3.6 V - same | 2.7 V to 3.6 V - same | 2.7 V to 3.6 V - same | 2.7 V to 3.6 V - same |
| AEC-Q100 Qualified | No | Yes | Yes (automotive grade) | No | No |
| RoHS Status | Compliant | Compliant | Compliant | Compliant | Compliant |
Principaux différenciateurs
- Industrial temperature grade at standard pricing (vs MTFC64GAPALBH-AAT)
- HS400 200 MHz DDR bus mode support (vs MTFC64GAPALBH-AAT)
- Same-footprint scalability to 128GB (vs MTFC128GAPALBH-IT)
Notes de conception
The MTFC64GAPALBH-IT requires both VCC (2.7-3.6 V) and VCCQ (1.70-1.95 V or 2.7-3.6 V) rails. Decouple each VCC ball with a 0.1 uF X7R ceramic capacitor placed within 2 mm of the ball, and add a bulk 4.7 uF ceramic per rail near the device. The dual-voltage VCCQ allows the eMMC I/O to interface with 1.8 V SoCs (common in low-power i.MX and Sitara processors) without level shifters, reducing BOM cost. Monitor the VCC rail for power-loss events - the eMMC controller requires a minimum hold-up time to complete in-flight writes, so adding a small supercapacitor or sufficient bulk capacitance on the host side is recommended for industrial designs subject to brown-outs.
At continuous HS400 write workloads, the 153-ball TFBGA package can dissipate 0.8-1.2 W internally, raising the junction temperature above ambient. Ensure the PCB has a continuous ground plane beneath the package and stitch the GND balls to inner ground layers with multiple thermal vias to spread heat. The industrial -40C to +85C operating range refers to ambient; for designs in sealed enclosures without airflow, the junction-to-ambient thermal resistance (theta_JA) of approximately 25-30 C/W (per Micron package data) means that the actual ambient must stay below ~70 C at maximum sustained write throughput to keep Tj under 100 C. Add a temperature sensor near the part for thermal monitoring in fanless designs.
Follow Micron's reference PCB layout for the 153-ball TFBGA escape. The 0.5 mm ball pitch requires laser-drilled microvias or precise HDI stackup - 4-layer 1+2+1 build-up with 0.1 mm via pad and 0.25 mm via drill is typical. Route the CLK signal on an inner layer with ground reference on both sides to control 50 ohm impedance, and length-match the DAT[7:0] traces within 0.5 mm of the CLK length to meet HS400 DDR timing. Avoid routing noisy signals (DC-DC switch nodes, high-speed SERDES) under the BGA escape region. The CMD line should be pulled up to VCCQ with a 4.7 kohm to 10 kohm resistor, and the RST_n line is optional per eMMC 5.1 - tie to VCCQ if not used.
A common pitfall is treating eMMC like raw NAND and writing directly without going through the MMC driver layer - the controller expects all access to come through standard MMC commands (CMD24/CMD25 single/multi-block write). Forcing direct mode bypass can cause the firmware to enter an undefined state. Another pitfall is power-cycling during a write: the host must either wait for the write to complete or issue a CMD12 (STOP_TRANSMISSION) followed by a CMD13 (SEND_STATUS) before cutting VCC. Failing to do so can leave the controller mid-page-program, corrupting the current block. Finally, do not exceed the rated 260 C peak reflow temperature per JEDEC J-STD-020, and respect the MSL3 moisture sensitivity handling (pre-bake at 125 C for 24 hours if the factory floor exposure exceeds the floor-life budget).
Informations de conformité
RoHS compliant per DigiKey and Micron product listings. Not AEC-Q100 qualified; choose -AAT variant for automotive. REACH compliance confirmed by Micron product page.
