MX30UF4G28AB - 4Gbit SLC Parallel NAND Flash | Macronix
Référence : MX30UF4G28AB ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.5 | $4,50 |
| 10 | $4.05 | $40,50 |
| 100 | $3.6 | $360,00 |
| 500 | $3.15 | $1 575,00 |
| 1 000 | $2.7 | $2 700,00 |
| 3 000 | $2.3 | $6 900,00 |
MX30UF4G28AB Présentation
An SLC NAND flash memory stores one bit per cell using a single-level charge representation, offering higher endurance (typically 100k P/E cycles per block), faster write performance, and longer data retention than MLC/TLC counterparts. Within the broader non-volatile memory hierarchy, NAND flash sits between NOR flash (byte-addressable, used for code storage) and managed NAND (e.g., eMMC, UFS - integrating controller and NAND in a single package). SLC NAND specifically targets industrial, automotive, and embedded systems where reliability and write endurance outweigh the per-bit cost advantage of higher-density MLC/TLC.
Key features include ONFI 1.0-compatible command set, two-plane operation with Status Enhanced Read command (78h), 25 ns page read access, internal data move/erase, and hardware data protection. The 1.8 V core and I/O voltage (1.7 V to 1.95 V range) makes it suitable for low-power embedded designs, and the TSOP-I package provides a drop-in migration path from legacy parallel NOR/PSRAM layouts.
The device uses a charge-trap or floating-gate SLC NAND array organized as 4096 blocks (typical 128 Kbytes each) with 2112-byte pages (2048 data + 64 spare), supporting single-plane and two-plane page read/program operations. The asynchronous parallel interface is fully multiplexed with CE, ALE, CLE, RE, WE control signals to a shared 8/16-bit I/O bus, and the integrated controller manages ECC, bad-block management, and wear-leveling hints.
Typical applications include industrial embedded storage (HMI, PLC data logging), networking equipment boot+OS storage, automotive infotainment and instrument clusters, set-top box firmware storage, and point-of-sale terminals requiring high-endurance non-volatile memory with parallel interface simplicity.
When designing with this part, follow ONFI 1.0 timing parameters, allocate ECC strength of at least 4-bit per 528 bytes (BCH or Hamming), implement bad-block management in firmware, and reserve the spare area for ECC metadata plus block status. Avoid hot-temperature write operations beyond 70 °C if maximum P/E endurance is required.
This page synthesizes distributor pricing, drop-in alternatives from the same Macronix NAND family, and practical SLC NAND design notes not aggregated in the manufacturer datasheet alone.
Alternatives de remplacement direct pour MX30UF4G28AB — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MX30UF4G28AB (même facteur de forme et même empreinte) — différant par Interface, MSL Level, Memory Organization, Operating Temperature, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MX30UF4G28AC-TI
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MX30UF4G28AC-XKI
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MX30UF4G28AD-XKI
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MX30UF4G18AB-XKI
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MT29F4G08ABAEAWP
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
TC58NVG2S0HTAI0
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
MX30UF4G28AB Valeurs maximales et caractéristiques électriques
| Type de mémoire | FLASH - NAND (SLC) |
| Taille de mémoire | 4 Gbit |
| Memory Organization | 512M x 8 |
| Interface | Parallel (asynchronous) |
| Bus Width | x8 / x16 selectable |
| Access Time (tRC) | 25 ns (typical) |
| Supply Voltage (VCC) | 1.7 V to 1.95 V (1.8 V typ) |
| Technology | SLC (Single-Level Cell) NAND |
| Page Size | 2048 bytes + 64 bytes spare (x8) |
| Boîtier | 48-pin TSOP-I (TI) / 63-ball VFBGA (XKI) |
| Température de fonctionnement | -40 °C to +85 °C (industrial) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (per JEDEC J-STD-020, typical for TSOP) |
Guide de configuration des broches du MX30UF4G28AB 48-pin tsop-i (ti) / 63-ball vfbga (xki)
Configuration des broches du MX30UF4G28AB (boîtier 48-pin tsop-i (ti) / 63-ball vfbga (xki)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour MX30UF4G28AB.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
MX30UF4G28AB convient pour 6 applications: Industrial HMI / PLC Data Logging, Networking Equipment Boot + OS Storage, Automotive Infotainment and Instrument Cluster, Set-Top Box Firmware Storage, Point-of-Sale (POS) Terminal Transaction Log, Embedded Linux Rootfs Storage.
Industrial HMI / PLC Data Logging
The MX30UF4G28AB's 4 Gbit SLC capacity and 100k P/E cycle endurance per block make it well-suited for industrial HMI and PLC data-logging storage. Its 1.8 V supply aligns with modern low-power SoCs while keeping I/O levels compatible with 1.8 V GPIO. The 25 ns page read access supports burst transfers of process-variable history without MCU stalls. The device fits designs that previously used discrete NOR+SRAM, replacing both with one parallel NAND IC. Compared with MLC/TLC alternatives, the SLC technology avoids bit-error bursts during write-amplification scenarios common in append-only log workloads. ECC strength of 4-bit per 528 bytes is recommended to match the datasheet's endurance guarantee.
Recommandé
Networking Equipment Boot + OS Storage
Routers, switches, and access points commonly pair a small NOR boot region with a larger OS+firmware storage; the MX30UF4G28AB consolidates both into a single 4 Gbit SLC NAND. The parallel asynchronous interface simplifies the host SoC boot path, since the bootloader can directly read pages into DDR without SPI overhead. The 1.8 V core and I/O reduce overall router power budget versus 3.3 V NAND alternatives. SLC endurance handles frequent firmware-update and syslog write cycles that would wear out MLC NAND within a few years. ONFI 1.0 command compatibility ensures the bootloader can re-use standard NAND drivers across router SKUs.
Recommandé
Automotive Infotainment and Instrument Cluster
The MX30UF4G28AB targets automotive infotainment and instrument-cluster non-volatile storage where reliability over the vehicle lifetime is critical. SLC NAND's 10x write endurance advantage over MLC makes it suitable for the frequent map-update and configuration-write workloads in infotainment head units. The 48-pin TSOP-I package is a long-standing automotive form factor with proven solder-joint reliability on rigid FR-4 and flexi PCB stacks. Industrial -40 °C to +85 °C operating temperature aligns with cabin-temperature automotive specs; for under-hood applications, review Macronix's AEC-Q100-qualified MX30UF4G*8AB-Q suffix variants.
Recommandé
Set-Top Box Firmware Storage
Set-top boxes (STBs) boot their Linux/Android image from a parallel NAND like the MX30UF4G28AB to balance cost and capacity. The 4 Gbit capacity is sufficient for compressed Linux rootfs plus DVB channel databases and conditional-access modules. The 25 ns access time keeps the STB's initial-boot time within product requirements (typically under 10 s to first-channel lock). Parallel interface simplifies DMA-based page reads from the host SoC, which matters for fast channel-zapping and EPG loads. SLC technology handles the frequent OTA firmware updates that STB operators push over the satellite/cable downlink.
Recommandé
Point-of-Sale (POS) Terminal Transaction Log
POS terminals require non-volatile storage for transaction logs that must survive power loss, periodic health-check audit logs, and frequent firmware updates - all workloads aligned with SLC NAND strengths. The MX30UF4G28AB's 4 Gbit capacity supports months of compressed transaction history on a single device. The hardware WP# pin plus internal data protection features guard against unintended writes during battery-swap or brown-out events. The 48-pin TSOP-I option simplifies field-replacement service workflows (TSOP is hand-reworkable, while VFBGA requires hot-air rework stations).
Recommandé
Embedded Linux Rootfs Storage
Embedded Linux designs in industrial gateways, building controllers, and edge-compute nodes use the MX30UF4G28AB as rootfs storage where reliability and field-upgradability matter. The device holds the kernel image, device-tree blobs, rootfs (squashfs/ubifs), and persistent application data partitions on a single IC, reducing BOM cost versus SPI-NOR+SD-card solutions. The parallel interface's burst-read throughput allows fast kernel-decompress and systemd-service-start during boot. SLC NAND's superior write-endurance survives the syslog/journal writes that frequently damage MLC devices over multi-year deployments. JFFS2 or UBI/UBIFS filesystems pair well with this NAND and handle bad-block management transparently.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MX30UF4G28AB — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MX30UF4G28AC-TI | MX30UF4G28AD-XKI | MX30UF4G18AB-XKI | MT29F4G08ABAEAWP | TC58NVG2S0HTAI0 |
|---|---|---|---|---|---|---|
| Brand | Macronix | Macronix | Macronix | Macronix | Micron Technology | Kioxia |
| Package | 48-pin TSOP-I (TI) / 63-ball VFBGA (XKI) | 48-pin TSOP-I - same | 63-ball VFBGA (9x11) - same | 63-ball VFBGA (9x11) - same | 48-pin TSOP-I - same | 48-pin TSOP-I - same |
| Memory Size | 4 Gbit | 4 Gbit | 4 Gbit | 2 Gbit (-50%) | 4 Gbit | 4 Gbit |
| Technology | SLC NAND | SLC NAND | SLC NAND | SLC NAND | SLC NAND | SLC NAND |
| Supply Voltage | 1.7 V to 1.95 V (1.8 V typ) | 1.7 V to 1.95 V | 1.7 V to 1.95 V | 1.7 V to 1.95 V | 1.7 V to 1.95 V | 1.7 V to 1.95 V |
| Access Time | 25 ns | 25 ns | 20-25 ns | 25 ns | 25 ns | 25 ns |
| Interface | Parallel (x8/x16) | Parallel (x8/x16) | Parallel (x8/x16) | Parallel (x8/x16) | Parallel (x8) | Parallel (x8) |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C |
Principaux différenciateurs
- Single Macronix 4 Gbit SLC NAND family spanning both TSOP-I and VFBGA packages with identical command set (vs MT29F4G08ABAEAWP)
- Forward migration path within Macronix's revision ladder (AB → AC → AD) (vs TC58NVG2S0HTAI0)
- Lower 1.8 V operating voltage matches modern low-power SoCs without level shifters (vs Legacy 3.3 V parallel NAND (e.g., MX30LF series predecessors))
Notes de conception
Failure to implement bad-block management (BBM) in firmware is the most common pitfall when designing with the MX30UF4G28AB. NAND flash inherently contains bad blocks that must be skipped during initial factory-bad-block scan and during runtime. Macronix marks factory bad blocks via a non-FFh byte in the spare area of the first page of each block. Without BBM, the filesystem will silently corrupt data the first time it writes to a bad block. Always scan the first page of every block at first power-up and maintain a BBM table in a reserved area; use JFFS2, UBI/UBIFS, or a custom MTD layer to abstract the underlying media.
Place the MX30UF4G28AB as close as possible to the host SoC's memory controller pins to minimize parallel bus trace lengths. Matched-length routing within ±150 mil across the 8/16-bit I/O bus and the RE#, WE# strobes is critical for 25 ns timing. Add 22-33 ohm series damping resistors near the SoC side of the bus to suppress ringing on the parallel traces. For the TSOP-I package, route the bus on the top layer under the IC and reference it to a continuous ground plane on layer 2 to control impedance near 50 ohms. Add a 0.1 µF + 1 µF decoupling pair adjacent to each VCC/VCCQ pin and a bulk 10 µF near the package to suppress page-program current transients.
Implement a hardware write-protect (WP#) sequencing scheme that holds WP# low during power-up, brown-out, and reset to prevent accidental program/erase operations. The MX30UF4G28AB samples WP# state at WE# rising edge; if WP# is high during a power-up transient, a glitched command could corrupt the block address. Connect WP# to the SoC's reset line through a logic buffer, or use a simple RC delay that holds WP# low for 100 ms after VCC stabilizes. Also route R/B# (ready/busy) back to the host as a status input to avoid busy-wait polling that wastes CPU cycles.
Informations de conformité
RoHS compliant per Macronix product page. Industrial -40 °C to +85 °C operating temperature. AEC-Q100 variants available under separate -Q suffix part numbers; the standard MX30UF4G28AB is not AEC-Q100 qualified.
