PIC32MX330F064H-V/RG - 32-bit MCU 80MHz 64KB Flash 64-VQFN | Microchip
Référence : PIC32MX330F064H-V/RG ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.5 | $5,50 |
| 10 | $5.1 | $51,00 |
| 100 | $4.6 | $460,00 |
| 500 | $4.1 | $2 050,00 |
| 1 000 | $3.65 | $3 650,00 |
PIC32MX330F064H-V/RG Présentation
What is a 32-bit microcontroller? A microcontroller (MCU) is a single-chip computer containing a processor core, program memory (Flash), working memory (RAM), and integrated peripherals such as timers, communication interfaces, and analog blocks. The PIC32MX3/4 family sits within the broader taxonomy of microcontrollers -> embedded processors -> semiconductors, and is widely adopted for cost-sensitive embedded designs requiring 32-bit performance without the overhead of higher-end Cortex-M parts.
Key features include 80 MHz / 100 DMIPS core performance, 64KB program memory with 16KB RAM, an integrated 10-bit ADC, two SPI/I2S ports, two I2C, two UART, USB 2.0 full-speed OTG, five 16-bit timers, a parallel master port, and 53 digital I/O pins. The MIPS32 core delivers deterministic real-time response in industrial control and automotive HMI applications.
The device uses a 5-stage pipeline Harvard architecture with single-cycle multiplication, enabling efficient DSP-like operations. The integrated USB 2.0 full-speed OTG controller eliminates the need for an external USB transceiver, while the 10-bit 1 Msps ADC with up to 28 analog input channels supports precision sensor acquisition.
Typical applications include automotive instrument clusters and infotainment HMI, industrial automation controllers, USB peripherals, sensor hub systems, consumer audio with processing amplifier footers, and low-power IoT connected edge devices. The wide peripheral integration is leveraged when wiring sensor and IO communication paths down to MCU nodes.
When designing with this device, observe the 2.5V/3.3V supply window and the VQFN-64 thermal pad PCB mounting requirements. The -V suffix denotes an automotive-grade (-40C to +125C) operating range, and the part is supplied in tube packaging as indicated by the /RG suffix.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers evaluate PIC32MX330F064H-V/RG for new designs and second-source qualification.
Alternatives de remplacement direct pour PIC32MX330F064H-V/RG — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX330F064H-V/RG (même facteur de forme et même empreinte) — différant par Package, ADC, USB, Operating Temperature, UART.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX330F064HT-V/RG
✅ Remplacement direct✓ En stock
$3.05 / unité
Voir la fiche technique →PIC32MX330F064H-I/MR
✅ Remplacement direct✓ En stock
$4.1 / unité
Voir la fiche technique →PIC32MX330F064HT-V/MR
✅ Remplacement direct✓ En stock
$4.12 / unité
Voir la fiche technique →PIC32MX270F512L-V/PF
✅ Remplacement direct✓ En stock
$5.1 / unité
Voir la fiche technique →PIC32MX274F256B-V/SO
✅ Remplacement direct✓ En stock
$4.41 / unité
Voir la fiche technique →PIC32MX330F064H-V/RG Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Frequency | 80 MHz |
| Performance | 100 DMIPS |
| Program Memory (Flash) | 64 KB (64K x 8) |
| SRAM | 16 KB |
| Operating Voltage | 2.5V / 3.3V |
| Plage de température de fonctionnement | -40C to +125C (Automotive Grade) |
| Number of I/O Pins | 53 |
| Boîtier | 64-pin VQFN (9x9 mm) with exposed pad |
| ADC | 10-bit, up to 28 channels, 1 Msps |
| USB | USB 2.0 Full-Speed OTG |
| SPI / I2S | 2 |
| I2C | 2 |
| UART | 2 |
| Timers | 5x 16-bit |
| Parallel Master Port (PMP) | Yes |
| AEC-Q100 Grade | Qualified (Automotive Grade -V suffix) |
| Type de montage | Surface Mount |
Guide de configuration des broches du PIC32MX330F064H-V/RG 64-pin vqfn (9x9 mm) with exposed pad
Configuration des broches du PIC32MX330F064H-V/RG (boîtier 64-pin vqfn (9x9 mm) with exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MX330F064H-V/RG.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MX330F064H-V/RG convient pour 6 applications: Automotive Instrument Cluster, USB HID Peripheral Devices, Industrial HMI / Operator Panels, Sensor Hub and Data Logger, Consumer Audio Processing, IoT Edge Connectivity Bridge.
Automotive Instrument Cluster
The PIC32MX330F064H-V/RG is ideal for instrument cluster applications thanks to its 64-pin VQFN footprint, AEC-Q100 automotive qualification, parallel master port (PMP) for TFT/LCD interfacing, and 53 GPIO pins for driving stepper motors, LED arrays, and analog gauge signals. With 80 MHz MIPS32 M4K core delivering 100 DMIPS, the device can drive PWM-controlled backlights, perform CAN-bridge protocol conversion, and update display refresh at automotive-grade latency. The integrated 10-bit ADC samples up to 28 sensor channels including fuel level, oil pressure, and temperature sensors in real time. AEC-Q automotive grade uses the -V suffix and -40C to +125C temperature range to meet under-hood thermal environments.
Recommandé
USB HID Peripheral Devices
The PIC32MX330F064H-V/RG's integrated USB 2.0 full-speed OTG controller eliminates the need for an external PHY, making it ideal for USB HID peripherals, custom keyboards, mice, game controllers, and CDC virtual COM port devices. With 64KB Flash and 16KB SRAM, the MCU can host USB stacks, HID report descriptors, and application logic in a single chip without external memory. The 80 MHz MIPS32 M4K core processes USB HIDs with deterministic latency, while the 53 GPIOs handle buttons, encoders, RGB LEDs, and analog joysticks. The automotive-grade -V variant performs reliably across wide temperature envelopes including in-cabin and out-of-cabin deployments.
Recommandé
Industrial HMI / Operator Panels
The PIC32MX330F064H-V/RG suits industrial HMI panels with parallel master port driving TFT/STN LCDs and touch controllers. The PMP interface connects to graphical displays with reduced external glue, while 53 GPIOs drive matrix keypads, LEDs, and relay outputs. The 10-bit ADC samples analog sensors including temperature and pressure with up to 28 channels, and the integrated USB enables field firmware updates and configuration via USB. Industrial panel uses leverage the wide operating temperature and integrated peripherals to replace multiple discrete components.
Recommandé
Sensor Hub and Data Logger
The PIC32MX330F064H-V/RG functions as a sensor hub aggregating analog and digital sensor data via its 28-channel 10-bit ADC, two I2C buses, and two SPI ports. With 16KB SRAM and 64KB Flash, the MCU buffers sensor readings and runs lightweight filtering algorithms on-board. The automotive temperature grade supports deployment in industrial sensor nodes and outdoor installations. Two UART is leveraged when bridging to RS-485 sensor networks for industrial sensor hub applications.
Recommandé
Consumer Audio Processing
The PIC32MX330F064H-V/RG integrates two SPI/I2S interfaces ideal for digital audio bridging and DSP preprocessing. Audio devices with processing amplifier backends leverage the I2S ports to connect to audio DACs and codecs without external logic. The 80 MHz MIPS32 M4K core can run audio effects algorithms, while the integrated USB enables USB audio class device support for headphone and microphone peripherals. Two SPI/I2S drives dual-channel audio DAC/ADC pairs in compact consumer audio designs.
Recommandé
IoT Edge Connectivity Bridge
The PIC32MX330F064H-V/RG serves as an IoT edge bridge connecting local sensors and actuators to upstream gateways via USB, I2C, SPI, or UART. With USB OTG and two UARTs, the MCU can manage multiple connectivity stacks simultaneously. The 16KB SRAM holds connection state and protocol frames, and the 64KB Flash fits embedded TLS clients and MQTT/CoAP stacks. Wide temperature and automotive grade supports edge deployments in outdoor enclosures and factory floors.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX330F064H-V/RG — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX330F064HT-V/RG | PIC32MX330F064H-I/MR | PIC32MX330F064HT-V/MR | PIC32MX270F512L-V/PF | PIC32MX274F256B-V/SO |
|---|---|---|---|---|---|---|
| Package | 64-pin VQFN (9x9) | 64-pin VQFN (9x9) - same | 64-pin VQFN (9x9) - same | 64-pin VQFN (9x9) - same | 100-pin TQFP | 28-pin SOIC |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 50 MHz | 72 MHz |
| Flash Memory | 64 KB | 64 KB | 64 KB | 64 KB | 512 KB | 256 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 64 KB | 32 KB |
| Temperature Grade | Automotive (-40C to +125C) | Automotive (-40C to +125C) | Industrial (-40C to +85C) | Automotive (-40C to +125C) | Automotive (-40C to +125C) | Automotive (-40C to +125C) |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| Packaging Media | Tube | Tape and Reel | Tube | Tape and Reel | Tray | Tube |
Principaux différenciateurs
- Integrated USB 2.0 Full-Speed OTG with on-chip transceiver (vs PIC32MX230F064H)
- Parallel Master Port (PMP) for direct LCD/TFT interfacing (vs PIC32MX270F256B)
- AEC-Q100 automotive qualification with -40C to +125C range (vs PIC32MX330F064H-I/MR)
Notes de conception
The VQFN-64 package requires a properly sized thermal pad soldered to a PCB copper pour for heat dissipation. At 80 MHz full load with all peripherals active, the device can dissipate up to ~400 mW. Per Microchip packaging documentation, design the PCB with at least 1 sq inch of 1-oz copper connected to the exposed pad (EP) to keep junction temperature within safe limits.
Decouple all VDD/VSS pin pairs with 100 nF X7R capacitors placed as close as possible to the IC pins, plus a single 10 uF bulk capacitor near the MCU. The AVDD/AVSS analog supply pair requires separate analog-ground routing to isolate noise from the ADC. The VQFN-64 EP pin must be soldered to a continuous ground pour for both electrical and thermal performance.
Do not exceed 3.6V on any VDD/AVDD pin to avoid permanent damage. The USB D+/D- pins require 27-ohm series resistors and proper PCB routing for USB 2.0 full-speed compliance. The MCLR reset pin must have a 10 kohm pull-up to VDD and a 100 nF cap to ground for reliable operation.
Informations de conformité
AEC-Q100 qualified per -V temperature grade suffix per Microchip product qualification documentation. RoHS and REACH compliant per Microchip product declaration.
