PIC32MZ0512EFF100-E/GJX - 200MHz 512KB Flash MCU | Microchip
Référence : PIC32MZ0512EFF100-E/GJX ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $11.85 | $11,85 |
| 10 | $10.67 | $106,70 |
| 100 | $9.48 | $948,00 |
| 500 | $8.52 | $4 260,00 |
| 1 000 | $7.62 | $7 620,00 |
PIC32MZ0512EFF100-E/GJX Présentation
A 32-bit MCU (microcontroller unit) is a single-chip computer that integrates a processor core, program and data memory, and a configurable peripheral set. The PIC32MZ EF family is positioned at the high end of Microchip's PIC32 portfolio, targeting applications that demand deterministic real-time response combined with rich connectivity. Within the broader taxonomy, this part is a 32-bit microcontroller -> RISC MCU -> embedded processor -> semiconductor IC. The MIPS32 M-Class architecture supports hardware multiply-accumulate, saturating and fractional math, and DSP primitives that simplify audio and motor-control firmware.
Key features include dual-panel Flash for live firmware update, 12-bit ADC at 18 Msps, analog comparators, multiple timer/counter modules, an 8-bit parallel master port (PMP) for graphics, and dedicated audio interfaces (I2S/AC97). The 100-TFBGA package is paired with Microchip's MPLAB Harmony development framework, providing integrated middleware for USB, TCP/IP, graphics, and motor control.
Typical applications include industrial automation controllers, automotive body and HMI modules, IoT edge gateways with Ethernet, graphics display terminals, and sensor-hub platforms. The combination of CAN, Ethernet, and HS USB makes it well suited for connected industrial nodes, while the FPU and dual-panel Flash support safety-critical firmware with in-field update capability.
Designers should pay close attention to the 100-TFBGA PCB layout, which requires microvia or laser-drilled via stack-ups; the high 200 MHz core speed demands careful power-plane decoupling. The dual-panel Flash feature requires the application to manage two program images and a bootloader partition. AEC-Q100 qualification simplifies automotive end-product certification.
This page synthesizes distributor pricing, drop-in alternatives drawn from the PIC32MZ EF family, and practical PCB design notes that supplement the manufacturer datasheet.
Alternatives de remplacement direct pour PIC32MZ0512EFF100-E/GJX — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ0512EFF100-E/GJX (même facteur de forme et même empreinte) — différant par Core Architecture, ADC, Package, Ethernet, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ0512EFE100-E/GJX
✅ Remplacement direct✓ En stock
$9.52 / unité
Voir la fiche technique →PIC32MZ0512EFF100-I/GJX
✅ Remplacement direct✓ En stock
$5.85 / unité
Voir la fiche technique →PIC32MZ0512EFF100T-E/GJX
✅ Remplacement direct✓ En stock
$6.65 / unité
Voir la fiche technique →PIC32MZ1024EFF100-E/GJX
✅ Remplacement direct✓ En stock
$7.75 / unité
Voir la fiche technique →PIC32MZ0512EFE100-E/PT
✅ Remplacement direct✓ En stock
$7.92 / unité
Voir la fiche technique →PIC32MZ0512EFF100-E/GJX Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M-Class (PIC32MZ EF) |
| Core Frequency | 200 MHz (330 DMIPS) |
| Program Flash | 512 KB (512K x 8) |
| SRAM | 128 KB |
| FPU | IEEE 754 single-precision |
| Operating Voltage | 2.2 V to 3.6 V (typical 3.3 V) |
| Température de fonctionnement | -40C to +125C (extended, -E suffix) |
| Boîtier | 100-pin TFBGA (7x7 mm) |
| Crypto Engine | Not present (No-Crypto variant) |
| CAN | Yes (CAN 2.0B) |
| USB | Hi-Speed USB 2.0 (Host/Device/OTG) |
| Ethernet | 10/100 Mbps MAC with MII/RMII |
| ADC | 12-bit, up to 18 Msps |
| AEC-Q100 | Qualified (automotive grade) |
| Type de montage | Surface Mount (TFBGA) |
Configuration des broches de PIC32MZ0512EFF100-E/GJX
| Broche A1 | AVDD — Analog supply voltage |
| Broche A2 | AVSS — Analog ground |
| Broche A3 | VREF+ — ADC positive reference |
| Broche A4 | VREF- — ADC negative reference |
| Broche A5 | AN0 — Analog input 0 |
| Broche A6 | AN1 — Analog input 1 |
| Broche A7 | AN2 — Analog input 2 |
| Broche A8 | AN3 — Analog input 3 |
| Broche A9 | AN4 — Analog input 4 |
| Broche A10 | AN5 — Analog input 5 |
| Broche B1 | VDD — Digital supply voltage |
| Broche B2 | VSS — Digital ground |
| Broche B3 | OSC1 — Crystal oscillator input |
| Broche B4 | OSC2 — Crystal oscillator output |
| Broche B5 | AN6 — Analog input 6 |
| Broche B6 | AN7 — Analog input 7 |
| Broche B7 | AN8 — Analog input 8 |
| Broche B8 | AN9 — Analog input 9 |
| Broche B9 | AN10 — Analog input 10 |
| Broche B10 | AN11 — Analog input 11 |
| Broche C1 | PGEC1 — ICSP programming clock |
| Broche C2 | PGED1 — ICSP programming data |
| Broche C3 | TMS — JTAG test mode select |
| Broche C4 | TCK — JTAG test clock |
| Broche C5 | TDI — JTAG test data in |
| Broche C6 | TDO — JTAG test data out |
| Broche C7 | AN12 — Analog input 12 |
| Broche C8 | AN13 — Analog input 13 |
| Broche C9 | AN14 — Analog input 14 |
| Broche C10 | AN15 — Analog input 15 |
| Broche D1 | PMD0 — Parallel master port data 0 |
| Broche D2 | PMD1 — Parallel master port data 1 |
| Broche D3 | PMD2 — Parallel master port data 2 |
| Broche D4 | PMD3 — Parallel master port data 3 |
| Broche D5 | PMD4 — Parallel master port data 4 |
| Broche D6 | PMD5 — Parallel master port data 5 |
| Broche D7 | PMD6 — Parallel master port data 6 |
| Broche D8 | PMD7 — Parallel master port data 7 |
| Broche D9 | PMALL — PMP address latch low |
| Broche D10 | PMRD — PMP read strobe |
| Broche E1 | PMCS1 — PMP chip select 1 |
| Broche E2 | PMCS2 — PMP chip select 2 |
| Broche E3 | PMWR — PMP write strobe |
| Broche E4 | PMA0 — PMP address 0 |
| Broche E5 | PMA1 — PMP address 1 |
| Broche E6 | PMA2 — PMP address 2 |
| Broche E7 | PMA3 — PMP address 3 |
| Broche E8 | PMA4 — PMP address 4 |
| Broche E9 | PMA5 — PMP address 5 |
| Broche E10 | PMA6 — PMP address 6 |
| Broche F1 | USBID — USB OTG ID pin |
| Broche F2 | VBUS — USB VBUS sense |
| Broche F3 | D+ — USB D+ data line |
| Broche F4 | D- — USB D- data line |
| Broche F5 | ETXD0 — Ethernet transmit data 0 |
| Broche F6 | ETXD1 — Ethernet transmit data 1 |
| Broche F7 | ERXD0 — Ethernet receive data 0 |
| Broche F8 | ERXD1 — Ethernet receive data 1 |
| Broche F9 | ERXCLK — Ethernet receive clock |
| Broche F10 | ETXCLK — Ethernet transmit clock |
| Broche G1 | C1RX — CAN 1 receive |
| Broche G2 | C1TX — CAN 1 transmit |
| Broche G3 | SDA1 — I2C 1 data |
| Broche G4 | SCL1 — I2C 1 clock |
| Broche G5 | SCK1 — SPI 1 clock |
| Broche G6 | SDI1 — SPI 1 data in |
| Broche G7 | SDO1 — SPI 1 data out |
| Broche G8 | U1TX — UART 1 transmit |
| Broche G9 | U1RX — UART 1 receive |
| Broche G10 | U1CTS — UART 1 clear-to-send |
| Broche H1 | OC1 — Output compare 1 / PWM |
| Broche H2 | OC2 — Output compare 2 / PWM |
| Broche H3 | OC3 — Output compare 3 / PWM |
| Broche H4 | OC4 — Output compare 4 / PWM |
| Broche H5 | IC1 — Input capture 1 |
| Broche H6 | IC2 — Input capture 2 |
| Broche H7 | INT0 — External interrupt 0 |
| Broche H8 | INT1 — External interrupt 1 |
| Broche H9 | INT2 — External interrupt 2 |
| Broche H10 | INT3 — External interrupt 3 |
| Broche J1 | MCLR — Master clear reset |
| Broche J2 | TRCLK — Trace clock |
| Broche J3 | TRD0 — Trace data 0 |
| Broche J4 | TRD1 — Trace data 1 |
| Broche J5 | SDA2 — I2C 2 data |
| Broche J6 | SCL2 — I2C 2 clock |
| Broche J7 | RTCC — Real-time clock output |
| Broche J8 | CVREF — Comparator voltage reference |
| Broche J9 | C2RX — CAN 2 receive |
| Broche J10 | C2TX — CAN 2 transmit |
Applications typiques
PIC32MZ0512EFF100-E/GJX convient pour 6 applications: Industrial Automation Controllers, Automotive Body and HMI Modules, IoT Edge Gateways with Ethernet, Graphics Display Terminals, Motor Control and Drives, Sensor Hubs and Data Loggers.
Industrial Automation Controllers
The PIC32MZ0512EFF100-E/GJX fits industrial automation controllers because its 200 MHz MIPS32 M-class core with single-precision FPU executes PID loops, motion trajectories, and Modbus/TCP stacks with deterministic latency. The 512 KB dual-panel Flash supports live firmware updates critical for factory-floor deployments where downtime is expensive, while 128 KB SRAM accommodates Ethernet frame buffers for PROFINET/EtherNet/IP slave stacks. The AEC-Q100 qualification and -40C to +125C operating range let the same BOM variant serve both industrial cabinets and on-vehicle subsystems, simplifying part numbering for OEM product lines.
Recommandé
Automotive Body and HMI Modules
The PIC32MZ0512EFF100-E/GJX targets automotive body and HMI modules where AEC-Q100 qualification, -40C to +125C operation, and integrated CAN 2.0B are mandatory. The dedicated audio interfaces (I2S/AC97) and 8-bit PMP graphics port let the MCU drive segment-LCD or TFT panels for instrument clusters and HVAC controls, while the FPU accelerates audio DSP such as active noise cancellation. With HS USB, Ethernet, and CAN all available concurrently, designers can implement body-domain gateways that aggregate sensor data from sub-buses and expose it to infotainment or telematics links.
Recommandé
IoT Edge Gateways with Ethernet
The PIC32MZ0512EFF100-E/GJX is well matched to IoT edge gateways because the integrated 10/100 Ethernet MAC plus HS USB 2.0 and CAN deliver the multi-protocol bridging required between sensor networks, cloud uplinks, and local displays. The 128 KB SRAM buffers TLS handshakes and MQTT payloads, while 512 KB Flash holds a TCP/IP stack, MQTT client, and OTA bootloader. MPLAB Harmony 3 provides mature middleware for lwIP and wolfSSL, shortening development. The FPU lets local analytics (filtering, FFT-based vibration analysis) run on-gateway, reducing uplink bandwidth.
Recommandé
Graphics Display Terminals
For graphics display terminals, the PIC32MZ0512EFF100-E/GJX combines a 200 MHz MIPS32 core with a parallel master port (PMP) capable of driving small TFT displays up to WQVGA resolution. The FPU accelerates vector graphics rendering, while the dedicated timer/PWM outputs support backlight control and touch-panel coordination. The 512 KB Flash comfortably holds a graphics library plus application logic, and the dual-panel Flash architecture enables safe in-field UI redesigns. The on-chip 12-bit ADC reads touch coordinates and ambient light sensors without external components.
Recommandé
Motor Control and Drives
The PIC32MZ0512EFF100-E/GJX serves motor-control applications such as BLDC, PMSM, and stepper drives thanks to its 200 MHz core, hardware FPU for Park/Clarke transforms, and high-resolution PWM/timer peripherals. The 18 Msps 12-bit ADC samples phase currents with sub-microsecond conversion latency, while the dual-panel Flash enables field-upgradeable control firmware - valuable for tuning commutation parameters in deployed drives. CAN connectivity supports CiA 402 or CANopen drive profiles, and the extended -40C to +125C operating range handles drive-cabinet ambient temperatures.
Recommandé
Sensor Hubs and Data Loggers
The PIC32MZ0512EFF100-E/GJX works as a sensor hub and data logger because its 12-bit 18 Msps ADC, multiple I2C/SPI ports, and 128 KB SRAM can aggregate readings from many transducers while running local filtering. The USB device port streams logged data to a host PC without external bridge chips, and the Ethernet MAC supports industrial protocols like BACnet for building automation. Dual-panel Flash provides safe in-field firmware update with rollback, while the AEC-Q100 grade allows the same part to be used in cabin-mounted automotive sensor modules.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ0512EFF100-E/GJX — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ0512EFE100-E/GJX | PIC32MZ0512EFF100-I/GJX | PIC32MZ1024EFF100-E/GJX |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (7x7 mm) | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same | 100-TFBGA (7x7 mm) - same |
| Core Speed | 200 MHz / 330 DMIPS | 200 MHz / 330 DMIPS | 200 MHz / 330 DMIPS | 200 MHz / 330 DMIPS |
| Flash | 512 KB | 512 KB | 512 KB | 1 MB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB |
| Crypto Engine | No | Yes (AES/SHA/RNG) | No | No |
| Temperature Grade | -40C to +125C (-E) | -40C to +125C (-E) | -40C to +85C (-I) | -40C to +125C (-E) |
| AEC-Q100 | Qualified | Qualified | Not qualified (industrial) | Qualified |
Principaux différenciateurs
- AEC-Q100 qualified 32-bit MCU with extended -40C to +125C operating range in same package as industrial grade (vs PIC32MZ0512EFF100-I/GJX)
- Dual-panel Flash enables live firmware update with atomic rollback (vs PIC32MX570F512L-I/PT)
- Integrated 10/100 Ethernet MAC with hardware DMA offload (vs PIC32MX795F512L-80I/PF)
Notes de conception
The 100-TFBGA package at 0.65 mm pitch requires a 4-layer PCB minimum with microvia or laser-drilled via stack-ups for escape routing. Per Microchip family datasheet section on PCB layout, place at least one decoupling capacitor (100 nF X7R) within 2 mm of every VDD/VSS pair, plus bulk 4.7 uF on each supply rail. The exposed thermal pad is not present on this TFBGA, so thermal dissipation depends primarily on the internal bond wires and the application's duty cycle.
The PIC32MZ0512EFF100-E/GJX requires a 3.3 V main supply (2.2 V to 3.6 V allowed) with separate analog (AVDD) and digital (VDD) rails. Per the family datasheet, AVDD and VDD must be powered up within 50 ms of each other to avoid latch-up; place a ferrite bead or small resistor between AVDD and VDD, then tie both to the same 3.3 V rail with separate decoupling. For noise-sensitive ADC measurements, add a 10 ohm isolation resistor between AVDD and VDD to decouple switching noise from the analog reference.
Do not confuse the FF (no-crypto) and FE (with-crypto) variants when ordering - both share the same 100-TFBGA footprint and same datasheet but the FE variant requires enabling the crypto module in Harmony 3 and adds approximately $1-2 to unit cost. Also note that the -E temperature grade (-40C to +125C) is required for AEC-Q100 automotive designs; the -I grade only reaches +85C and will fail AEC-Q100 stress profiles. Finally, ensure the dual-panel Flash bootloader partition is allocated before application code is written.
Informations de conformité
AEC-Q100 qualified per the part family datasheet. RoHS compliant and lead-free per Microchip product page. Halogen-free status should be confirmed against the latest Microchip MDDS document.