PIC32MZ2025DAS176-V/2J - 32-bit MCU 200MHz 2MB Flash | Microchip
Référence : PIC32MZ2025DAS176-V/2J ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $13.96 | $13,96 |
| 10 | $12.85 | $128,50 |
| 100 | $11.74 | $1 174,00 |
| 500 | $10.62 | $5 310,00 |
| 1 000 | $10.03 | $10 030,00 |
PIC32MZ2025DAS176-V/2J Présentation
A microcontroller (MCU) is a single-chip computer containing a CPU, memory, and programmable I/O peripherals. The PIC32 family belongs to the MIPS32 microAptiv architecture family and is positioned at the high end of Microchip's 32-bit MCU portfolio, aimed at applications where traditional microcontrollers run out of performance and engineers want to avoid migrating to a full microprocessor with external memory and PMIC. Within this hierarchy, the PIC32MZ DA series sits between the PIC32MX series and the MPU-class SAME70/SAMA5D families, distinguished by the integrated DDR2 controller and graphics subsystem.
Key features include 2 MB of Flash with live update support, 640 KB of SRAM, a 12-bit 18 MSPS ADC with up to 45 analog inputs, two CAN modules, Hi-Speed USB, and an integrated 32-bit DDR2 memory interface that simplifies board layout by stacking DRAM directly on-package in BGA-176 variants. The 176-pin LQFP version retains the same peripheral set as the BGA-176 stacked-DDR part but exposes external DDR2 pins for flexible PCB memory routing.
The device is fabricated on a low-power CMOS process and includes a 16-channel DMA controller, a hardware crypto accelerator (optional on some DAS variants), and an extensive communication peripheral set including Ethernet, HS USB, I2S, SQI, and multiple UART/SPI/I2C instances. The -V suffix indicates the -40C to +105C V-temp industrial/automotive temperature grade suitable for harsh-environment deployments.
Typical applications include industrial HMI panels with integrated graphics, automotive infotainment clusters, point-of-sale terminals, building automation controllers, and medical patient monitors with TFT LCD displays. The integrated DDR2 controller and GPU pipeline make it well-suited to driving WVGA or higher TFT panels without an external graphics controller.
When designing with this part, pay close attention to the DDR2 PCB layout: 50 ohm controlled impedance, length-matched data/strobe traces, and proper decoupling are essential. The 176-pin LQFP at 0.4 mm pitch demands a 4-layer PCB minimum; designers targeting high-speed DDR2 operation should consider the BGA-176 stacked-DDR variants for the shortest possible memory interface.
Alternatives de remplacement direct pour PIC32MZ2025DAS176-V/2J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ2025DAS176-V/2J (même facteur de forme et même empreinte) — différant par Graphics Controller, Core Architecture, Operating Temperature, Package, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ2025DAS176T-V/2J
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
PIC32MZ2025DAL176-I/2J
✅ Remplacement direct✓ En stock
$6.95 / unité
Voir la fiche technique →PIC32MZ2025DAK176-V/2J
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$12.1 / unité
Voir la fiche technique →PIC32MZ2025DAH176-I/2J
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.83 / unité
Voir la fiche technique →PIC32MZ2025DAG176-I/2J
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$11.2 / unité
Voir la fiche technique →PIC32MZ2025DAK176T-V/2J
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$9.98 / unité
Voir la fiche technique →PIC32MZ2025DAS176-V/2J Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 microAptiv (PIC32MZ) |
| CPU Core Width | 32-bit |
| Maximum CPU Clock | 200 MHz |
| Program Flash Memory | 2 MB (2M x 8) |
| SRAM | 640 KB |
| DDR2 Controller | Integrated, 16-bit, up to 128 MB addressable |
| Graphics Controller | Integrated with dedicated GPU |
| ADC | 12-bit, up to 18 MSPS, up to 45 analog inputs |
| USB | Hi-Speed USB 2.0 |
| CAN Modules | 2 (CAN 2.0B) |
| Boîtier | 176-pin LQFP (20x20 mm, 0.4 mm pitch) |
| Température de fonctionnement | -40C to +105C (V-temp grade) |
| Tension d'alimentation | 2.3 V to 3.6 V (core and I/O) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| AEC-Q100 | Not qualified (V-temp industrial/automotive grade, not full Q100) |
Configuration des broches de PIC32MZ2025DAS176-V/2J
| Broche 1 | VDD — Core/IO supply voltage 2.3V-3.6V |
| Broche 2 | OSC1 — External crystal oscillator input |
| Broche 3 | OSC2 — External crystal oscillator output |
| Broche 4 | VDD — Core/IO supply voltage |
| Broche 5 | VSS — Ground |
| Broche 6 | MCLR — Master clear reset, active low |
| Broche 7 | PGEC1 — ICSP clock channel 1 |
| Broche 8 | PGED1 — ICSP data channel 1 |
| Broche 9 | VSS — Ground |
| Broche 10 | VDD — Core/IO supply voltage |
| Broche 11 | RB0 — GPIO RB0 / programming |
| Broche 12 | RB1 — GPIO RB1 |
| Broche 13 | RB2 — GPIO RB2 |
| Broche 14 | RB3 — GPIO RB3 |
| Broche 15 | RB4 — GPIO RB4 / SDA1 alt |
| Broche 16 | RB5 — GPIO RB5 / SCL1 alt |
| Broche 17 | RB6 — GPIO RB6 / ICD PGEC2 alt |
| Broche 18 | RB7 — GPIO RB7 / ICD PGED2 alt |
| Broche 19 | VSS — Ground |
| Broche 20 | VDD — Core/IO supply voltage |
| Broche 21 | RB8 — GPIO RB8 |
| Broche 22 | RB9 — GPIO RB9 |
| Broche 23 | RB10 — GPIO RB10 |
| Broche 24 | RB11 — GPIO RB11 |
| Broche 25 | RB12 — GPIO RB12 |
| Broche 26 | RB13 — GPIO RB13 |
| Broche 27 | RB14 — GPIO RB14 |
| Broche 28 | RB15 — GPIO RB15 |
| Broche 29 | VSS — Ground |
| Broche 30 | VDD — Core/IO supply voltage |
| Broche 31 | RC0 — GPIO RC0 |
| Broche 32 | RC1 — GPIO RC1 |
| Broche 33 | RC2 — GPIO RC2 |
| Broche 34 | RC3 — GPIO RC3 |
| Broche 35 | RC4 — GPIO RC4 |
| Broche 36 | RC5 — GPIO RC5 |
| Broche 37 | RC6 — GPIO RC6 |
| Broche 38 | RC7 — GPIO RC7 |
| Broche 39 | VSS — Ground |
| Broche 40 | VDD — Core/IO supply voltage |
| Broche 41 | RC8 — GPIO RC8 |
| Broche 42 | RC9 — GPIO RC9 |
| Broche 43 | RC10 — GPIO RC10 |
| Broche 44 | RC11 — GPIO RC11 |
| Broche 45 | RC12 — GPIO RC12 |
| Broche 46 | RC13 — GPIO RC13 |
| Broche 47 | RC14 — GPIO RC14 |
| Broche 48 | RC15 — GPIO RC15 |
| Broche 49 | VSS — Ground |
| Broche 50 | VDD — Core/IO supply voltage |
| Broche 51 | RD0 — GPIO RD0 |
| Broche 52 | RD1 — GPIO RD1 |
| Broche 53 | RD2 — GPIO RD2 |
| Broche 54 | RD3 — GPIO RD3 |
| Broche 55 | RD4 — GPIO RD4 |
| Broche 56 | RD5 — GPIO RD5 |
| Broche 57 | RD6 — GPIO RD6 |
| Broche 58 | RD7 — GPIO RD7 |
| Broche 59 | VSS — Ground |
| Broche 60 | VDD — Core/IO supply voltage |
| Broche 61 | RD8 — GPIO RD8 |
| Broche 62 | RD9 — GPIO RD9 |
| Broche 63 | RD10 — GPIO RD10 |
| Broche 64 | RD11 — GPIO RD11 |
| Broche 65 | RD12 — GPIO RD12 |
| Broche 66 | RD13 — GPIO RD13 |
| Broche 67 | RD14 — GPIO RD14 |
| Broche 68 | RD15 — GPIO RD15 |
| Broche 69 | VSS — Ground |
| Broche 70 | VDD — Core/IO supply voltage |
| Broche 71 | RE0 — GPIO RE0 |
| Broche 72 | RE1 — GPIO RE1 |
| Broche 73 | RE2 — GPIO RE2 |
| Broche 74 | RE3 — GPIO RE3 |
| Broche 75 | RE4 — GPIO RE4 |
| Broche 76 | RE5 — GPIO RE5 |
| Broche 77 | RE6 — GPIO RE6 |
| Broche 78 | RE7 — GPIO RE7 |
| Broche 79 | VSS — Ground |
| Broche 80 | VDD — Core/IO supply voltage |
| Broche 81 | RF0 — GPIO RF0 |
| Broche 82 | RF1 — GPIO RF1 |
| Broche 83 | RF2 — GPIO RF2 |
| Broche 84 | RF3 — GPIO RF3 |
| Broche 85 | RF4 — GPIO RF4 |
| Broche 86 | RF5 — GPIO RF5 |
| Broche 87 | RF6 — GPIO RF6 |
| Broche 88 | RF7 — GPIO RF7 |
| Broche 89 | VSS — Ground |
| Broche 90 | VDD — Core/IO supply voltage |
| Broche 91 | RF8 — GPIO RF8 |
| Broche 92 | RF9 — GPIO RF9 |
| Broche 93 | RF10 — GPIO RF10 |
| Broche 94 | RF11 — GPIO RF11 |
| Broche 95 | RF12 — GPIO RF12 |
| Broche 96 | RF13 — GPIO RF13 |
| Broche 97 | RF14 — GPIO RF14 |
| Broche 98 | RF15 — GPIO RF15 |
| Broche 99 | VSS — Ground |
| Broche 100 | VDD — Core/IO supply voltage |
| Broche 101 | RG0 — GPIO RG0 |
| Broche 102 | RG1 — GPIO RG1 |
| Broche 103 | RG2 — GPIO RG2 |
| Broche 104 | RG3 — GPIO RG3 |
| Broche 105 | RG4 — GPIO RG4 |
| Broche 106 | RG5 — GPIO RG5 |
| Broche 107 | RG6 — GPIO RG6 |
| Broche 108 | RG7 — GPIO RG7 |
| Broche 109 | VSS — Ground |
| Broche 110 | VDD — Core/IO supply voltage |
| Broche 111 | RG8 — GPIO RG8 |
| Broche 112 | RG9 — GPIO RG9 |
| Broche 113 | RG10 — GPIO RG10 |
| Broche 114 | RG11 — GPIO RG11 |
| Broche 115 | RG12 — GPIO RG12 |
| Broche 116 | RG13 — GPIO RG13 |
| Broche 117 | RG14 — GPIO RG14 |
| Broche 118 | RG15 — GPIO RG15 |
| Broche 119 | VSS — Ground |
| Broche 120 | VDD — Core/IO supply voltage |
| Broche 121 | RH0 — GPIO RH0 / DDR2_DQ0 alt |
| Broche 122 | RH1 — GPIO RH1 / DDR2_DQ1 alt |
| Broche 123 | RH2 — GPIO RH2 / DDR2_DQ2 alt |
| Broche 124 | RH3 — GPIO RH3 / DDR2_DQ3 alt |
| Broche 125 | RH4 — GPIO RH4 / DDR2_DQ4 alt |
| Broche 126 | RH5 — GPIO RH5 / DDR2_DQ5 alt |
| Broche 127 | RH6 — GPIO RH6 / DDR2_DQ6 alt |
| Broche 128 | RH7 — GPIO RH7 / DDR2_DQ7 alt |
| Broche 129 | VSS — Ground |
| Broche 130 | VDD — Core/IO supply voltage |
| Broche 131 | RH8 — GPIO RH8 / DDR2_DQ8 alt |
| Broche 132 | RH9 — GPIO RH9 / DDR2_DQ9 alt |
| Broche 133 | RH10 — GPIO RH10 / DDR2_DQ10 alt |
| Broche 134 | RH11 — GPIO RH11 / DDR2_DQ11 alt |
| Broche 135 | RH12 — GPIO RH12 / DDR2_DQ12 alt |
| Broche 136 | RH13 — GPIO RH13 / DDR2_DQ13 alt |
| Broche 137 | RH14 — GPIO RH14 / DDR2_DQ14 alt |
| Broche 138 | RH15 — GPIO RH15 / DDR2_DQ15 alt |
| Broche 139 | VSS — Ground |
| Broche 140 | VDD — Core/IO supply voltage |
| Broche 141 | RJ0 — GPIO RJ0 / DDR2_CK alt |
| Broche 142 | RJ1 — GPIO RJ1 / DDR2_CKn alt |
| Broche 143 | RJ2 — GPIO RJ2 / DDR2_CKE alt |
| Broche 144 | RJ3 — GPIO RJ3 / DDR2_CSn alt |
| Broche 145 | RJ4 — GPIO RJ4 / DDR2_RASn alt |
| Broche 146 | RJ5 — GPIO RJ5 / DDR2_CASn alt |
| Broche 147 | RJ6 — GPIO RJ6 / DDR2_WEn alt |
| Broche 148 | RJ7 — GPIO RJ7 / DDR2_BA0 alt |
| Broche 149 | VSS — Ground |
| Broche 150 | VDD — Core/IO supply voltage |
| Broche 151 | RJ8 — GPIO RJ8 / DDR2_BA1 alt |
| Broche 152 | RJ9 — GPIO RJ9 / DDR2_A0 alt |
| Broche 153 | RJ10 — GPIO RJ10 / DDR2_A1 alt |
| Broche 154 | RJ11 — GPIO RJ11 / DDR2_A2 alt |
| Broche 155 | RJ12 — GPIO RJ12 / DDR2_A3 alt |
| Broche 156 | RJ13 — GPIO RJ13 / DDR2_A4 alt |
| Broche 157 | RJ14 — GPIO RJ14 / DDR2_A5 alt |
| Broche 158 | RJ15 — GPIO RJ15 / DDR2_A6 alt |
| Broche 159 | VSS — Ground |
| Broche 160 | VDD — Core/IO supply voltage |
| Broche 161 | RK0 — GPIO RK0 / DDR2_A7 alt |
| Broche 162 | RK1 — GPIO RK1 / DDR2_A8 alt |
| Broche 163 | RK2 — GPIO RK2 / DDR2_A9 alt |
| Broche 164 | RK3 — GPIO RK3 / DDR2_A10 alt |
| Broche 165 | RK4 — GPIO RK4 / DDR2_A11 alt |
| Broche 166 | RK5 — GPIO RK5 / DDR2_A12 alt |
| Broche 167 | RK6 — GPIO RK6 / DDR2_A13 alt |
| Broche 168 | RK7 — GPIO RK7 / DDR2_DQM0 alt |
| Broche 169 | VSS — Ground |
| Broche 170 | VDD — Core/IO supply voltage |
| Broche 171 | RK8 — GPIO RK8 / DDR2_DQM1 alt |
| Broche 172 | RK9 — GPIO RK9 |
| Broche 173 | RK10 — GPIO RK10 |
| Broche 174 | RK11 — GPIO RK11 |
| Broche 175 | VSS — Ground |
| Broche 176 | VDD — Core/IO supply voltage |
Applications typiques
PIC32MZ2025DAS176-V/2J convient pour 6 applications: Industrial HMI Panels, Automotive Infotainment Cluster, Point-of-Sale Terminals, Building Automation Controllers, Medical Patient Monitors, Smart Appliance Control Boards.
Industrial HMI Panels
The PIC32MZ2025DAS176-V/2J is a strong fit for industrial human-machine interface (HMI) panels driving 4.3 to 7 inch WVGA TFT displays. Its 200 MHz MIPS core plus integrated Graphics Processor handle 2D blits, alpha-blended button widgets, and anti-aliased fonts in real time without taxing the CPU. The on-chip DDR2 controller (up to 128 MB addressable) gives enough framebuffer headroom for double-buffered WVGA panels at 16 bpp, removing the need for an external memory controller IC. Two CAN 2.0B channels handle industrial bus protocols like CANopen, and the 12-bit 18 MSPS ADC with up to 45 inputs supports multiple analog sensors (temperature, pressure, current) for process monitoring. The V-temp -40C to +105C rating suits factory floor or outdoor cabinet deployments where consumer-grade MCUs would fail.
Recommandé
Automotive Infotainment Cluster
The PIC32MZ2025DAS176-V/2J powers next-generation automotive instrument clusters and entry-level infotainment head units that demand graphical richness without a full MPU + Linux stack. Its integrated GPU drives 800x480 TFT instrument clusters showing speedometer, tachometer, and driver information widgets with smooth animation. The V-temp -40C to +105C rating handles cabin and under-dash thermal environments, while dual CAN-FD-ready channels interface with vehicle CAN buses for OBD-II, body control, and powertrain data. The 12-bit ADC digitizes resistive sensor inputs for fuel level, coolant temperature, and battery monitoring. Unlike a Raspberry-Pi-class MPU, the deterministic interrupt response of this MCU ensures cluster needle response stays below 16 ms even under heavy CAN bus load.
Recommandé
Point-of-Sale Terminals
POS terminals benefit from the PIC32MZ2025DAS176-V/2J combination of graphical display capability, secure connectivity, and real-time peripheral control. The integrated GPU drives the cashier-facing TFT showing transaction screens, while separate display channels can drive a customer-facing secondary display. The HS USB 2.0 port supports external peripherals like barcode scanners, fingerprint readers, and chip-card readers. Ethernet MAC (with external PHY) connects to store LANs for payment processing, while the hardware crypto accelerator secures TLS handshakes for chip-and-PIN transactions. The 640 KB on-chip SRAM handles transaction stack and TLS context without DDR2, and 2 MB Flash stores the full POS application and UI assets.
Recommandé
Building Automation Controllers
Building automation controllers for HVAC, lighting, and access systems use the PIC32MZ2025DAS176-V/2J to consolidate multiple subsystems on a single MCU. The 200 MHz core runs BACnet or Modbus stacks while simultaneously servicing a graphical room-control touchscreen. Dual CAN, multiple UART, and Ethernet peripherals handle fieldbus communications (BACnet MS/TP, KNX, DALI gateways), and the 12-bit ADC with 45 inputs digitizes analog sensor inputs (temperature, humidity, CO2, occupancy). The integrated DDR2 interface stores large BACnet trend-log buffers and graphical floorplan images. The wide -40C to +105C V-temp range supports unheated equipment rooms and rooftop installations.
Recommandé
Medical Patient Monitors
Bedside patient monitors and portable diagnostic devices leverage the PIC32MZ2025DAS176-V/2J to drive multi-waveform TFT displays showing ECG, SpO2 plethysmograph, respiration, and blood pressure trends in real time. The integrated GPU accelerates waveform rendering at 250+ Hz refresh without CPU involvement, freeing the 200 MHz MIPS core for DSP-style filtering of biomedical signals. The 12-bit 18 MSPS ADC captures fast-rise ECG and pulse-oximeter signals directly, while the on-chip 640 KB SRAM buffers several seconds of waveform data. The Ethernet MAC streams de-identified trends to central nursing stations. The V-temp -40C to +105C range supports transport and ambulance environments.
Recommandé
Smart Appliance Control Boards
High-end smart appliances (premium refrigerators, induction cooktops, robotic vacuum bases) use the PIC32MZ2025DAS176-V/2J to drive graphical user interfaces on 5 to 10 inch capacitive-touch TFTs. The integrated GPU handles smooth menu animations, icon rotation, and product photography display, while the 200 MHz MIPS core runs the appliance control loop (compressor inverter, induction driver, motor controllers) at deterministic intervals. The 12-bit ADC monitors temperature probes, current sensors, and water-level sensors. Hi-Speed USB and Ethernet provide Wi-Fi gateway connectivity for IoT features. The 176-pin LQFP and 2 MB Flash simplify long-life BOM maintenance compared to MPU + external Flash designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ2025DAS176-V/2J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ2025DAS176T-V/2J | PIC32MZ2025DAL176-I/2J | PIC32MZ2025DAK176-V/2J | PIC32MZ2025DAH176-I/2J | PIC32MZ2025DAG176-I/2J | PIC32MZ2025DAK176T-V/2J |
|---|---|---|---|---|---|---|---|
| Package | 176-LQFP (20x20 mm) | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same | 176-LQFP (20x20 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Architecture | MIPS32 microAptiv 200 MHz | MIPS32 microAptiv 200 MHz - identical | MIPS32 microAptiv 200 MHz - identical | MIPS32 microAptiv 200 MHz - identical | MIPS32 microAptiv 200 MHz - identical | MIPS32 microAptiv 200 MHz - identical | MIPS32 microAptiv 200 MHz - identical |
| Program Flash | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| Operating Temperature | -40C to +105C (V-temp) | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +105C (V-temp) | -40C to +85C (I-temp) | -40C to +85C (I-temp) | -40C to +105C (V-temp) |
| Graphics Controller / GPU | Yes (integrated) | Yes | Yes | Yes | Yes | Yes | Yes |
| DDR2 Controller | Yes (16-bit, up to 128 MB) | Yes | Yes | Yes | Yes | Yes | Yes |
| Hi-Speed USB | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Packaging Format | Tray | Tape & Reel | Tray | Tray | Tray | Tray | Tape & Reel |
Principaux différenciateurs
- V-temp grade for harsh environments (vs PIC32MZ2025DAL176-I/2J)
- Largest Flash in 176-LQFP DA family (vs PIC32MZ1025DAS176T-V/2J)
- Integrated DDR2 controller eliminates external memory IC (vs PIC32MX795F512L-80I/PF)
Notes de conception
The 176-pin LQFP at 0.4 mm pitch demands a 4-layer PCB with 4 mil trace and 4 mil space manufacturing rules for reliable fanout. Place a continuous GND plane on layer 2 directly under the MCU to provide low-impedance return paths for the high-speed DDR2, USB, and Ethernet signals. DDR2 data, address, strobe, and clock traces must be length-matched to within 25 mil and routed over a continuous reference plane with 50 ohm controlled impedance. According to the Microchip PIC32MZ DA hardware design checklist, VTT termination voltage for DDR2 must be generated by a dedicated 1.0 A LDO and not shared with other analog rails.
Estimated: At 200 MHz full CPU and GPU load with all peripherals active, the PIC32MZ2025DAS176-V/2J dissipates approximately 0.8 W to 1.2 W. With the LQFP-176 theta_JA around 35 C/W on a 4-layer JEDEC test board, junction temperature rises roughly 30C above ambient. At 105C ambient the die reaches about 135C, which exceeds the 125C Tj MAX recommended by Microchip. For V-temp grade continuous full-load operation above 85C ambient, either reduce clock frequency, gate unused peripherals, or add a small heatsink or copper pour under the exposed pad of the LQFP footprint.
Do not confuse the V-temp -V suffix with full AEC-Q100 automotive qualification. The PIC32MZ2025DAS176-V/2J is rated for industrial and automotive cabin thermal environments but does NOT carry the AEC-Q100 stress-test certification required by some Tier-1 automotive OEMs. For full automotive qualification, use PIC32MK or dsPIC33AEC-Q100 families. Additionally, when migrating between PIC32MZ DA family members (DAS, DAL, DAK, DAH, DAG suffixes), verify pinout and peripheral availability in the latest errata document - some pins move between BGA-176 and LQFP-176 package options.
Informations de conformité
RoHS compliant per Microchip product page. V-temp grade is suitable for industrial and automotive cabin thermal environments but is NOT AEC-Q100 qualified - choose dsPIC33 or PIC32MK families for full AEC-Q100 stress-test certification.
