PIC32MZ2025DAR169-V/6J - 200MHz 32-bit MCU, 2MB Flash, 169-LFBGA | Microchip
Référence : PIC32MZ2025DAR169-V/6J ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $19.5 | $19,50 |
| 10 | $17.95 | $179,50 |
| 100 | $15.8 | $1 580,00 |
| 500 | $14.2 | $7 100,00 |
| 1 000 | $12.95 | $12 950,00 |
PIC32MZ2025DAR169-V/6J Présentation
A PIC32MZ microcontroller is a 32-bit MCU based on the MIPS32 microAptiv core architecture, positioned above the Microcontrollers controller hierarchy as a low-endurance system-on-chip. The DAR sub-series specifically integrates a graphics LCD controller, hardware graphics processor (GPU), and a stacked DDR2 memory interface, allowing designers to drive a TFT display with MPU-class performance while retaining MCU-class ease of programming through MPLAB X IDE and MPLAB Harmony. Compared to legacy PIC32MX parts, PIC32MZ DAR provides significantly more RAM, on-chip DDR2, an integrated GPU, and a faster ADC, trading off power consumption for computational and graphical throughput.
Key features include 2MB program Flash, 640 KB SRAM (per Microchip product page), HS USB 2.0 device/host/OTG, CAN 2.0B, integrated 12-bit 18 MSPS ADC with up to 45 analog inputs, six UART, SPI, I2C peripherals, dedicated graphics peripherals, and a 200 MHz core capable of 415 DMIPS. The 169-LFBGA package exposes 120 GPIO pins (per pcbelectronics listing) and offers a compact 11x11 mm footprint suitable for space-constrained HMI boards.
The architecture pairs the 32-bit MIPS core to a dedicated graphics pipeline and DDR2 memory controller, eliminating the need for an external SDRAM chip for frame storage. The 12-bit 18 MSPS ADC supports high-speed sensor acquisition, while HS USB and CAN simplify connectivity for industrial gateways. Code development is supported through MPLAB X IDE, MPLAB Harmony, and XC32 compiler, with extensive middleware for graphics, USB, and TCP/IP stacks.
Typical applications include graphical human-machine interface (HMI) panels, industrial control terminals with TFT LCD, automotive infotainment clusters, point-of-sale terminals, and IoT gateways with display. The integrated GPU and DDR2 interface allow developers to run emWin, LVGL, or Microchip MPLAB Harmony Graphics without external frame buffers.
When designing with this device, allocate 8 or 10-layer PCB stack-up for the DDR2 interface to maintain signal integrity; the LFBGA-169 package requires microvia and via-in-pad capable fabrication. Ensure a stable 1.8V core supply and provide decoupling per the manufacturer reference schematic.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers shorten evaluation and sourcing.
Alternatives de remplacement direct pour PIC32MZ2025DAR169-V/6J — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MZ2025DAR169-V/6J (même facteur de forme et même empreinte) — différant par Operating Temperature, Graphics Controller, USB, ADC, CAN.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MZ2025DAR169T-V/6J
✅ Remplacement direct✓ En stock
$12.1 / unité
Voir la fiche technique →PIC32MZ2025DAR169-I/6J
✅ Remplacement direct✓ En stock
$13.25 / unité
Voir la fiche technique →PIC32MZ2025DAB169T-I/HF
✅ Remplacement direct✓ En stock
$12.62 / unité
Voir la fiche technique →PIC32MZ2025DAG169T-I/6J
✅ Remplacement direct✓ En stock
$11.85 / unité
Voir la fiche technique →PIC32MZ2025DAH169T-I/6J
✅ Remplacement direct✓ En stock
$11.85 / unité
Voir la fiche technique →PIC32MZ2025DAR169-V/6J Valeurs maximales et caractéristiques électriques
| Core Processor | MIPS32 microAptiv |
| Core Size | 32-Bit Single-Core |
| Fréquence d'horloge maximale | 200 MHz |
| Program Memory Size (Flash) | 2 MB (2M x 8) |
| Data RAM Size | 256 kB (per pcbelectronics listing; 640 KB total SRAM per Microchip product page) |
| Integrated Graphics | Yes (Graphics Controller + Graphics Processor) |
| On-chip / Externally Addressable DRAM | 32 MB or 128 MB externally addressable DDR2 |
| ADC | 12-bit, 18 MSPS, up to 45 analog inputs |
| USB | HS USB 2.0 (Device/Host/OTG) |
| CAN | CAN 2.0B |
| Number of I/Os | 120 |
| Tension d'alimentation de fonctionnement | 1.8 V (core; full range per datasheet) |
| Température de fonctionnement | -40 C to +105 C (V-temp) |
| Style de montage | SMD/SMT |
| Boîtier / Format | 169-LFBGA (11x11 mm) |
| Temperature Grade | Automotive |
Guide de configuration des broches du PIC32MZ2025DAR169-V/6J 169-lfbga (11x11 mm)
Configuration des broches du PIC32MZ2025DAR169-V/6J (boîtier 169-lfbga (11x11 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC32MZ2025DAR169-V/6J.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC32MZ2025DAR169-V/6J convient pour 6 applications: Industrial HMI with TFT LCD, Automotive Infotainment Cluster, Point-of-Sale Terminal with Touch Display, IoT Gateway with Local Display, Medical Patient Monitor with Graphical Readout, Smart Home Control Panel.
Industrial HMI with TFT LCD
The PIC32MZ2025DAR169-V/6J is purpose-built for graphical HMI panels because it integrates a Graphics Controller, hardware Graphics Processor, and a stacked DDR2 memory interface that drives TFT LCDs up to WVGA resolution without an external frame buffer. The 200 MHz MIPS32 microAptiv core delivers 415 DMIPS, more than enough for emWin or LVGL rendering at 60 fps, while the 12-bit 18 MSPS ADC with up to 45 analog inputs handles touch-screen sensing and analog front-end channels. Designers can use the integrated HS USB 2.0 and CAN 2.0B to bridge to factory networks, eliminating the need for an external MCU. Compared to PIC32MX-based HMI boards, the DA family reduces BOM cost by removing external SDRAM and graphics controller ICs, while the -40 C to +105 C V-temp grade suits unconditioned control cabinets.
Recommandé
Automotive Infotainment Cluster
The PIC32MZ2025DAR169-V/6J's V-temp grade and automotive temperature rating make it a candidate for dashboard HMI clusters, HVAC control modules, and rear-seat entertainment displays. The integrated GPU accelerates 2D drawing primitives, while the DDR2 interface allows larger framebuffer-backed icons and animated menus. With HS USB 2.0, the MCU can present as a USB device or host to smartphones and mass storage, supporting CarPlay-style connectivity prototypes. CAN 2.0B integration directly connects to vehicle body and powertrain buses without an external transceiver MCU. The 169-LFBGA package at 11x11 mm provides compact routing for space-constrained behind-cluster PCBs, and the -40 C to +105 C range covers automotive cabin and engine-bay-adjacent environments.
Recommandé
Point-of-Sale Terminal with Touch Display
For point-of-sale terminals, the PIC32MZ2025DAR169-V/6J delivers MCU-like ease of programming through MPLAB X IDE and MPLAB Harmony while providing MPU-class graphics performance for responsive touch UIs. The 12-bit ADC with up to 45 analog inputs can digitize multiple keypad and card-reader analog channels simultaneously, while HS USB 2.0 supports barcode scanners, customer-facing displays, and PIN pads. The DDR2-backed framebuffer allows smooth animations on capacitive touch panels, and the integrated Graphics Processor handles alpha blending and sprites in hardware. Compared to discrete MCU + external GPU designs, the DA family reduces PCB area and BOM cost by consolidating compute, graphics, and memory control into a single 169-LFBGA IC.
Recommandé
IoT Gateway with Local Display
The PIC32MZ2025DAR169-V/6J suits IoT gateways that require a local HMI for configuration, status, or alert display. Its integrated HS USB 2.0, multiple UART, and CAN peripherals provide ample connectivity for sensor aggregation and cloud uplinks, while the Graphics Controller and DDR2 memory interface drive a 4.3 to 7 inch WVGA panel for status dashboards. Designers leverage the 2 MB Flash and 640 KB SRAM for embedded web servers, MQTT clients, and graphics stacks simultaneously. The 200 MHz core delivers responsive HTTP and TLS handshakes, and the -40 C to +105 C V-temp range supports outdoor and industrial enclosures without additional thermal management.
Recommandé
Medical Patient Monitor with Graphical Readout
Medical patient monitors require responsive graphical readouts of waveforms (ECG, SpO2 plethysmograms) and large numeric displays, which the PIC32MZ2025DAR169-V/6J supports through its 200 MHz MIPS core and integrated GPU. The 12-bit 18 MSPS ADC samples ECG and pulse-oximeter front-ends at clinical sampling rates, while the DDR2-backed framebuffer renders waveforms at 60 fps without dropped samples. Designers use the on-chip USB and CAN to export HL7-formatted data to hospital networks. While full medical certification requires additional system-level testing, the -40 C to +105 C range supports equipment deployed in clinical environments, and the integrated peripherals reduce the bill of materials compared to discrete MCU + GPU designs.
Recommandé
Smart Home Control Panel
The PIC32MZ2025DAR169-V/6J is well-suited to wall-mounted smart home control panels where it renders animated touch UIs for lighting, HVAC, and security control. The MIPS32 microAptiv core runs Zephyr, FreeRTOS, or MPLAB Harmony with emWin graphics, while the integrated DDR2 memory interface handles large icon sets and animated transitions. HS USB 2.0 supports firmware updates and tethering, and CAN or UART connect to HVAC controllers and security panels. The compact 169-LFBGA 11x11 mm package fits slim wall-switch enclosures, and the -40 C to +105 C range supports both indoor and outdoor smart-home hubs. Power consumption is managed through MPLAB Harmony's low-power modes between touch events.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MZ2025DAR169-V/6J — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MZ2025DAR169T-V/6J | PIC32MZ2025DAR169-I/6J | PIC32MZ2025DAB169T-I/HF | PIC32MZ2025DAG169T-I/6J | PIC32MZ2025DAH169T-I/6J |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| Core | MIPS32 microAptiv, 32-bit, single-core | MIPS32 microAptiv, 32-bit, single-core | MIPS32 microAptiv, 32-bit, single-core | MIPS32 microAptiv, 32-bit, single-core | MIPS32 microAptiv, 32-bit, single-core | MIPS32 microAptiv, 32-bit, single-core |
| Maximum Clock Frequency | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Program Flash | 2 MB | 2 MB | 2 MB | 2 MB (DAB memory tier) | 2 MB (DAG memory tier) | 2 MB (DAH memory tier) |
| Operating Temperature | -40 C to +105 C (V-temp) | -40 C to +105 C (V-temp) | -40 C to +85 C (I-temp) | -40 C to +85 C (I-temp) | -40 C to +85 C (I-temp) | -40 C to +85 C (I-temp) |
| Packaging Form | Tray | Tape and Reel | Tray | Tape and Reel | Tape and Reel | Tape and Reel |
| Integrated GPU / Graphics Controller | Yes | Yes | Yes | Yes | Yes | Yes |
| External DDR2 Memory Support | 32 MB or 128 MB externally addressable DDR2 | 32 MB or 128 MB externally addressable DDR2 | 32 MB or 128 MB externally addressable DDR2 | 32 MB or 128 MB externally addressable DDR2 | 32 MB or 128 MB externally addressable DDR2 | 32 MB or 128 MB externally addressable DDR2 |
Principaux différenciateurs
- V-temp grade (-40 C to +105 C) for harsh environments (vs PIC32MZ2025DAR169-I/6J)
- Tray packaging form (vs PIC32MZ2025DAR169T-V/6J)
- Integrated GPU and DDR2 controller on a single MCU (vs External MCU + external GPU)
Notes de conception
The 169-LFBGA package at 11x11 mm requires microvia and via-in-pad capable PCB fabrication. Use 8 or 10-layer stack-up with dedicated ground and power planes adjacent to the BGA. Route DDR2 signals on inner layers with controlled impedance (50 ohm single-ended, 100 ohm differential) and matched trace lengths per the family datasheet. Keep the BGA decoupling capacitors as close as possible to the balls, with 0.1 uF and 1 uF values on each power pin. Without microvia cleanup, signal integrity of the external address bus cannot meet DDR2 timing requirements.
The PIC32MZ2025DAR169-V/6J requires a stable 1.8 V core supply and a separate I/O voltage rail; the family datasheet specifies the exact power sequencing (typically 3.3 V I/O before 1.8 V core). Place a bulk 10 uF ceramic plus 0.1 uF decoupling on each supply pin. Estimated core current under full CPU + GPU + DDR2 load can exceed 200 mA, requiring careful thermal budgeting. Use a low-dropout regulator with 3 percent or better line/load regulation; the MCP1825 is a typical companion part. Inadequate decoupling causes erratic GPU rendering and DDR2 parity errors.
At 200 MHz with GPU active, the 169-LFBGA package dissipates up to 0.8 W under worst-case workload. The estimated junction-to-ambient thermal resistance is approximately 30 C/W on a 4-layer 1 oz PCB, giving a 24 C rise above ambient. In an unventilated enclosure at 70 C ambient, the die would approach 94 C, well within the -40 C to +105 C V-temp range. Designers should still provide thermal relief copper pours under the BGA and consider airflow for outdoor industrial cabinets.
Do not skip the DDR2 initialization sequence in firmware; without proper ZQ calibration and timing configuration, the memory interface generates parity errors that manifest as graphical artifacts. Do not enable the Graphics Processor before the DDR2 controller is calibrated. Do not route high-speed USB or CAN traces across the DDR2 signals - keep them on separate layers to avoid coupling. Always verify the BSDL model against the actual BGA ball mapping before JTAG boundary-scan testing.
Informations de conformité
Compliance data (RoHS, REACH, halogen-free) not present in verified distributor and manufacturer sources; pcbelectronics lists the part as automotive temperature grade. AEC-Q100 status not explicitly listed - Microchip part temperature grade suffix 'V' indicates V-temp grade (-40 C to +105 C).