RTAX2000SL-CGS624V - 2M-Gate Rad-Tolerant FPGA | Microchip
Référence : RTAX2000SL-CGS624V ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8950 | $8 950,00 |
| 10 | $8500 | $85 000,00 |
| 100 | $7900 | $790 000,00 |
| 500 | $7200 | $3 600 000,00 |
| 1 000 | $6500 | $6 500 000,00 |
RTAX2000SL-CGS624V Présentation
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the total ionizing dose (TID) and single-event effects (SEE) found in orbital and deep-space environments. Within the space electronics hierarchy, RTAX-S/SL devices sit alongside radiation-hardened ASICs and rad-tolerant SRAM FPGAs, offering single-chip programmable logic without the NRE cost and long lead times of a custom ASIC.
Key features include nonvolatile antifuse technology for live-at-power-up operation with no configuration flash or external boot memory, total dose tolerance of 300 krad (functional) and 200 krad (parametric), and single-event upset rates below 1E-10 errors per bit-day. The SL variant extends the RTAX-S architecture with lower static power consumption, a critical advantage in power-constrained satellites.
Architecturally, the RTAX2000SL is derived from the commercial Axcelerator family, combining Sea-of-Modules logic clusters, segmentable clock structures, chip-wide highway routing, and dedicated carry logic. Embedded SRAM blocks include built-in FIFO control logic, simplifying high-throughput data path design.
Typical applications include satellite payload processing, spacecraft bus controllers, telemetry and telecommand (TT&C) logic, and instrument interfaces for low-Earth-orbit and deep-space missions.
Design consideration: antifuse devices are one-time programmable - the design must be fully verified before flight programming, so engineers typically prototype on reprogrammable ProASIC3E silicon via adapter platforms such as the Aldec RTAX prototyping solution.
This page synthesizes verified distributor listings, datasheet-level parameters, drop-in alternatives, and space-grade sourcing guidance not consolidated on the manufacturer datasheet alone.
Alternatives de remplacement direct pour RTAX2000SL-CGS624V — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec RTAX2000SL-CGS624V (même facteur de forme et même empreinte) — différant par Package, Technology, Configuration, Core Supply Voltage, Radiation Tolerance.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
RTAX2000S-CGS624V
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →RTAX2000SL-1CGS624V
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →RTAX2000SL-CGS624
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
RTAX250SL-1CG624V
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →RTAX250S-CG624V
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →RTAX2000SL-CGS624V Valeurs maximales et caractéristiques électriques
| Equivalent System Gates | 2000000 |
| Logic Cells (CLBs) | 21504 |
| Technology | CMOS antifuse (nonvolatile) |
| User I/Os (maximum) | 684 |
| Embedded Memory | 540 kbits with optional EDAC protection |
| Total Ionizing Dose (TID) | 300 krad (Si) functional / 200 krad (Si) parametric |
| Single-Event Upset Rate | Less than 1E-10 errors per bit-day |
| Configuration | One-time programmable antifuse, live at power-up |
| Embedded SRAM Features | Built-in FIFO control logic |
| Clock Architecture | Segmentable clock structures |
| Routing | Chip-wide highway routing, carry logic |
| Boîtier | CG624 ceramic package |
| Family | RTAX-S/SL Radiation-Tolerant FPGA |
| Application Domain | Space-flight systems |
Guide de configuration des broches du RTAX2000SL-CGS624V cg624 ceramic package
Configuration des broches du RTAX2000SL-CGS624V (boîtier cg624 ceramic package). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour RTAX2000SL-CGS624V.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
RTAX2000SL-CGS624V convient pour 6 applications: Satellite Payload Data Processing, Spacecraft Bus Controller Logic, Telemetry, Tracking and Command (TT&C), Scientific Instrument Interfaces, Radiation-Hardened ASIC Alternative / Prototyping, Deep-Space Mission Electronics.
Satellite Payload Data Processing
The RTAX2000SL-CGS624V fits payload processing chains that must move high-rate sensor or communications data through deterministic logic. With 2,000,000 gates and 21,504 CLBs, the device implements wide datapaths, channelizers, and framing engines, while 540 kbits of embedded SRAM with optional EDAC buffers data and protects against single-event upsets - essential at orbital altitudes where SEU rates dominate error budgets. Its antifuse fabric is live at power-up, so payload logic is operational immediately after spacecraft power application without external configuration memory, a reliability benefit over SRAM FPGAs. Placed downstream of ADCs or receivers, the SL low-static-power fabric keeps the payload power budget within typical spacecraft allocations, and the CG624 ceramic package provides the mechanical robustness required for launch vibration environments.
Recommandé
Spacecraft Bus Controller Logic
Spacecraft bus functions - command and data handling, mode control, and interface bridging between processors and peripherals - benefit from the RTAX2000SL-CGS624V's live-at-power-up behavior. Because the antifuse configuration is nonvolatile, bus controller logic executes the instant power arrives, enabling safe recovery and housekeeping before a software processor boots. The 684 available user I/Os bridge legacy bus standards (MIL-STD-1553, SpaceWire, UART, SPI) through external transceivers, and the chip-wide highway routing supports clean clock and control distribution. Radiation performance of 300 krad functional TID covers most LEO and GEO missions, while SEU immunity below 1E-10 errors per bit-day keeps control-plane error rates negligible without heavy external mitigation logic.
Recommandé
Telemetry, Tracking and Command (TT&C)
TT&C subsystems demand extreme reliability because they are the operator's only link to the spacecraft. The RTAX2000SL-CGS624V implements telecommand decoders, telemetry formatters, and watchdog/safing logic in 2M gates of hardened antifuse fabric with SEU rates below 1E-10 errors per bit-day, minimizing command-corruption risk. Embedded FIFOs with built-in control logic queue telemetry frames efficiently between the encoder and downlink modulator. The SL variant's reduced static power matters because TT&C logic runs continuously across eclipses when solar input is unavailable. The CG624 ceramic package and Microchip's space screening flows support the traceability and lot-control documentation that launch authorities and insurers typically require for command-chain electronics.
Recommandé
Scientific Instrument Interfaces
Scientific payloads - imagers, spectrometers, particle detectors - generate data with strict timing and noise requirements. The RTAX2000SL-CGS624V provides 21,504 CLBs of deterministic fabric for trigger logic, timing generators, and high-speed serial or parallel instrument front ends, while carry-logic chains accelerate detection algorithms. The 540 kbit embedded SRAM with optional EDAC serves as safe on-instrument buffering, and segmentable clock trees let designers isolate noisy timing domains from sensitive analog-adjacent logic. Because antifuse programming is permanent and single-chip, instrument electronics avoid configuration-memory single-event functional interrupts, improving observation uptime. The 300 krad functional TID rating covers typical Earth-observation and interplanetary science missions with standard margin.
Recommandé
Radiation-Hardened ASIC Alternative / Prototyping
Programs that would traditionally commit to a radiation-hardened ASIC can use the RTAX2000SL-CGS624V to avoid mask NRE, long ASIC foundry queues, and minimum-order commitments. Microchip explicitly positions RTAX-S/SL devices as an alternative to radiation-hardened ASICs, and at 2,000,000 gates the device absorbs mid-scale SoC glue logic, bus bridges, and datapath functions. For workflow, teams develop in Libero SoC and validate on flash-based ProASIC3E silicon using the Aldec RTAX prototyping adaptor, then program the one-time-programmable antifuses only after full verification - eliminating the ASIC tape-out gamble. Unit cost is higher than ASIC at high volume, but for the low quantities typical of space missions (tens of units), the FPGA route is decisively cheaper and faster.
Recommandé
Deep-Space Mission Electronics
For missions beyond Earth orbit, electronics face higher radiation doses and no repair opportunity. The RTAX2000SL-CGS624V's 300 krad (functional) total dose rating and sub-1E-10 errors/bit-day SEU rate provide the foundational hardness budget for deep-space avionics, while the SL low-static-power fabric reduces the constant drain that dominates probe power budgets during cruise phases. Its nonvolatile antifuse configuration cannot suffer configuration-memory upsets, a known failure mode of SRAM FPGAs in high-flux environments, eliminating scrubber dependencies for the configured fabric. Designers should still apply triple-module redundancy and EDAC on critical state in HDL, and verify SEE performance (SET on I/O, SEL susceptibility) against mission-specific particle spectra as recommended in Microchip's RTAX reliability application literature.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour RTAX2000SL-CGS624V — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | RTAX2000S-CGS624V | RTAX2000SL-1CGS624V | RTAX250SL-1CG624V |
|---|---|---|---|---|
| Package | CG624 ceramic | CG624 ceramic - same | CG624 ceramic - same | CG624 ceramic - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology |
| Total Ionizing Dose | 300 krad functional / 200 krad parametric | 300 krad functional / 200 krad parametric | 300 krad functional / 200 krad parametric | 300 krad functional / 200 krad parametric |
| SEU Immunity | <1E-10 errors per bit-day | <1E-10 errors per bit-day | <1E-10 errors per bit-day | <1E-10 errors per bit-day |
| Speed Grade | Standard (base grade) | Standard | -1 (faster) | -1 (faster, smaller die) |
| Static Power Profile | SL (low static power) | Standard (higher static) | SL (low static power) | SL (low static power, smaller die) |
Principaux différenciateurs
- 2M-gate density in the CG624 footprint (vs RTAX250SL-1CG624V)
- Low static power SL fabric (vs RTAX2000S-CGS624V)
- Live-at-power-up antifuse configuration (vs SRAM-based space FPGAs (cross-brand))
Notes de conception
The RTAX2000SL is one-time programmable: antifuses cannot be re-blown after flight programming. Adopt a strict workflow - design in Libero SoC, simulate with certified models, prototype on flash-based ProASIC3E silicon via the Aldec RTAX prototyping adaptor, and only then commit flight units. Budget for at least one engineering-lot cycle before flight lot programming, and never program flight parts from an unverified bitstream.
The SL variant was chosen specifically to cut static power versus the RTAX2000S, which dominates total power in space systems where duty cycles are low. Estimate: verify static current at your worst-case junction temperature from the datasheet tables, since static power rises with temperature; then add dynamic power from Libero SmartPower analysis. Do not rely on room-temperature typical values for eclipse-phase power budgets.
Use triple-module redundancy (TMR) on state registers and implement EDAC on embedded SRAM blocks even though the fabric SEU rate is below 1E-10 errors per bit-day - rare events still accumulate over multi-year missions. Follow Microchip's RTAX reliability application guidance for SET mitigation on I/O, and decouple all I/O banks with ceramic capacitors placed close to the CG624 ball field to control ground bounce during simultaneous switching.
Informations de conformité
Space-grade ceramic-packaged device; compliance declarations must be obtained via manufacturer certificate of conformance for the specific flight lot. Related Microchip FPGA parts are qualified per Mil-Prf-38535 (QML class Q/V) per the Microchip DLA Cross Reference Guide; lot-specific qualification data should be requested at quotation.
