RTAX2000S-CGS624V - 2M-Gate Rad-Tolerant FPGA CG624 | Microchip
MPN: RTAX2000S-CGS624V ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for RTAX2000S-CGS624V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX2000SL-1CGS624V
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →RTAX2000SL-1CGS624E
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$10750 / Unit
View Datasheet →RTAX2000SL-1CGS624EV
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View Datasheet →RTAX2000S-1CG624PROTO
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View Datasheet →RTAX2000S-CGS624E
✅ Drop-In📋 Reference alternative (not in catalog)
RTAX2000S-CGS624V Maximum Ratings & Electrical Characteristics
| Equivalent System Gates | 2000000 |
| Configurable Logic Blocks (CLBs) | 21504 |
| Logic Cells | 32256 |
| Technology | Digital CMOS, anti-fuse OTP |
| Core Supply Voltage (Nominal) | 1.5 V |
| Core Supply Voltage Range | 1.425 V to 1.575 V |
| Operating Temperature | -55C to +125C |
| Package | CG624 ceramic column grid array |
| Mounting Type | Surface Mount |
| Family | RTAX-S/SL Radiation-Tolerant FPGA |
| Configuration Type | One-Time Programmable (anti-fuse), live at power-up |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clocking | Segmentable clocks |
| Routing Features | Chip-wide highway routing, carry logic |
| Application Domain | Space-flight systems |
| Max Family Density | 4000000 equivalent system gates (family max) |
RTAX2000S-CGS624V cg624 ceramic column grid array Pin Configuration Guide
Complete pinout information for RTAX2000S-CGS624V (cg624 ceramic column grid array package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX2000S-CGS624V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX2000S-CGS624V is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Bus Control and Telemetry, Deep-Space Scientific Instruments, Launch Vehicle Avionics, Earth Observation Imaging Systems, Radiation-Tolerant Prototyping and Design Migration.
Satellite Payload Data Processing
The RTAX2000S-CGS624V fits payload data processing because its 2,000,000 equivalent gates and 21,504 CLBs provide the logic capacity needed for on-board compression, formatting, and channelization of sensor data, while embedded SRAM with built-in FIFO control implements buffering without external memory. Its anti-fuse architecture is live at power-up in a true single-chip form factor, so no boot flash is needed - reducing board area, parts count, and configuration-upset risk in orbit. The -55C to +125C operating range covers typical payload bay environments. Placed as the main payload FPGA between the sensor front end and the downlink formatter, it delivers deterministic, single-chip processing, with the trade-off that one-time programmability requires fully verified designs before flight-lot programming.
Recommended
Spacecraft Bus Control and Telemetry
For spacecraft bus controllers, the RTAX2000S-CGS624V integrates command decoding, telemetry formatting, and interface glue logic in one radiation-tolerant device, eliminating separate ASIC development cost and schedule. The chip-wide highway routing and segmentable clocks support multiple independent functional blocks - reaction-wheel interfaces, telemetry encoders, and watch-dog logic - at modest clock rates, while low-power consumption suits the always-on bus avionics load. Its 1.5V core (1.425V-1.575V) simplifies integration with modern low-voltage bus electronics. Designers should allocate the embedded SRAM/FIFO blocks for CCSDS frame buffering, and note that the -55C to +125C qualification envelope supports unheated equipment bays without supplemental thermal control.
Recommended
Deep-Space Scientific Instruments
Deep-space instruments benefit from the RTAX2000S-CGS624V's radiation tolerance and single-chip, live-at-power-up operation, which is critical where repair is impossible and configuration memory upsets are unacceptable. The 32,256-cell architecture with carry logic efficiently implements detector readout sequencing, DSP pre-processing filters, and instrument control state machines, while segmentable clocks allow low-power regions to run at reduced frequency. Embedded SRAM with FIFO control buffers high-rate detector data before downlink. Because the RTAX-S family offers densities to four million gates, instrument teams can scale within one design flow. The one-time-programmable anti-fuse technology removes configuration-storage devices that would otherwise be single-event-upset liabilities on multi-year cruises.
Recommended
Launch Vehicle Avionics
Launch vehicle flight computers and stage controllers use the RTAX2000S-CGS624V where vibration-tolerant single-chip logic, wide -55C to +125C operation, and deterministic power-up are required. The anti-fuse configuration survives the shock, vibration, and radiation environments of ascent without latch-up-prone configuration memories, and the 1.5V core keeps dynamic power within typical avionics power allocations. Carry-logic chains and highway routing implement flight-critical sequencers, safety interlocks, and redundant-voting logic. Typical deployments instantiate triple-modular-redundancy in fabric; the 21,504 CLB capacity accommodates TMR overhead that would exhaust smaller devices. Designers should complete timing closure with worst-case space-grade corners before programming flight units.
Recommended
Earth Observation Imaging Systems
Earth-observation cameras and SAR front ends use the RTAX2000S-CGS624V to perform image acquisition timing, defect correction, and data formatting at high throughput. The embedded SRAM with FIFO control logic lines up pixel streams between the focal-plane electronics and the mass-memory unit, while 2,000,000 gates accommodate channel-alignment and calibration datapaths without external glue logic. Low static power and single-chip integration reduce the thermal design burden on the payload's radiators. The CG624 column grid array provides the high pin count and mechanical robustness needed for focal-plane I/O. Because imaging pipelines are iterative, the recommended flow prototypes on Axcelerator commercial silicon or the Aldec CG624 adaptor before committing anti-fuse flight units.
Recommended
Radiation-Tolerant Prototyping and Design Migration
The RTAX2000S-CGS624V participates in a cost-effective design migration flow: developers target the commercial Axcelerator equivalent first, using Actel Extender circuit boards that map the commercial package footprint to the RTAX-S package footprint, then transfer the verified design to RTAX-S silicon. Aldec's ACT-H3Ki-CG624 adaptor, carrying a ProASIC3E flash FPGA, assembles directly in the RTAX chip's place on the target board, providing reprogrammable prototyping that OTP anti-fuse parts cannot. This methodology preserves the CG624 land pattern throughout, eliminating PCB respins, and satisfies the full simulation/timing sign-off that one-time-programmable flight devices demand. It dramatically reduces the cost risk of space-qualified FPGA development programs.
Recommended
Recommended Products Summary
Engineering reference data for RTAX2000S-CGS624V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX2000SL-1CGS624V | RTAX2000SL-1CGS624E | RTAX2000SL-1CGS624EV | RTAX2000S-1CG624PROTO | RTAX2000S-CGS624E |
|---|---|---|---|---|---|---|
| Package | CG624 ceramic column grid array | CG624 - same | CG624 - same | CG624 - same | CG624 - same | CG624 - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 2,000,000 | 2,000,000 | 2,000,000 | 2,000,000 | 2,000,000 | 2,000,000 |
| CLBs / Cells | 21,504 / 32,256 | 21,504 / 32,256 | 21,504 / 32,256 | 21,504 / 32,256 | 21,504 / 32,256 | 21,504 / 32,256 |
| Speed Grade | Standard | -1 (faster) | -1 (faster) | -1 (faster) | -1 (faster) | Standard |
| Power Variant | Standard (S) | Low-power (SL) | Low-power (SL) | Low-power (SL) | Standard (S) | Standard (S) |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | [DATA_NEEDED] | -55C to +125C |
| Configuration Technology | Anti-fuse OTP, live at power-up | Anti-fuse OTP | Anti-fuse OTP | Anti-fuse OTP | Anti-fuse OTP | Anti-fuse OTP |
| Core Supply Voltage | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) | 1.5 V (1.425-1.575 V) |
Key Differentiators
- Single-chip live-at-power-up operation (vs SRAM-FPGA space alternatives)
- Low-power SL variant available on the same footprint (vs RTAX2000SL-1CGS624V)
- Faster -1 speed grade options (vs RTAX2000S-CGS624E)
- Commercial-equivalent prototyping flow (vs RTAX2000S-1CG624PROTO)
Design Notes
RTAX-S devices are anti-fuse one-time programmable: a mis-programmed flight unit is unrecoverable. Complete the full design sign-off recommended in the Microchip design flow - simulation, static timing closure at worst-case space corners, and hardware prototyping on the commercial Axcelerator equivalent or the Aldec ACT-H3Ki-CG624 flash-based adaptor (which assembles directly in the RTAX chip's place on the CG624 footprint) - before programming any flight units. Budget for prototype iterations in the program schedule.
The RTAX2000S-CGS624V requires a nominal 1.5V core supply regulated to 1.425V-1.575V per Microchip USA's series specification. Provide a low-noise point-of-load regulator with bulk and high-frequency decoupling at the CG624 power balls, and consult the RTAX-S/SL datasheet (DS2169) for I/O bank supply rails and sequencing. For power-limited missions, evaluate the RTAX2000SL-1CGS624V low-power variant, which shares the same footprint so no PCB change is needed.
The CG624 ceramic column grid array has a dense 624-column footprint; follow the Microchip RTAX-S package land-pattern and via-fanout recommendations exactly, since ceramic column BGA rework in flight hardware is effectively impossible. Route power on dedicated planes, keep configuration and JTAG nets short and protected, and verify thermal relief for the -55C to +125C operating envelope during board-level thermal analysis before design freeze.
Compliance Information
Compliance data for space-grade ceramic-package RTAX-S devices was not present in the provided web data; ceramic column grid array packages for space flight may be exempt from certain RoHS requirements. Verify with Microchip product compliance documentation.
