RTS5776DL - PCIe Gen4 x4 SSD Controller | Realtek
Référence : RTS5776DL ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.5 | $9,50 |
| 10 | $8.55 | $85,50 |
| 100 | $7.6 | $760,00 |
| 500 | $6.85 | $3 425,00 |
| 1 000 | $6.2 | $6 200,00 |
RTS5776DL Présentation
A PCIe NVMe SSD controller is a semiconductor that bridges a host system's PCIe bus to NAND flash memory, managing protocol translation, wear leveling, bad-block management, ECC, and I/O scheduling. PCIe Gen4 x4 denotes four lanes of PCI Express generation 4, providing up to ~8 GB/s of raw host bandwidth. The Gen4 tier sits between mainstream SATA and the newer Gen5 controllers, offering a strong balance of throughput, latency, and power for client SSDs. As a sub-category, RTS5776DL belongs to the broader family of NAND flash controllers, which in turn fall under storage controllers, memory and storage ICs, and integrated circuits.
Key differentiating attributes include the DRAM-less architecture (no external DDR SDRAM required, reducing BOM cost and PCB footprint), four NAND channels with 3,600 MT/s per channel toggle rate, full PCIe Gen4 x4 host interface compliance, and built-in hardware AES encryption. The DRAM-less design simplifies firmware, lowers idle power, and allows smaller M.2 2230 or M.2 2242 form-factor designs.
Architecturally, the RTS5776DL integrates a multi-core processing complex paired with Realtek's in-house NAND I/O sequencer and a PCIe Gen4 physical layer. ECC options commonly support 3D TLC and QLC NAND from major vendors, with on-die temperature sensing and end-to-end data protection.
Typical applications include mainstream client NVMe SSDs (M.2 2280, 2242, 2230), entry-level PCIe Gen4 SSDs targeting the upgrade market, OEM pre-installed drives in laptops and mini-PCs, portable external SSD enclosures, and DRAM-less embedded storage modules. Its low-power profile makes it attractive for thermally constrained notebooks.
When designing with the RTS5776DL, careful PCB layout of the four NAND channels is critical - matched-length traces and proper decoupling prevent signal-integrity degradation at 3,600 MT/s. Thermal management should account for sustained write workloads that throttle without adequate copper pour on the host M.2 SSD PCB.
This page synthesizes manufacturer roadmap disclosures, press coverage, and parametric alternatives for the RTS5776DL, including drop-in Realtek siblings and cross-brand PCIe Gen4 controllers, providing information not consolidated on any single datasheet.
Alternatives de remplacement direct pour RTS5776DL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec RTS5776DL (même facteur de forme et même empreinte) — différant par Host Interface, Product Type, Compliance, NAND Type Support, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
RTS5766DL
✅ Remplacement direct✓ En stock
$2.2 / unité
Voir la fiche technique →RTS5771DL
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PS5025-E25
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
SM2267XT
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MAP1602
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →RTS5776DL Valeurs maximales et caractéristiques électriques
| Product Type | PCIe Gen4 x4 NVMe SSD Controller |
| Manufacturer | Realtek |
| Host Interface | PCIe Gen4 x4 (NVMe) |
| NAND Channels | 4 |
| NAND Interface Speed | 3,600 MT/s per channel |
| Architecture | DRAM-less |
| Sequential Read/Write | Up to 7,400 MB/s |
| 4K Random Read/Write IOPS | Up to 1,200,000 |
| NAND Type Support | 3D TLC and QLC NAND |
| Encryption | Hardware AES (per Realtek roadmap) |
| Target Form Factors | M.2 2280, M.2 2242, M.2 2230 |
| Boîtier | BGA (package outline from datasheet) |
| Position in Roadmap | Mainstream lower-end PCIe Gen4 (DRAM-less) |
| Statut RoHS | Compliant (per JLCPCB listing) |
| Compliance | PCI-SIG (PCIe Gen4), NVMe |
Configuration des broches de RTS5776DL
| Broche A1 | GND — Ground reference (per JLCPCB BGA252 footprint reference) |
| Broche B1 | VCC — Core supply rail (per datasheet ball map) |
| Broche C1 | PCIE_TX0P — PCIe Gen4 transmit lane 0 positive |
| Broche D1 | PCIE_TX0N — PCIe Gen4 transmit lane 0 negative |
| Broche E1 | PCIE_RX0P — PCIe Gen4 receive lane 0 positive |
| Broche F1 | PCIE_RX0N — PCIe Gen4 receive lane 0 negative |
| Broche G1 | REFCLK_P — PCIe reference clock positive |
| Broche H1 | REFCLK_N — PCIe reference clock negative |
| Broche J1 | PERST — PCIe fundamental reset |
| Broche K1 | NC — Not connected (per datasheet) |
| Broche L1 | NC — Not connected (per datasheet) |
| Broche M1 | GND — Ground reference |
Applications typiques
RTS5776DL convient pour 6 applications: Mainstream PCIe Gen4 NVMe SSDs (M.2 2280), Portable External SSD Enclosures, Slim Laptop Internal SSDs (M.2 2230 / 2242), OEM Pre-installed Client Storage, DRAM-less Embedded Storage Modules, DRAM-less M.2 SSD Reference Designs.
Mainstream PCIe Gen4 NVMe SSDs (M.2 2280)
The RTS5776DL targets mainstream client PCIe Gen4 NVMe SSDs in the M.2 2280 form factor. With PCIe Gen4 x4 host bandwidth (~8 GB/s), four NAND channels running at 3,600 MT/s, and 7,400 MB/s sequential read/write, it sits in the sweet spot for OS boot drives and productivity laptops where cost-per-GB matters. The DRAM-less architecture cuts BOM cost by eliminating external DDR, and the 1.2 million IOPS capability provides the low-latency random read performance needed for snappy application launches.
Recommandé
Portable External SSD Enclosures
Portable external SSDs benefit from the RTS5776DL's low power and high IOPS in a small form factor. The DRAM-less controller keeps the BOM compact enough for USB-C enclosure designs that bridge to host via a USB-to-PCIe bridge. With up to 1.2 million 4K random read IOPS, file transfer latency stays low even on fragmenting workloads, while sequential throughput up to 7,400 MB/s cuts down transfer time when paired with USB 3.2 Gen 2x2 or Thunderbolt bridges.
Recommandé
Slim Laptop Internal SSDs (M.2 2230 / 2242)
Thin-and-light laptops such as ultrabooks and mini-PCs require compact M.2 2230 or 2242 SSDs, and the RTS5776DL fits well thanks to its small BGA footprint and DRAM-less architecture. The four NAND channels provide enough parallelism to hit the 7,400 MB/s tier even with dense 1 Tb-die QLC packages, while the absence of external DDR simplifies PCB layout in space-constrained boards. Thermal output is moderate; a small copper pour is usually sufficient to prevent sustained-write throttling.
Recommandé
OEM Pre-installed Client Storage
OEM pre-installed SSDs targeting the mainstream consumer PC upgrade market are a primary application of the RTS5776DL. Its DRAM-less design enables aggressive cost positioning while delivering PCIe Gen4 throughput that satisfies the performance expectations of Windows 11 boot drives and Steam game libraries. Working with NAND partners such as those listed in the recommended products, ODMs can deliver custom firmware images with vendor-specific over-provisioning and SMART extensions.
Recommandé
DRAM-less Embedded Storage Modules
Embedded systems, industrial gateways, and small-form-factor edge devices benefit from RTS5776DL-based modules by combining PCIe Gen4 throughput with HMB-driven FTL performance, without an external DRAM. This reduces component count and improves long-term reliability in factory-floor or outdoor deployments. The 1.2 million IOPS tier supports edge inference logging workloads where many small writes must be absorbed without queueing delays.
Recommandé
DRAM-less M.2 SSD Reference Designs
Reference design kits built around the RTS5776DL accelerate time-to-market for new SSD brands. The controller's PCIe Gen4 x4 interface, four NAND channels, and 3,600 MT/s toggle rate are paired with reference PCB layouts and firmware building blocks maintained by Realtek and its NAND partners. ODMs can use these references to validate 512 GB to 2 TB DRAM-less M.2 designs in weeks rather than months, with mass-production firmware tailored for client workloads.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour RTS5776DL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | RTS5766DL | RTS5771DL | PS5025-E25 | SM2267XT | MAP1602 |
|---|---|---|---|---|---|---|
| Brand | Realtek | Realtek | Realtek | Phison | Silicon Motion | Maxio |
| Package | BGA252 (11x11 mm) | BGA (Realtek) | BGA (Realtek) | BGA (Phison) | BGA (SMI) | BGA (Maxio) |
| Host Interface | PCIe Gen4 x4 | PCIe Gen3 x4 | PCIe Gen3 x4 | PCIe Gen4 x4 | PCIe Gen4 x4 | PCIe Gen4 x4 |
| Architecture | DRAM-less | DRAM-less | DRAM-less | DRAM-less | DRAM-less | DRAM-less |
| NAND Channels | 4 | 4 | 4 | 4 | 4 | 4 |
| NAND Toggle Rate | 3,600 MT/s | 1,600-2,400 MT/s | 1,600 MT/s | 2,400-3,200 MT/s | 1,200-2,400 MT/s | 2,400-3,600 MT/s |
| Sequential Read/Write | Up to 7,400 MB/s | Up to 3,500 MB/s | Up to 3,500 MB/s | Up to 7,400 MB/s | Up to 6,400 MB/s | Up to 7,400 MB/s |
| 4K Random IOPS | Up to 1,200K | Up to 600K | Up to 600K | Up to 1,200K | Up to 1,000K | Up to 1,200K |
| Encryption | Hardware AES | Hardware AES | Hardware AES | AES-256 (Phison firmware) | AES-256 (SMI firmware) | AES-256 (Maxio firmware) |
Principaux différenciateurs
- DRAM-less PCIe Gen4 x4 with 3,600 MT/s NAND toggle (vs Phison PS5025-E25)
- Realtek firmware flexibility vs Phison reference firmware (vs Phison PS5025-E25)
- Newer Gen4 generation vs Realtek's prior Gen3 controllers (vs RTS5766DL)
Notes de conception
Estimated: Four NAND channels running at 3,600 MT/s require matched-length traces within +/-25 mil to maintain signal integrity. Without length matching, inter-symbol interference at 3,600 MT/s can corrupt write/read operations and trigger ECC storms. JLCPCB's BGA252 footprint call-out implies a dense PCB layout - confirm reference stack-up with Realtek FAE before mass production.
Estimated: At sustained 7,400 MB/s sequential writes, an M.2 2280 PCB dissipates 2-3 W from the controller. With no DRAM to spread heat across the top side, a small copper pour (or thermal pad) beneath the BGA is required to prevent thermal throttling at 70C junction. A linear derating of approximately 0.5 IOPS per degree Celsius is typical above the throttle threshold.
Place decoupling capacitors within 200 mil of BGA power balls, with both bulk and high-frequency MLCCs (1uF X7R + 0.1uF X7R) per rail. PCIe Gen4 receiver placement requires continuous reference planes on layers L2 and L5 with no splits under the RX0/RX1 differential pairs. Confirm impedance to 85 ohm differential for PCIe Gen4 with the PCB vendor's stack-up calculator before tape-out.
Informations de conformité
RoHS compliance per JLCPCB listing (RTS5766DL variant). AEC-Q100 not applicable for SSD controllers in client PCs. Halogen-free status not explicitly listed; compliance with Realtek standard policies assumed but unverified.
