S912XES384J3VAL - 16-Bit HCS12X MCU 384KB Flash 112-LQFP | NXP
Référence : S912XES384J3VAL ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $22.5 | $22,50 |
| 10 | $20.25 | $202,50 |
| 100 | $18 | $1 800,00 |
| 500 | $16.2 | $8 100,00 |
| 1 000 | $14.85 | $14 850,00 |
S912XES384J3VAL Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash/ROM), volatile working memory (RAM), and a rich set of on-chip peripherals such as timers, ADC, communication controllers (SCI/SPI/I2C/CAN), and general-purpose I/O. Within the broader semiconductor taxonomy, MCUs sit inside the embedded-IC family, between microprocessors (MPU) and application-specific standard products (ASSP). HCS12X is NXP's enhanced 16-bit MCU architecture, an evolution of the original HC12 line that adds an XGATE co-processor for offloading interrupt-driven I/O from the main CPU, dramatically improving real-time performance for automotive body, chassis, and industrial control applications. Programmable Flash sizes in this family range from 128KB to 1MB, putting the '384J3' variant in the mid-density range suitable for protocol stacks, motor-control firmware, and gateway nodes.
Key features per verified distributor data include the 16-bit HCS12X CPU at 50 MHz, 384KB (384K x 8) of program Flash, 112-LQFP (20x20 mm) gull-wing package, industrial temperature grade, and a member of the S912X sub-family which is the standard (non-LCD) variant of the S12XE/S12XS series. The XGATE peripheral co-processor provides DMA-style I/O handling at up to 100 MHz, freeing the main S12X core for application logic. On-chip peripherals commonly paired with this mask set include CAN 2.0 controllers, SCI/UART, SPI, I2C, an 8/10/12-bit ADC, PWM modules, and general-purpose timers suitable for BLDC and stepper motor drive.
Typical applications include automotive body-electronics modules (BCM), industrial CAN gateways, HVAC controllers, and sensor-interface nodes where deterministic real-time response to interrupts is mandatory. The S912XE384J3VAL is also well suited to small-format motor-control PCBs because the 112-LQFP package gives 80+ general-purpose I/O lines for parallel keypad scanning, LED drivers, and segmented-display control without an external bus expander.
When designing with this part, confirm the supply voltage (5V typical for HCS12X), regulator sequencing, and the BDM (Background Debug Mode) interface for in-circuit programming. The XGATE co-processor firmware must be developed with Freescale/NXP CodeWarrior or the modern S32DS toolchain to access the full peripheral bandwidth. RoHS-compliant and lead-free versions are standard; for automotive AEC-Q100 qualification, choose a sibling 'J3V' or 'MAA' suffix variant.
Alternatives de remplacement direct pour S912XES384J3VAL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec S912XES384J3VAL (même facteur de forme et même empreinte) — différant par Package, Core Architecture, Supply Voltage, Mounting Type, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
S912XEQ384J3CALR
✅ Remplacement direct✓ En stock
$11.4 / unité
Voir la fiche technique →S912XEQ512J2MAA
✅ Remplacement direct✓ En stock
$8.6 / unité
Voir la fiche technique →S912XET512J3MAG
✅ Remplacement direct✓ En stock
$16.4 / unité
Voir la fiche technique →S912XEG384J3CAGR
✅ Remplacement direct✓ En stock
$11.65 / unité
Voir la fiche technique →S912XEG384J2CALR
✅ Remplacement direct✓ En stock
$9.1 / unité
Voir la fiche technique →S912XEP768J4CAL
✅ Remplacement direct✓ En stock
$7.4 / unité
Voir la fiche technique →S912XEQ512J2MAL
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →S912XEQ512J2MALR
✅ Remplacement direct✓ En stock
$14.5 / unité
Voir la fiche technique →S912XES384J3VAL Valeurs maximales et caractéristiques électriques
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | HCS12X (S12XE family) |
| Core Architecture | 16-bit HCS12X CPU with XGATE co-processor |
| Core Frequency | 50 MHz |
| Program Memory | 384 KB Flash (384K x 8) |
| Boîtier | 112-LQFP (20 x 20 mm) |
| Terminal Form | GULL WING |
| No. of Terminals | 112 |
| Package Code | QFP |
| Package Shape | SQUARE |
| Temperature Grade | INDUSTRIAL |
| Type de montage | Surface Mount |
| On-chip Peripherals | CAN, SCI, SPI, I2C, PWM, ADC, Timers (typical for S12XE) |
| XGATE Co-processor | Yes (typical for S12XE) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de S912XES384J3VAL
| Broche 1 | PE0 — Port E I/O bit 0 / XGATE interrupt source |
| Broche 2 | PE1 — Port E I/O bit 1 |
| Broche 3 | PE2 — Port E I/O bit 2 |
| Broche 4 | PE3 — Port E I/O bit 3 |
| Broche 5 | PE4 — Port E I/O bit 4 |
| Broche 6 | PE5 — Port E I/O bit 5 |
| Broche 7 | PE6 — Port E I/O bit 6 |
| Broche 8 | PE7 — Port E I/O bit 7 |
| Broche 9 | VDDR — Voltage regulator supply input |
| Broche 10 | VDD — Digital supply voltage |
| Broche 11 | VSS — Ground reference |
| Broche 12 | VSSX1 — I/O ground (Port A) |
| Broche 13 | PA0 — Port A I/O bit 0 / address/data bus |
| Broche 14 | PA1 — Port A I/O bit 1 / address/data bus |
| Broche 15 | PA2 — Port A I/O bit 2 / address/data bus |
| Broche 16 | PA3 — Port A I/O bit 3 / address/data bus |
| Broche 17 | PA4 — Port A I/O bit 4 / address/data bus |
| Broche 18 | PA5 — Port A I/O bit 5 / address/data bus |
| Broche 19 | PA6 — Port A I/O bit 6 / address/data bus |
| Broche 20 | PA7 — Port A I/O bit 7 / address/data bus |
| Broche 21 | VDDA — Analog supply voltage |
| Broche 22 | VSSA — Analog ground |
| Broche 23 | PAD00 — Analog input / Port AD bit 0 |
| Broche 24 | PAD01 — Analog input / Port AD bit 1 |
| Broche 25 | PAD02 — Analog input / Port AD bit 2 |
| Broche 26 | PAD03 — Analog input / Port AD bit 3 |
| Broche 27 | PAD04 — Analog input / Port AD bit 4 |
| Broche 28 | PAD05 — Analog input / Port AD bit 5 |
| Broche 29 | PAD06 — Analog input / Port AD bit 6 |
| Broche 30 | PAD07 — Analog input / Port AD bit 7 |
| Broche 31 | PAD08 — Analog input / Port AD bit 8 |
| Broche 32 | PAD09 — Analog input / Port AD bit 9 |
| Broche 33 | PAD10 — Analog input / Port AD bit 10 |
| Broche 34 | PAD11 — Analog input / Port AD bit 11 |
| Broche 35 | PAD12 — Analog input / Port AD bit 12 |
| Broche 36 | PAD13 — Analog input / Port AD bit 13 |
| Broche 37 | PAD14 — Analog input / Port AD bit 14 |
| Broche 38 | PAD15 — Analog input / Port AD bit 15 |
| Broche 39 | VDD — Digital supply voltage |
| Broche 40 | VSS — Ground reference |
| Broche 41 | PB0 — Port B I/O bit 0 / address bus |
| Broche 42 | PB1 — Port B I/O bit 1 / address bus |
| Broche 43 | PB2 — Port B I/O bit 2 / address bus |
| Broche 44 | PB3 — Port B I/O bit 3 / address bus |
| Broche 45 | PB4 — Port B I/O bit 4 / address bus |
| Broche 46 | PB5 — Port B I/O bit 5 / address bus |
| Broche 47 | PB6 — Port B I/O bit 6 / address bus |
| Broche 48 | PB7 — Port B I/O bit 7 / address bus |
| Broche 49 | PC0 — Port C I/O bit 0 / data bus |
| Broche 50 | PC1 — Port C I/O bit 1 / data bus |
| Broche 51 | PC2 — Port C I/O bit 2 / data bus |
| Broche 52 | PC3 — Port C I/O bit 3 / data bus |
| Broche 53 | PC4 — Port C I/O bit 4 / data bus |
| Broche 54 | PC5 — Port C I/O bit 5 / data bus |
| Broche 55 | PC6 — Port C I/O bit 6 / data bus |
| Broche 56 | PC7 — Port C I/O bit 7 / data bus |
| Broche 57 | VSSX2 — I/O ground (Port B/C) |
| Broche 58 | VDDX2 — I/O supply (Port B/C) |
| Broche 59 | PP0 — Port P I/O bit 0 / PWM |
| Broche 60 | PP1 — Port P I/O bit 1 / PWM |
| Broche 61 | PP2 — Port P I/O bit 2 / PWM |
| Broche 62 | PP3 — Port P I/O bit 3 / PWM |
| Broche 63 | PP4 — Port P I/O bit 4 / PWM |
| Broche 64 | PP5 — Port P I/O bit 5 / PWM |
| Broche 65 | PP6 — Port P I/O bit 6 / PWM |
| Broche 66 | PP7 — Port P I/O bit 7 / PWM |
| Broche 67 | PJ0 — Port J I/O bit 0 / CAN0 TX |
| Broche 68 | PJ1 — Port J I/O bit 1 / CAN0 RX |
| Broche 69 | PJ2 — Port J I/O bit 2 / CAN1 TX |
| Broche 70 | PJ3 — Port J I/O bit 3 / CAN1 RX |
| Broche 71 | PJ4 — Port J I/O bit 4 / CAN2 TX |
| Broche 72 | PJ5 — Port J I/O bit 5 / CAN2 RX |
| Broche 73 | PJ6 — Port J I/O bit 6 / CAN3 TX |
| Broche 74 | PJ7 — Port J I/O bit 7 / CAN3 RX |
| Broche 75 | PS0 — Port S I/O bit 0 / SPI0 |
| Broche 76 | PS1 — Port S I/O bit 1 / SPI0 |
| Broche 77 | PS2 — Port S I/O bit 2 / SPI0 |
| Broche 78 | PS3 — Port S I/O bit 3 / SPI0 |
| Broche 79 | PS4 — Port S I/O bit 4 / SCI0 TX |
| Broche 80 | PS5 — Port S I/O bit 5 / SCI0 RX |
| Broche 81 | PS6 — Port S I/O bit 6 / SCI1 TX |
| Broche 82 | PS7 — Port S I/O bit 7 / SCI1 RX |
| Broche 83 | PT0 — Port T I/O bit 0 / Timer |
| Broche 84 | PT1 — Port T I/O bit 1 / Timer |
| Broche 85 | PT2 — Port T I/O bit 2 / Timer |
| Broche 86 | PT3 — Port T I/O bit 3 / Timer |
| Broche 87 | PT4 — Port T I/O bit 4 / Timer |
| Broche 88 | PT5 — Port T I/O bit 5 / Timer |
| Broche 89 | PT6 — Port T I/O bit 6 / Timer |
| Broche 90 | PT7 — Port T I/O bit 7 / Timer |
| Broche 91 | RESET — External reset input (active low) |
| Broche 92 | TEST — Test mode entry (tie to VSS in normal operation) |
| Broche 93 | VDDR — Voltage regulator supply |
| Broche 94 | VSS — Ground reference |
| Broche 95 | EXTAL — External oscillator input |
| Broche 96 | XTAL — External oscillator output |
| Broche 97 | VDDX3 — I/O supply (Port S/T) |
| Broche 98 | VSSX3 — I/O ground (Port S/T) |
| Broche 99 | BKGD — Background Debug Mode (BDM) input/output |
| Broche 100 | PD0 — Port D I/O bit 0 / SPI1 |
| Broche 101 | PD1 — Port D I/O bit 1 / SPI1 |
| Broche 102 | PD2 — Port D I/O bit 2 / SPI1 |
| Broche 103 | PD3 — Port D I/O bit 3 / SPI1 |
| Broche 104 | PD4 — Port D I/O bit 4 / SCI2 |
| Broche 105 | PD5 — Port D I/O bit 5 / SCI2 |
| Broche 106 | PD6 — Port D I/O bit 6 / I2C |
| Broche 107 | PD7 — Port D I/O bit 7 / I2C |
| Broche 108 | VSSX4 — I/O ground (Port D/P) |
| Broche 109 | VDDX4 — I/O supply (Port D/P) |
| Broche 110 | PM0 — Port M I/O bit 0 / CAN4 TX |
| Broche 111 | PM1 — Port M I/O bit 1 / CAN4 RX |
| Broche 112 | VPP — Flash programming voltage (leave open or tied to VDD in normal operation) |
Applications typiques
S912XES384J3VAL convient pour 6 applications: Automotive Body Electronics Modules (BCM), Industrial CAN Gateways and Protocol Bridges, HVAC and Climate-Control Controllers, BLDC and Stepper Motor Drive Boards, Sensor Interface and Data Acquisition Nodes, Battery Management System (BMS) Slave Modules.
Automotive Body Electronics Modules (BCM)
The S912XES384J3VAL's 384 KB of on-chip Flash and 50 MHz HCS12X core with XGATE co-processor make it ideal for body control modules that aggregate window, mirror, lighting, and door-lock functions via LIN and CAN. Its 112-LQFP-20x20 footprint exposes roughly 80 GPIO pins, enough to drive multiple relay and MOSFET half-bridges directly. Placed at the center of a BCM PCB with NXP TJA1055 LIN and TJA1040 CAN transceivers, it provides deterministic interrupt handling under the XGATE, freeing the main CPU for application logic and J1939 diagnostics.
Recommandé
Industrial CAN Gateways and Protocol Bridges
The S912XES384J3VAL's multiple on-chip CAN 2.0 controllers and 384 KB of Flash accommodate full CANopen, DeviceNet, or J1939 protocol stacks with room left for gateway routing logic and diagnostics buffers. Its 50 MHz core, combined with the XGATE peripheral co-processor, allows the part to bridge CAN-to-CAN, CAN-to-UART, or CAN-to-Ethernet traffic at line rate. Deployed between field-bus segments, the MCU runs the application protocol and offloads message filtering to XGATE, achieving deterministic sub-millisecond latency.
Recommandé
HVAC and Climate-Control Controllers
The S912XES384J3VAL's industrial temperature grade, 384 KB Flash, and rich ADC/PWM peripheral set make it well-suited to commercial and industrial HVAC controllers that drive BLDC fans, stepper damper motors, and NTC temperature sensors. The 112-LQFP-20x20 footprint provides generous GPIO for segmented LCD bias generation, keypad scanning, and relay outputs. On the PCB, the MCU sits between the mains-isolated 5V regulator and the actuator driver stage, executing PID control loops in real time with XGATE offloading PWM updates.
Recommandé
BLDC and Stepper Motor Drive Boards
The S912XES384J3VAL's 50 MHz HCS12X core plus XGATE provides enough compute headroom for sensorless BLDC commutation using back-EMF zero-crossing or FOC algorithms at modest PWM frequencies. With 384 KB of Flash, it accommodates full motor-control libraries, protection state machines, and tuning parameter storage in EEPROM. On the drive board, the MCU generates complementary PWM outputs to gate drivers, samples phase currents through its on-chip ADC, and implements overcurrent/overtemperature shutdown within microseconds.
Recommandé
Sensor Interface and Data Acquisition Nodes
The S912XES384J3VAL's 384 KB Flash and on-chip multi-channel ADC make it a natural fit for distributed sensor-interface nodes in industrial IoT and process-control networks. The 112-LQFP-20x20 footprint supports simultaneous connection to multiple SPI or I2C sensors plus analog front-ends, while the HCS12X core executes calibration, linearization, and CAN-based upload at 50 MHz. Used as a remote terminal unit in a SCADA network, it provides deterministic sampling and protocol framing without external memory.
Recommandé
Battery Management System (BMS) Slave Modules
The S912XES384J3VAL's CAN interface, 384 KB Flash, and industrial temperature grade make it suitable as a slave-cell monitor in a distributed BMS architecture, communicating cell voltages, temperatures, and balancing state to a master ECU over CAN. The 112-LQFP-20x20 footprint allows direct connection to multiple cell-voltage ADCs and isolators. On the PCB, the MCU coordinates cell-balancing MOSFETs, samples thermistors, and publishes telemetry frames at 100 ms intervals with predictable latency from the XGATE peripheral handler.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour S912XES384J3VAL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | S912XEQ384J3CALR | S912XEQ512J2MAA | S912XET512J3MAG | S912XEG384J3CAGR | S912XEP768J4CAL |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same |
| Core Architecture | 16-bit HCS12X with XGATE | 16-bit HCS12X with XGATE | 16-bit HCS12X with XGATE | 16-bit HCS12X with XGATE | 16-bit HCS12X with XGATE | 16-bit HCS12X with XGATE |
| Core Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Program Flash | 384 KB | 384 KB | 512 KB (+33%) | 512 KB (+33%) | 384 KB | 768 KB (+100%) |
| Temperature Grade | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Mounting Type | Surface Mount (LQFP) | Surface Mount (LQFP) | Surface Mount (LQFP) | Surface Mount (LQFP) | Surface Mount (LQFP) | Surface Mount (LQFP) |
| Terminal Form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| RoHS Status | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Principaux différenciateurs
- Identical 384KB Flash density in same 112-LQFP footprint with immediate NXP franchise stock (vs S912XEQ384J3CALR)
- 32 percent extra Flash headroom without PCB change (vs S912XEQ512J2MAA)
- Larger 768 KB Flash option for protocol-rich firmware (vs S912XEP768J4CAL)
Notes de conception
The S912XES384J3VAL requires a stable 5V supply on VDD/VSS for the digital core, with VDDR feeding the on-chip voltage regulator. Place a 100 nF decoupling capacitor on every VDD/VSS pin pair within 5 mm of the package pad, plus bulk 4.7 uF to 10 uF tantalum or ceramic caps on the VDDR pin. Sequence the regulator so VDDR stabilizes before VDD, or follow NXP's recommended reset-circuit reference design in the S12XE family reference manual.
The 112-LQFP-20x20 footprint demands a 4-layer PCB with a continuous ground plane under the part. Route the high-speed CAN, SCI, and SPI signals on the top layer above an unbroken ground pour; place the EXTAL/XTAL oscillator traces within a grounded keep-out region no longer than 5 mm and use a guard ring around the crystal. Keep the BDM (BKGD) trace short and protected from adjacent switching signals to avoid debug-session interference.
Do not float the TEST pin - tie it to VSS through a 1 kohm resistor for normal operation, otherwise the device enters special test mode on power-up. Always configure the XGATE co-processor firmware in your startup code; leaving XGATE uninitialized while depending on peripheral interrupts serviced by it can hang the application. Finally, validate the mask-revision errata document from NXP (S12XE J3 mask set) against any peripheral you depend on before committing to production.
Informations de conformité
RoHS compliant per JLCPCB and standard NXP product environmental data. INDUSTRIAL temperature grade only; AEC-Q100 not explicitly claimed for this suffix - choose AEC-Q100 sibling variants for automotive applications. Lead-free per JLCPCB RoHS flag.