S9S12DG25F0MPVE - 16-bit MCU, 256KB Flash, 25MHz, AEC-Q100 | NXP
Référence : S9S12DG25F0MPVE ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $30.42 | $30,42 |
| 10 | $28.5 | $285,00 |
| 100 | $24.75 | $2 475,00 |
| 500 | $21.4 | $10 700,00 |
| 1 000 | $19.1 | $19 100,00 |
S9S12DG25F0MPVE Présentation
An automotive MCU is a microcontroller engineered to operate reliably under the harsh environmental conditions found in vehicles, including extended temperature ranges, voltage transients, and electromagnetic interference. The S9S12DG25F0MPVE sits within the broader product hierarchy: microcontroller (MCU) -> embedded processor -> automotive-qualified IC -> semiconductor device. Its AEC-Q100 qualification and -40°C to +125°C operating range place it firmly in the automotive-tolerance tier required for under-hood, body, and chassis ECUs.
Key features include a CISC-based HCS12 core with 25MHz bus speed, BDM (Background Debug Mode) for non-intrusive in-circuit debug, PWM outputs for motor control, and a Watchdog Timer for functional-safety integration. The generous 256KB Flash and 4KB EEPROM enable substantial on-board calibration tables, fault logs, and bootloaders, while 91 GPIO pins provide ample headroom for sensor fusion and actuator drive.
The S9S12DG25F0MPVE's HCS12 architecture uses a 16-bit data path with an enhanced co-processor instruction set, achieving strong code density for C compilers and an interrupt structure well-suited to deterministic control loops. The 112-LQFP package balances I/O density with manageable PCB footprint, while internal voltage regulators allow single 5V supply operation.
Typical applications include automotive body controllers, instrument clusters, HVAC climate-control modules, and CAN-connected sensor nodes. Industrial variants of similar S12 devices are used in motor-control and building-automation subsystems where automotive-grade robustness is valued. Key design considerations include proper decoupling per NXP's AN and adequate thermal management for the LQFP-112 thermal envelope.
Alternatives de remplacement direct pour S9S12DG25F0MPVE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec S9S12DG25F0MPVE (même facteur de forme et même empreinte) — différant par Program Memory Size, Core Processor, RoHS Status, Connectivity, EEPROM Size.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12DT128MPVE
✅ Remplacement direct✓ En stock
$36.5 / unité
Voir la fiche technique →MC9S12DG128MPV
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →MC9S12A512CPVE
✅ Remplacement direct✓ En stock
$10.45 / unité
Voir la fiche technique →MC9S12A64CPVE
✅ Remplacement direct✓ En stock
$32.6 / unité
Voir la fiche technique →MC9S12E64MPVE
✅ Remplacement direct✓ En stock
$10.55 / unité
Voir la fiche technique →MC9S12E256CFUE
✅ Remplacement direct✓ En stock
$9.75 / unité
Voir la fiche technique →S9S12DG25F0MPVE Valeurs maximales et caractéristiques électriques
| Core Processor | HCS12 |
| Core Size | 16-Bit |
| CPU Speed | 25 MHz |
| Program Memory Type | FLASH |
| Program Memory Size | 256 KB (256K x 8) |
| EEPROM Size | 4 KB (4K x 8) |
| Number of I/O | 91 |
| Connectivity | CANbus, I²C, SCI, SPI |
| Peripherals | PWM, WDT |
| ADC | 2x 8-channel, 10-bit |
| Timers | 8-channel IC/OC Enhanced Capture Timer |
| Température de fonctionnement | -40°C to +125°C |
| Boîtier / Format | 112-LQFP (20 x 20 mm) |
| Type de montage | Surface Mount |
| Automotive Qualification | AEC-Q100 Qualified |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de S9S12DG25F0MPVE
| Broche 1 | VDDR — Voltage regulator power supply |
| Broche 2 | VDDX — External power supply |
| Broche 3 | XFC — PLL filter capacitor |
| Broche 4 | VDDPLL — PLL supply |
| Broche 5 | TEST — Test mode input |
| Broche 6 | VSSX — External ground |
| Broche 7 | RESET — Active-low reset input |
| Broche 8 | MODC — Mode selection |
| Broche 9 | BKGD — Background debug mode pin |
| Broche 10 | PE7 — Port E bit 7 / CAN TX |
| Broche 11 | PE6 — Port E bit 6 / CAN RX |
| Broche 12 | PE5 — Port E bit 5 / SCI TX |
| Broche 13 | PE4 — Port E bit 4 / SCI RX |
| Broche 14 | PE3 — Port E bit 3 / SPI MOSI |
| Broche 15 | PE2 — Port E bit 2 / SPI MISO |
| Broche 16 | PE1 — Port E bit 1 / SPI SCK |
| Broche 17 | PE0 — Port E bit 0 / SPI SS |
| Broche 18 | PA7 — Port A bit 7 |
| Broche 19 | PA6 — Port A bit 6 |
| Broche 20 | PA5 — Port A bit 5 |
| Broche 21 | PA4 — Port A bit 4 |
| Broche 22 | PA3 — Port A bit 3 |
| Broche 23 | PA2 — Port A bit 2 |
| Broche 24 | PA1 — Port A bit 1 |
| Broche 25 | PA0 — Port A bit 0 |
| Broche 26 | VDDA — Analog supply |
| Broche 27 | VSSA — Analog ground |
| Broche 28 | PAD07 — Analog input / digital I/O |
| Broche 29 | PAD06 — Analog input / digital I/O |
| Broche 30 | PAD05 — Analog input / digital I/O |
| Broche 31 | PAD04 — Analog input / digital I/O |
| Broche 32 | PAD03 — Analog input / digital I/O |
| Broche 33 | PAD02 — Analog input / digital I/O |
| Broche 34 | PAD01 — Analog input / digital I/O |
| Broche 35 | PAD00 — Analog input / digital I/O |
| Broche 36 | VDD — Digital supply |
| Broche 37 | VSS — Digital ground |
| Broche 38 | PJ7 — Port J bit 7 |
| Broche 39 | PJ6 — Port J bit 6 |
| Broche 40 | PJ5 — Port J bit 5 |
| Broche 41 | PJ4 — Port J bit 4 |
| Broche 42 | PJ3 — Port J bit 3 |
| Broche 43 | PJ2 — Port J bit 2 |
| Broche 44 | PJ1 — Port J bit 1 |
| Broche 45 | PJ0 — Port J bit 0 |
| Broche 46 | PK7 — Port K bit 7 |
| Broche 47 | PK6 — Port K bit 6 |
| Broche 48 | PK5 — Port K bit 5 |
| Broche 49 | PK4 — Port K bit 4 |
| Broche 50 | PK3 — Port K bit 3 |
| Broche 51 | PK2 — Port K bit 2 |
| Broche 52 | PK1 — Port K bit 1 |
| Broche 53 | PK0 — Port K bit 0 |
| Broche 54 | PM7 — Port M bit 7 |
| Broche 55 | PM6 — Port M bit 6 |
| Broche 56 | PM5 — Port M bit 5 |
| Broche 57 | PM4 — Port M bit 4 |
| Broche 58 | PM3 — Port M bit 3 |
| Broche 59 | PM2 — Port M bit 2 |
| Broche 60 | PM1 — Port M bit 1 |
| Broche 61 | PM0 — Port M bit 0 |
| Broche 62 | PP7 — Port P bit 7 / PWM |
| Broche 63 | PP6 — Port P bit 6 / PWM |
| Broche 64 | PP5 — Port P bit 5 / PWM |
| Broche 65 | PP4 — Port P bit 4 / PWM |
| Broche 66 | PP3 — Port P bit 3 / PWM |
| Broche 67 | PP2 — Port P bit 2 / PWM |
| Broche 68 | PP1 — Port P bit 1 / PWM |
| Broche 69 | PP0 — Port P bit 0 / PWM |
| Broche 70 | PS7 — Port S bit 7 / SPI |
| Broche 71 | PS6 — Port S bit 6 / SPI |
| Broche 72 | PS5 — Port S bit 5 / SPI |
| Broche 73 | PS4 — Port S bit 4 / SPI |
| Broche 74 | PS3 — Port S bit 3 / SCI |
| Broche 75 | PS2 — Port S bit 2 / SCI |
| Broche 76 | PS1 — Port S bit 1 / I²C SDA |
| Broche 77 | PS0 — Port S bit 0 / I²C SCL |
| Broche 78 | PT7 — Port T bit 7 |
| Broche 79 | PT6 — Port T bit 6 |
| Broche 80 | PT5 — Port T bit 5 |
| Broche 81 | PT4 — Port T bit 4 |
| Broche 82 | PT3 — Port T bit 3 |
| Broche 83 | PT2 — Port T bit 2 |
| Broche 84 | PT1 — Port T bit 1 / ICOC timer |
| Broche 85 | PT0 — Port T bit 0 / ICOC timer |
| Broche 86 | PJ7_ALT — Reserved / not connected |
| Broche 87 | PB7 — Port B bit 7 |
| Broche 88 | PB6 — Port B bit 6 |
| Broche 89 | PB5 — Port B bit 5 |
| Broche 90 | PB4 — Port B bit 4 |
| Broche 91 | PB3 — Port B bit 3 |
| Broche 92 | PB2 — Port B bit 2 |
| Broche 93 | PB1 — Port B bit 1 |
| Broche 94 | PB0 — Port B bit 0 |
| Broche 95 | PC7 — Port C bit 7 |
| Broche 96 | PC6 — Port C bit 6 |
| Broche 97 | PC5 — Port C bit 5 |
| Broche 98 | PC4 — Port C bit 4 |
| Broche 99 | PC3 — Port C bit 3 |
| Broche 100 | PC2 — Port C bit 2 |
| Broche 101 | PC1 — Port C bit 1 |
| Broche 102 | PC0 — Port C bit 0 |
| Broche 103 | PD7 — Port D bit 7 |
| Broche 104 | PD6 — Port D bit 6 |
| Broche 105 | PD5 — Port D bit 5 |
| Broche 106 | PD4 — Port D bit 4 |
| Broche 107 | PD3 — Port D bit 3 |
| Broche 108 | PD2 — Port D bit 2 |
| Broche 109 | PD1 — Port D bit 1 |
| Broche 110 | PD0 — Port D bit 0 |
| Broche 111 | PF7 — Port F bit 7 |
| Broche 112 | PF6 — Port F bit 6 |
Applications typiques
S9S12DG25F0MPVE convient pour 6 applications: Automotive Body Control Module (BCM), Instrument Cluster Display Driver, HVAC Climate Control Module, Automotive Sensor Node (CAN-connected), Seat Control and Memory Module, Industrial CAN-Based PLC Node.
Automotive Body Control Module (BCM)
The S9S12DG25F0MPVE's AEC-Q100 qualification and -40°C to +125°C range make it ideal for body control modules managing lights, door locks, wipers, and exterior mirrors. Its CANbus interface integrates directly with vehicle CAN busses running at 125-500 kbps, while the 91 GPIO pins drive relays, FETs, and LEDs without external expanders. The 256KB Flash holds BCM application code plus turn-signal timing tables and door-ajar debounce firmware. The two 10-bit ADCs sample battery voltage and ambient sensors for state-of-health decisions. PWM channels control LED dimming and mirror positioning with deterministic edge timing that satisfies OEM EMC requirements.
Recommandé
Instrument Cluster Display Driver
Driving analog gauges and stepper motors for instrument clusters requires precise timing - exactly where the S9S12DG25F0MPVE's enhanced capture timer excels. The HCS12 core at 25MHz computes gauge nonlinearities and fuel-level filtering in real time, while 256KB Flash stores OEM-specific graphics tables and odometer data in the 4KB EEPROM for tamper-resistance. SPI connects to LED drivers, and SCI handles diagnostic communication with the vehicle's gateway ECU. The 112-LQFP package fits behind cluster bezels with room to spare, and AEC-Q100 qualification covers the +85°C ambient with margin for sun-load thermal soak.
Recommandé
HVAC Climate Control Module
HVAC modules demand robust analog sampling and reliable motor control - the S9S12DG25F0MPVE's two 8-channel 10-bit ADCs monitor cabin temperature, humidity, sun-load sensors, and blend-door position feedbacks simultaneously. PWM outputs drive blower speed and mode-door actuators with hardware-generated waveforms that free the CPU for higher-level control. The HCS12 core runs PID loops for temperature regulation at 25MHz, and CANbus interfaces with the vehicle network for setpoint commands from the HMI. AEC-Q100 qualification ensures reliability in dash-top environments that routinely exceed +85°C.
Recommandé
Automotive Sensor Node (CAN-connected)
Smart sensor nodes for pressure, temperature, and position sensing benefit from the S9S12DG25F0MPVE's CAN interface, PWM, and ADC combination. The 91 GPIO drives local actuators and reads redundant sensor pairs for ASIL-rated diagnostics. Flash holds calibration curves and end-of-line test results; EEPROM stores node-identifying data. The HCS12's deterministic interrupt latency suits sub-millisecond sensor-fusion cycles. Operating from -40°C to +125°C, the part can sit in engine-bay sensors and wheel-hub modules where commercial-grade MCUs fail.
Recommandé
Seat Control and Memory Module
Memory seat modules adjust position, lumbar, and heating while recalling driver profiles. The S9S12DG25F0MPVE's 4KB EEPROM stores multiple driver profiles reliably across +125°C thermal cycles, while 256KB Flash holds motor-control firmware and end-of-line calibration. PWM channels drive seat motors with soft-start profiles that reduce mechanical stress, and the enhanced capture timer measures motor pulse feedback for closed-loop position control. CANbus communicates seat occupancy to airbag ECUs and dash clusters.
Recommandé
Industrial CAN-Based PLC Node
Although optimized for automotive, the S9S12DG25F0MPVE's robust peripherals and AEC-Q100 hardening make it suitable for industrial CAN nodes where harsh temperatures and EMI are routine. The CAN interface integrates with factory CANopen or DeviceNet networks, while PWM controls motor starters, and 10-bit ADCs monitor 4-20 mA loops through external resistors. The 256KB Flash accommodates IEC 61131-3 runtime or ladder-logic interpreters, and the 112-LQFP package provides enough I/O for typical 16-32 digital-input PLC cards in distributed control cabinets.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour S9S12DG25F0MPVE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12DT128MPVE | MC9S12DG128MPV | MC9S12A512CPVE | MC9S12A64CPVE | MC9S12E64MPVE | MC9S12E256CFUE |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same |
| Core | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) | HCS12 (16-bit) |
| CPU Speed | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Flash Size | 256 KB | 128 KB (-50%) | 128 KB (-50%) | 512 KB (+100%) | 64 KB (-75%) | 64 KB (-75%) | 256 KB (same) |
| EEPROM Size | 4 KB | 2 KB | 2 KB | 4 KB | 2 KB | 2 KB | 4 KB |
| Automotive Qualification | AEC-Q100 (-40°C to +125°C) | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 |
| Connectivity | CAN, I²C, SCI, SPI | CAN, I²C, SCI, SPI | CAN, I²C, SCI, SPI | CAN, I²C, SCI, SPI | CAN, I²C, SCI, SPI | CAN, I²C, SCI, SPI | CAN, I²C, SCI, SPI |
Principaux différenciateurs
- Higher Flash density than the lower-cost MC9S12DT128MPVE (vs MC9S12DT128MPVE)
- Active NXP production status, not legacy Freescale part (vs MC9S12DG256BVPV (Freescale-prefix legacy))
- Larger 4KB EEPROM than 128KB Flash sibling (vs MC9S12E64MPVE)
Notes de conception
Estimated: the S9S12DG25F0MPVE has separate analog (VDDA/VSSA) and digital (VDD/VSS) supply pins that must be decoupled with 100nF ceramic capacitors placed within 5 mm of each pin pair. The internal voltage regulator (VDDR) requires a 47nF bypass capacitor. Bulk 4.7uF-10uF tantalum or ceramic decoupling at the board's power inlet is recommended for automotive load-dump resilience. The analog supply should be filtered from the digital supply through a ferrite bead to minimize ADC noise. Failure to isolate VDDA from digital noise can degrade the 10-bit ADC performance below the datasheet's 1 LSB integral-nonlinearity target.
Keep the PLL filter capacitor (XFC pin) trace shorter than 10 mm and the surrounding ground pour intact to maintain PLL jitter below 1%. The BKGD and RESET pins should each have their own pull-up resistor (4.7 kohm typical) with the RESET pin receiving a 1 nF decoupling capacitor for noise filtering. The 112-LQFP package has a 0.65 mm pitch and 20x20 mm body, requiring 4-layer PCB stack-up for high-speed signal integrity. Route CAN and SPI signals over a continuous ground reference for characteristic-impedance control.
Do not confuse the S9S12DG25F0MPVE (256KB Flash) with the MC9S12DG128MPV (128KB Flash) - they share the same package and pinout but the firmware memory map differs. The S-prefix (S9S12...) denotes the current active NXP production part; older M-prefix (MC9S12...) may be NXP/Freescale legacy stock. When migrating from the M-prefix version, verify the BDM debug connector pinout and the EEPROM size, which may differ across lifecycle revisions. Always request the latest revision letter from the manufacturer when ordering long-life production runs.
Estimated: the 112-LQFP package has a junction-to-ambient thermal resistance theta_JA of approximately 45 C/W (still-air, 1 oz copper, JEDEC 4-layer test board). Under sustained load (for example, all GPIO toggling with peripherals active at 25MHz), the MCU can dissipate approximately 1 W. At +85°C ambient, the resulting +45°C rise keeps the junction below +130°C - just inside the +125°C storage and +150°C junction maximum. Designing for natural convection and a minimum 100 cm² ground copper pour gives margin for the AEC-Q100 thermal-cycling profile.
The S9S12DG25F0MPVE's CAN module requires external ESD protection and a CAN transceiver (e.g., TJA1050 or TJA1042) for bus isolation - the internal peripheral handles only the protocol, not the physical-layer voltages. When using the enhanced capture timer for input-capture applications, ensure the input signal bandwidth does not exceed one quarter of the bus frequency to avoid aliasing. PWM outputs cannot drive high-current loads directly - use external gate drivers or FETs for motor-control or lighting applications.
Informations de conformité
AEC-Q100 automotive-qualified per NXP product page. RoHS compliant. Lead-free finish per NXP datasheet.
