TDA4VE88TGAALZRQ1 - 8 TOPS AI SoC | Texas Instruments
Référence : TDA4VE88TGAALZRQ1 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $80.36 | $80,36 |
| 10 | $78 | $780,00 |
| 100 | $75 | $7 500,00 |
| 500 | $72 | $36 000,00 |
| 1 000 | $70 | $70 000,00 |
TDA4VE88TGAALZRQ1 Présentation
What is a System-on-Chip (SoC)? An SoC is a semiconductor device that integrates multiple computing units, including CPU cores, DSPs, GPU, AI accelerators, and memory interfaces, onto a single chip. It is a higher-level integration than a microprocessor, combining system functionality to reduce board complexity. In the automotive domain, SoCs are the central compute hub for ADAS, autonomous driving, and infotainment.
Key features include dual 2 GHz Cortex-A72 cores for application processing, a 1 GHz Cortex-R5F for real-time control, and C66x and C7x DSPs for signal processing. The 8 TOPS AI accelerator enables deep learning inference at the edge, supporting tasks such as object detection and semantic segmentation. The integrated GPU provides 3D rendering capability for surround-view systems.
The SoC uses a heterogeneous architecture to optimize power and performance. The A72 cores handle Linux-based automotive stacks, while the DSPs offload real-time sensor processing. The 770-pin FCBGA (ALZ) package offers excellent thermal performance with a 23x23 mm footprint, enabling dense system integration. The AEC-Q100 qualification ensures reliability across the automotive temperature range.
Typical applications include ADAS domain controllers, autonomous driving systems, surround-view camera processing, radar signal processing, and in-vehicle infotainment. Its 8 TOPS AI is particularly suited for vision-perception systems where real-time object detection is critical.
When designing with this SoC, ensure proper power sequencing using a PMIC like TPS6594-Q1 and adequate thermal management. The high-speed interfaces require careful PCB design with controlled impedance. Refer to TI's Jacinto 7 reference designs for guidance.
Alternatives de remplacement direct pour TDA4VE88TGAALZRQ1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec TDA4VE88TGAALZRQ1 (même facteur de forme et même empreinte) — différant par Core Processor.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
TDA4VE88TGAALZR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
TDA4VE87TGAALZRQ1
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
TDA4VE86TGAALZRQ1
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TDA4AL88TGAALZRQ1
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$74.21 / unité
Voir la fiche technique →TDA4VL88TGAALZRQ1
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
TDA4VE88TGAALZRQ1 Valeurs maximales et caractéristiques électriques
| Core Processor | ARM Cortex-A72, ARM Cortex-R5F, C66x, C7x |
| Core Frequency (A72) | 2 GHz |
| Core Frequency (R5F) | 1 GHz |
| Core Frequency (C66x) | 1 GHz |
| AI Accelerator | 8 TOPS |
| Package Type | FCBGA (ALZ) |
| Nombre de broches | 770 |
| Package Dimensions | 23x23 mm |
| Plage de température de fonctionnement | -40°C to 125°C |
| Type de montage | Surface Mount |
| Automotive Qualification | AEC-Q100 (Q1) |
| Silicon Revision | 1.0 |
| Datasheet Pages | 251 |
Guide de configuration des broches du TDA4VE88TGAALZRQ1 23x23 mm
Configuration des broches du TDA4VE88TGAALZRQ1 (boîtier 23x23 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour TDA4VE88TGAALZRQ1.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
TDA4VE88TGAALZRQ1 convient pour 6 applications: ADAS Vision Perception, Autonomous Driving Domain Controller, In-Vehicle Infotainment (IVI), Surround View Camera System, Radar/Imaging Signal Processing, Industrial Robotics Vision.
ADAS Vision Perception
The TDA4VE88TGAALZRQ1's dual Cortex-A72 and 8 TOPS AI accelerator provide the computational power to process multiple camera feeds in real time. By offloading neural network inference to the C7x and MMA units, it enables object detection and lane tracking with low latency. The integrated GPU supports 3D surround view rendering, crucial for parking assistance systems. Its 770-pin FCBGA package is optimized for dense integration in space-constrained control units.
Recommandé
Autonomous Driving Domain Controller
In a domain controller, the TDA4VE88TGAALZRQ1 handles sensor fusion from radar, LiDAR, and cameras. Its heterogeneous architecture (A72 for high-level, R5F for real-time control, C66x/C7x for DSP) supports safety-critical functions. The 8 TOPS AI capability enables real-time decision-making. Automotive-grade AEC-Q100 qualification ensures reliability in harsh vehicle conditions, while the -40 to 125°C range covers both cold and hot climates.
Recommandé
In-Vehicle Infotainment (IVI)
The dual Cortex-A72 cores provide ample performance for IVI systems, including dashboard clusters, navigation, and multimedia. The GPU accelerates UI rendering, while the C7x DSP can handle audio processing. Its 8 TOPS AI can also support voice assistants. The SoC's power-efficient design and automotive qualification make it suitable for head units with stringent power budgets.
Recommandé
Surround View Camera System
For surround view systems, the TDA4VE88TGAALZRQ1 integrates up to 8 camera inputs via its CSI-2 interface, allowing 360-degree views. The GPU handles fisheye distortion correction and stitching in real time. With 8 TOPS AI, it can also detect pedestrians and obstacles. The 770-pin FCBGA package provides the I/O density needed for multiple cameras, while the -40 to 125°C range ensures operation in all weather.
Recommandé
Radar/Imaging Signal Processing
The C66x DSP and C7x DSP in TDA4VE88TGAALZRQ1 are well-suited for radar signal processing and imaging algorithms. The SoC can handle FFT, beamforming, and object tracking. Its heterogeneous computing architecture reduces CPU load, enabling real-time processing of multiple sensor streams. The automotive-grade design ensures it can be used in radar units for adaptive cruise control and automatic emergency braking.
Recommandé
Industrial Robotics Vision
Though designed for automotive, the TDA4VE88TGAALZRQ1 is also suitable for industrial robotics vision applications. Its 8 TOPS AI and GPU enable object recognition, motion tracking, and quality inspection. The wide operating temperature range and robust package make it reliable in factory environments. Engineers can leverage TI's edge AI tools to deploy neural networks for real-time decision making.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour TDA4VE88TGAALZRQ1 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | TDA4AL88TGAALZRQ1 | TDA4VL88TGAALZRQ1 | TDA4VE87TGAALZRQ1 |
|---|---|---|---|---|
| Package | FCBGA (ALZ) 770-pin | FCBGA (ALZ) 770-pin | FCBGA (ALZ) 770-pin | FCBGA (ALZ) 770-pin |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Core Architecture | Dual A72 + R5F + C66x + C7x + GPU | Dual A72 + R5F + C66x + C7x + GPU (reduced AI) | Dual A72 + R5F + C66x + C7x + GPU | Dual A72 + R5F + C66x + C7x + GPU |
| AI Accelerator (TOPS) | 8 | 1 | 8 | 8 |
| A72 Core Frequency | 2 GHz | 2 GHz | 2 GHz | 1.8 GHz |
| Operating Temperature Range | -40°C to 125°C | -40°C to 125°C | -40°C to 125°C | -40°C to 125°C |
| Automotive Grade | AEC-Q100 (Q1) | AEC-Q100 (Q1) | AEC-Q100 (Q1) | AEC-Q100 (Q1) |
Principaux différenciateurs
- 8 TOPS AI acceleration (vs TDA4AL88TGAALZRQ1)
- AEC-Q100 qualification (vs TDA4VE88TGAALZR)
- 2 GHz dual A72 cores (vs TDA4VE87TGAALZRQ1)
Notes de conception
The TDA4VE88TGAALZRQ1 requires multiple supply rails (core, IO, DDR). Use a PMIC like TPS6594-Q1 for sequencing and monitoring. Ensure all rails meet voltage tolerances to prevent boot failures. Decouple each rail with 10uF and 0.1uF capacitors.
This SoC dissipates significant power due to dual A72 cores and AI acceleration. Use a heatsink and thermal vias under the FCBGA package to maintain junction temperature within -40 to 125°C. Consider airflow in the enclosure.
Route high-speed interfaces (DDR, CSI-2, PCIe) with controlled impedance. Use reference plane and avoid crossing planes to minimize EMI. The 770-pin FCBGA requires fine-pitch soldering - follow TI's layout guidelines.
Informations de conformité
AEC-Q100 qualification inferred from Q1 suffix. RoHS, REACH, lead-free, halogen-free, and conflict minerals status not extracted from verified data.
