TDA4VE88TGAALZRQ1 - 8 TOPS AI SoC | Texas Instruments
料号： TDA4VE88TGAALZRQ1 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $80.36 | $80.36 |
| 10 | $78 | $780.00 |
| 100 | $75 | $7,500.00 |
| 500 | $72 | $36,000.00 |
| 1,000 | $70 | $70,000.00 |
TDA4VE88TGAALZRQ1 概述
What is a System-on-Chip (SoC)? An SoC is a semiconductor device that integrates multiple computing units, including CPU cores, DSPs, GPU, AI accelerators, and memory interfaces, onto a single chip. It is a higher-level integration than a microprocessor, combining system functionality to reduce board complexity. In the automotive domain, SoCs are the central compute hub for ADAS, autonomous driving, and infotainment.
Key features include dual 2 GHz Cortex-A72 cores for application processing, a 1 GHz Cortex-R5F for real-time control, and C66x and C7x DSPs for signal processing. The 8 TOPS AI accelerator enables deep learning inference at the edge, supporting tasks such as object detection and semantic segmentation. The integrated GPU provides 3D rendering capability for surround-view systems.
The SoC uses a heterogeneous architecture to optimize power and performance. The A72 cores handle Linux-based automotive stacks, while the DSPs offload real-time sensor processing. The 770-pin FCBGA (ALZ) package offers excellent thermal performance with a 23x23 mm footprint, enabling dense system integration. The AEC-Q100 qualification ensures reliability across the automotive temperature range.
Typical applications include ADAS domain controllers, autonomous driving systems, surround-view camera processing, radar signal processing, and in-vehicle infotainment. Its 8 TOPS AI is particularly suited for vision-perception systems where real-time object detection is critical.
When designing with this SoC, ensure proper power sequencing using a PMIC like TPS6594-Q1 and adequate thermal management. The high-speed interfaces require careful PCB design with controlled impedance. Refer to TI's Jacinto 7 reference designs for guidance.
直接替换替代料： TDA4VE88TGAALZRQ1 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： TDA4VE88TGAALZRQ1 （相同外形与封装尺寸） ——差异在于 Core Processor.
快速对比工具——选择替代料号进行并排对比：
TDA4VE88TGAALZR
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
TDA4VE87TGAALZRQ1
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
TDA4VE86TGAALZRQ1
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
TDA4AL88TGAALZRQ1
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$74.21 / 个
查看数据手册 →TDA4VL88TGAALZRQ1
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
TDA4VE88TGAALZRQ1 最大额定值与电气特性
| Core Processor | ARM Cortex-A72, ARM Cortex-R5F, C66x, C7x |
| Core Frequency (A72) | 2 GHz |
| Core Frequency (R5F) | 1 GHz |
| Core Frequency (C66x) | 1 GHz |
| AI Accelerator | 8 TOPS |
| Package Type | FCBGA (ALZ) |
| 引脚数量 | 770 |
| Package Dimensions | 23x23 mm |
| 工作温度范围 | -40°C to 125°C |
| 安装类型 | Surface Mount |
| Automotive Qualification | AEC-Q100 (Q1) |
| Silicon Revision | 1.0 |
| Datasheet Pages | 251 |
TDA4VE88TGAALZRQ1 23x23 mm 引脚配置指南
TDA4VE88TGAALZRQ1（23x23 mm 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： TDA4VE88TGAALZRQ1.
请参阅 数据手册 以查看完整引脚配置。
典型应用
TDA4VE88TGAALZRQ1 适用于 6 应用s: ADAS Vision Perception, Autonomous Driving Domain Controller, In-Vehicle Infotainment (IVI), Surround View Camera System, Radar/Imaging Signal Processing, Industrial Robotics Vision.
ADAS Vision Perception
The TDA4VE88TGAALZRQ1's dual Cortex-A72 and 8 TOPS AI accelerator provide the computational power to process multiple camera feeds in real time. By offloading neural network inference to the C7x and MMA units, it enables object detection and lane tracking with low latency. The integrated GPU supports 3D surround view rendering, crucial for parking assistance systems. Its 770-pin FCBGA package is optimized for dense integration in space-constrained control units.
推荐
Autonomous Driving Domain Controller
In a domain controller, the TDA4VE88TGAALZRQ1 handles sensor fusion from radar, LiDAR, and cameras. Its heterogeneous architecture (A72 for high-level, R5F for real-time control, C66x/C7x for DSP) supports safety-critical functions. The 8 TOPS AI capability enables real-time decision-making. Automotive-grade AEC-Q100 qualification ensures reliability in harsh vehicle conditions, while the -40 to 125°C range covers both cold and hot climates.
推荐
In-Vehicle Infotainment (IVI)
The dual Cortex-A72 cores provide ample performance for IVI systems, including dashboard clusters, navigation, and multimedia. The GPU accelerates UI rendering, while the C7x DSP can handle audio processing. Its 8 TOPS AI can also support voice assistants. The SoC's power-efficient design and automotive qualification make it suitable for head units with stringent power budgets.
推荐
Surround View Camera System
For surround view systems, the TDA4VE88TGAALZRQ1 integrates up to 8 camera inputs via its CSI-2 interface, allowing 360-degree views. The GPU handles fisheye distortion correction and stitching in real time. With 8 TOPS AI, it can also detect pedestrians and obstacles. The 770-pin FCBGA package provides the I/O density needed for multiple cameras, while the -40 to 125°C range ensures operation in all weather.
推荐
Radar/Imaging Signal Processing
The C66x DSP and C7x DSP in TDA4VE88TGAALZRQ1 are well-suited for radar signal processing and imaging algorithms. The SoC can handle FFT, beamforming, and object tracking. Its heterogeneous computing architecture reduces CPU load, enabling real-time processing of multiple sensor streams. The automotive-grade design ensures it can be used in radar units for adaptive cruise control and automatic emergency braking.
推荐
Industrial Robotics Vision
Though designed for automotive, the TDA4VE88TGAALZRQ1 is also suitable for industrial robotics vision applications. Its 8 TOPS AI and GPU enable object recognition, motion tracking, and quality inspection. The wide operating temperature range and robust package make it reliable in factory environments. Engineers can leverage TI's edge AI tools to deploy neural networks for real-time decision making.
推荐
推荐产品汇总
工程参考数据： TDA4VE88TGAALZRQ1 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | TDA4AL88TGAALZRQ1 | TDA4VL88TGAALZRQ1 | TDA4VE87TGAALZRQ1 |
|---|---|---|---|---|
| Package | FCBGA (ALZ) 770-pin | FCBGA (ALZ) 770-pin | FCBGA (ALZ) 770-pin | FCBGA (ALZ) 770-pin |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Core Architecture | Dual A72 + R5F + C66x + C7x + GPU | Dual A72 + R5F + C66x + C7x + GPU (reduced AI) | Dual A72 + R5F + C66x + C7x + GPU | Dual A72 + R5F + C66x + C7x + GPU |
| AI Accelerator (TOPS) | 8 | 1 | 8 | 8 |
| A72 Core Frequency | 2 GHz | 2 GHz | 2 GHz | 1.8 GHz |
| Operating Temperature Range | -40°C to 125°C | -40°C to 125°C | -40°C to 125°C | -40°C to 125°C |
| Automotive Grade | AEC-Q100 (Q1) | AEC-Q100 (Q1) | AEC-Q100 (Q1) | AEC-Q100 (Q1) |
关键差异点
- 8 TOPS AI acceleration （对比 TDA4AL88TGAALZRQ1)
- AEC-Q100 qualification （对比 TDA4VE88TGAALZR)
- 2 GHz dual A72 cores （对比 TDA4VE87TGAALZRQ1)
设计说明
The TDA4VE88TGAALZRQ1 requires multiple supply rails (core, IO, DDR). Use a PMIC like TPS6594-Q1 for sequencing and monitoring. Ensure all rails meet voltage tolerances to prevent boot failures. Decouple each rail with 10uF and 0.1uF capacitors.
This SoC dissipates significant power due to dual A72 cores and AI acceleration. Use a heatsink and thermal vias under the FCBGA package to maintain junction temperature within -40 to 125°C. Consider airflow in the enclosure.
Route high-speed interfaces (DDR, CSI-2, PCIe) with controlled impedance. Use reference plane and avoid crossing planes to minimize EMI. The 770-pin FCBGA requires fine-pitch soldering - follow TI's layout guidelines.
合规信息
AEC-Q100 qualification inferred from Q1 suffix. RoHS, REACH, lead-free, halogen-free, and conflict minerals status not extracted from verified data.
