TDA4VE88TGAALZRQ1 - 8 TOPS AI SoC | Texas Instruments
MPN: TDA4VE88TGAALZRQ1 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $80.36 | $80.36 |
| 10 | $78 | $780.00 |
| 100 | $75 | $7,500.00 |
| 500 | $72 | $36,000.00 |
| 1,000 | $70 | $70,000.00 |
Drop-in alternatives for TDA4VE88TGAALZRQ1 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
TDA4VE88TGAALZR
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TDA4VE87TGAALZRQ1
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TDA4AL88TGAALZRQ1
✅ Drop-In✓ In Stock
$74.21 / Unit
View Datasheet →TDA4VL88TGAALZRQ1
✅ Drop-In📋 Reference alternative (not in catalog)
TDA4VE88TGAALZRQ1 Maximum Ratings & Electrical Characteristics
| Core Processor | ARM Cortex-A72, ARM Cortex-R5F, C66x, C7x |
| Core Frequency (A72) | 2 GHz |
| Core Frequency (R5F) | 1 GHz |
| Core Frequency (C66x) | 1 GHz |
| AI Accelerator | 8 TOPS |
| GPU | Integrated [DATA_NEEDED: GPU Model] |
| Package Type | FCBGA (ALZ) |
| Pin Count | 770 |
| Package Dimensions | 23x23 mm |
| Operating Temperature Range | -40°C to 125°C |
| Mounting Type | Surface Mount |
| Automotive Qualification | AEC-Q100 (Q1) |
| Silicon Revision | 1.0 |
| Datasheet Pages | 251 |
| Supply Voltage | [DATA_NEEDED: Supply Voltage] |
| Process Technology | [DATA_NEEDED: Process Technology] |
| RoHS Status | [DATA_NEEDED: RoHS Status] |
TDA4VE88TGAALZRQ1 23x23 mm Pin Configuration Guide
Complete pinout information for TDA4VE88TGAALZRQ1 (23x23 mm package) with 770 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for TDA4VE88TGAALZRQ1.
Refer to the datasheet for full pin configuration.
Estimated pin count: 770 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
TDA4VE88TGAALZRQ1 is suitable for 6 applications: ADAS Vision Perception, Autonomous Driving Domain Controller, In-Vehicle Infotainment (IVI), Surround View Camera System, Radar/Imaging Signal Processing, Industrial Robotics Vision.
ADAS Vision Perception
The TDA4VE88TGAALZRQ1's dual Cortex-A72 and 8 TOPS AI accelerator provide the computational power to process multiple camera feeds in real time. By offloading neural network inference to the C7x and MMA units, it enables object detection and lane tracking with low latency. The integrated GPU supports 3D surround view rendering, crucial for parking assistance systems. Its 770-pin FCBGA package is optimized for dense integration in space-constrained control units.
Recommended
Autonomous Driving Domain Controller
In a domain controller, the TDA4VE88TGAALZRQ1 handles sensor fusion from radar, LiDAR, and cameras. Its heterogeneous architecture (A72 for high-level, R5F for real-time control, C66x/C7x for DSP) supports safety-critical functions. The 8 TOPS AI capability enables real-time decision-making. Automotive-grade AEC-Q100 qualification ensures reliability in harsh vehicle conditions, while the -40 to 125°C range covers both cold and hot climates.
Recommended
In-Vehicle Infotainment (IVI)
The dual Cortex-A72 cores provide ample performance for IVI systems, including dashboard clusters, navigation, and multimedia. The GPU accelerates UI rendering, while the C7x DSP can handle audio processing. Its 8 TOPS AI can also support voice assistants. The SoC's power-efficient design and automotive qualification make it suitable for head units with stringent power budgets.
Recommended
Surround View Camera System
For surround view systems, the TDA4VE88TGAALZRQ1 integrates up to 8 camera inputs via its CSI-2 interface, allowing 360-degree views. The GPU handles fisheye distortion correction and stitching in real time. With 8 TOPS AI, it can also detect pedestrians and obstacles. The 770-pin FCBGA package provides the I/O density needed for multiple cameras, while the -40 to 125°C range ensures operation in all weather.
Recommended
Radar/Imaging Signal Processing
The C66x DSP and C7x DSP in TDA4VE88TGAALZRQ1 are well-suited for radar signal processing and imaging algorithms. The SoC can handle FFT, beamforming, and object tracking. Its heterogeneous computing architecture reduces CPU load, enabling real-time processing of multiple sensor streams. The automotive-grade design ensures it can be used in radar units for adaptive cruise control and automatic emergency braking.
Recommended
Industrial Robotics Vision
Though designed for automotive, the TDA4VE88TGAALZRQ1 is also suitable for industrial robotics vision applications. Its 8 TOPS AI and GPU enable object recognition, motion tracking, and quality inspection. The wide operating temperature range and robust package make it reliable in factory environments. Engineers can leverage TI's edge AI tools to deploy neural networks for real-time decision making.
Recommended
Recommended Products Summary
Engineering reference data for TDA4VE88TGAALZRQ1 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | TDA4AL88TGAALZRQ1 | TDA4VL88TGAALZRQ1 | TDA4VE87TGAALZRQ1 |
|---|---|---|---|---|
| Package | FCBGA (ALZ) 770-pin | FCBGA (ALZ) 770-pin | FCBGA (ALZ) 770-pin | FCBGA (ALZ) 770-pin |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Core Architecture | Dual A72 + R5F + C66x + C7x + GPU | Dual A72 + R5F + C66x + C7x + GPU (reduced AI) | Dual A72 + R5F + C66x + C7x + GPU | Dual A72 + R5F + C66x + C7x + GPU |
| AI Accelerator (TOPS) | 8 | 1 | 8 | 8 |
| A72 Core Frequency | 2 GHz | 2 GHz | 2 GHz | 1.8 GHz |
| Operating Temperature Range | -40°C to 125°C | -40°C to 125°C | -40°C to 125°C | -40°C to 125°C |
| Automotive Grade | AEC-Q100 (Q1) | AEC-Q100 (Q1) | AEC-Q100 (Q1) | AEC-Q100 (Q1) |
| Price at Qty 1 | $80.36 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- 8 TOPS AI acceleration (vs TDA4AL88TGAALZRQ1)
- AEC-Q100 qualification (vs TDA4VE88TGAALZR)
- 2 GHz dual A72 cores (vs TDA4VE87TGAALZRQ1)
Design Notes
The TDA4VE88TGAALZRQ1 requires multiple supply rails (core, IO, DDR). Use a PMIC like TPS6594-Q1 for sequencing and monitoring. Ensure all rails meet voltage tolerances to prevent boot failures. Decouple each rail with 10uF and 0.1uF capacitors.
This SoC dissipates significant power due to dual A72 cores and AI acceleration. Use a heatsink and thermal vias under the FCBGA package to maintain junction temperature within -40 to 125°C. Consider airflow in the enclosure.
Route high-speed interfaces (DDR, CSI-2, PCIe) with controlled impedance. Use reference plane and avoid crossing planes to minimize EMI. The 770-pin FCBGA requires fine-pitch soldering - follow TI's layout guidelines.
Compliance Information
AEC-Q100 qualification inferred from Q1 suffix. RoHS, REACH, lead-free, halogen-free, and conflict minerals status not extracted from verified data.
