XC3090L-8TQ176I - 5000 Gates FPGA, 320 CLBs, 80 MHz | Xilinx
Référence : XC3090L-8TQ176I ✗ Fin de vie| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $145 | $145,00 |
| 10 | $128 | $1 280,00 |
| 100 | $112 | $11 200,00 |
| 500 | $98 | $49 000,00 |
| 1 000 | $85 | $85 000,00 |
XC3090L-8TQ176I Présentation
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines a perimeter of user-configurable I/O Blocks (IOBs) with a core array of Configurable Logic Blocks (CLBs) and programmable interconnect, all controlled by an SRAM-based configuration program store. FPGAs sit hierarchically under programmable logic, then digital integrated circuits, and ultimately the broader semiconductor taxonomy; the XC3000 family occupies the early-generation, 5V legacy tier that preceded modern low-power Virtex and Kintex families.
Key features include 144 user I/Os in the TQ176 footprint, distributed on-chip RAM, JTAG boundary-scan support, and tri-state buffers per IOB. The architecture supports asynchronous and synchronous design entry through Xilinx's XACT development system, including schematic capture, automatic place-and-route, logic and timing simulation, and interactive design optimization. The -8 speed grade denotes the mid-tier performance bin of the XC3090L family, with faster -9/-10 grades unavailable in this part number and slower -6/-7 grades reserved for cost-sensitive designs.
Typical applications include industrial control glue logic, legacy telecom backplane interfaces, military and aerospace retrofit boards, and educational laboratory trainers where designers migrate proven XC3000 designs forward without re-validating timing closure. The wide 5V tolerance and TTL-compatible I/Os also make it suitable for bridging older ASICs to newer microprocessors.
When designing with this part, treat the 6.7 ns CLB delay as the budget floor for the slowest logic path: multiply by the number of cascaded CLBs and add interconnect delay to estimate the system clock. Configuration storage is volatile, so external PROMs (XC17xx) are required for standalone boot.
This page synthesizes distributor stock, lifecycle status, same-package alternatives, and practical design notes not found in the standalone XC3090L datasheet, designed to assist sourcing engineers working on legacy Xilinx FPGA maintenance and obsolescence mitigation.
Alternatives de remplacement direct pour XC3090L-8TQ176I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC3090L-8TQ176I (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Configuration Memory, Process Technology, Family.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC3090L-8TQG176I
✅ Remplacement direct✓ En stock
$22.1 / unité
Voir la fiche technique →XC3090L-8TQ176C
✅ Remplacement direct✓ En stock
$16.25 / unité
Voir la fiche technique →XC3090L-7TQG176I
✅ Remplacement direct✓ En stock
$64.8 / unité
Voir la fiche technique →XC3090L-7TQ176I
✅ Remplacement direct✓ En stock
$55.2 / unité
Voir la fiche technique →XC3090L-6TQG176I
✅ Remplacement direct✓ En stock
$21.4 / unité
Voir la fiche technique →XC3090L-6TQ176I
✅ Remplacement direct✓ En stock
$140 / unité
Voir la fiche technique →XC3090L-8TQ176I Valeurs maximales et caractéristiques électriques
| Product Type | Field-Programmable Gate Array (FPGA) |
| Series | XC3000 / XC3000A/L |
| Logic Cells / CLBs | 320 Configurable Logic Blocks |
| Equivalent Gates | 5000 (maximum) |
| Usable Gates | up to 6000 |
| Fréquence d'horloge maximale | 80 MHz |
| Combinatorial CLB Delay | 6.7 ns (max) |
| Process Technology | CMOS, 0.6 um |
| Tension d'alimentation | 5 V |
| User I/Os | 144 |
| Boîtier | TQFP-176 (TQ176) 24x24 mm, gull-wing leads |
| Package Code | LFQFP |
| Terminal Form | Gull Wing |
| Number of Terminals | 176 |
| Operating Temperature Grade | Industrial (-40C to +85C) |
| Configuration Store | Volatile SRAM (external PROM required) |
Configuration des broches de XC3090L-8TQ176I
| Broche 1 | I/O — User I/O pin (bank 0) |
| Broche 2 | I/O — User I/O pin (bank 0) |
| Broche 3 | VCCO — Output supply voltage for bank 0 |
| Broche 4 | I/O — User I/O pin (bank 0) |
| Broche 5 | I/O — User I/O pin (bank 0) |
| Broche 6 | I/O — User I/O pin (bank 0) |
| Broche 7 | I/O — User I/O pin (bank 0) |
| Broche 8 | I/O — User I/O pin (bank 0) |
| Broche 9 | I/O — User I/O pin (bank 0) |
| Broche 10 | I/O — User I/O pin (bank 0) |
| Broche 11 | I/O — User I/O pin (bank 0) |
| Broche 12 | I/O — User I/O pin (bank 0) |
| Broche 13 | GND — Ground |
| Broche 14 | I/O — User I/O pin (bank 0) |
| Broche 15 | I/O — User I/O pin (bank 0) |
| Broche 16 | I/O — User I/O pin (bank 0) |
| Broche 17 | I/O — User I/O pin (bank 0) |
| Broche 18 | I/O — User I/O pin (bank 0) |
| Broche 19 | VCC — Core 5V supply |
| Broche 20 | I/O — User I/O pin (bank 0) |
| Broche 21 | I/O — User I/O pin (bank 0) |
| Broche 22 | I/O — User I/O pin (bank 0) |
| Broche 23 | I/O — User I/O pin (bank 0) |
| Broche 24 | I/O — User I/O pin (bank 0) |
| Broche 25 | I/O — User I/O pin (bank 0) |
| Broche 26 | I/O — User I/O pin (bank 0) |
| Broche 27 | I/O — User I/O pin (bank 0) |
| Broche 28 | GND — Ground |
| Broche 29 | I/O — User I/O pin (bank 1) |
| Broche 30 | I/O — User I/O pin (bank 1) |
| Broche 31 | I/O — User I/O pin (bank 1) |
| Broche 32 | I/O — User I/O pin (bank 1) |
| Broche 33 | I/O — User I/O pin (bank 1) |
| Broche 34 | I/O — User I/O pin (bank 1) |
| Broche 35 | VCCO — Output supply voltage for bank 1 |
| Broche 36 | I/O — User I/O pin (bank 1) |
| Broche 37 | I/O — User I/O pin (bank 1) |
| Broche 38 | I/O — User I/O pin (bank 1) |
| Broche 39 | I/O — User I/O pin (bank 1) |
| Broche 40 | I/O — User I/O pin (bank 1) |
| Broche 41 | I/O — User I/O pin (bank 1) |
| Broche 42 | I/O — User I/O pin (bank 1) |
| Broche 43 | GND — Ground |
| Broche 44 | I/O — User I/O pin (bank 1) |
| Broche 45 | I/O — User I/O pin (bank 1) |
| Broche 46 | I/O — User I/O pin (bank 1) |
| Broche 47 | I/O — User I/O pin (bank 1) |
| Broche 48 | I/O — User I/O pin (bank 1) |
| Broche 49 | VCC — Core 5V supply |
| Broche 50 | I/O — User I/O pin (bank 1) |
| Broche 51 | I/O — User I/O pin (bank 1) |
| Broche 52 | I/O — User I/O pin (bank 1) |
| Broche 53 | I/O — User I/O pin (bank 1) |
| Broche 54 | I/O — User I/O pin (bank 1) |
| Broche 55 | I/O — User I/O pin (bank 1) |
| Broche 56 | GND — Ground |
| Broche 57 | I/O — User I/O pin (bank 2) |
| Broche 58 | I/O — User I/O pin (bank 2) |
| Broche 59 | I/O — User I/O pin (bank 2) |
| Broche 60 | I/O — User I/O pin (bank 2) |
| Broche 61 | I/O — User I/O pin (bank 2) |
| Broche 62 | I/O — User I/O pin (bank 2) |
| Broche 63 | VCCO — Output supply voltage for bank 2 |
| Broche 64 | I/O — User I/O pin (bank 2) |
| Broche 65 | I/O — User I/O pin (bank 2) |
| Broche 66 | I/O — User I/O pin (bank 2) |
| Broche 67 | I/O — User I/O pin (bank 2) |
| Broche 68 | I/O — User I/O pin (bank 2) |
| Broche 69 | I/O — User I/O pin (bank 2) |
| Broche 70 | GND — Ground |
| Broche 71 | I/O — User I/O pin (bank 2) |
| Broche 72 | I/O — User I/O pin (bank 2) |
| Broche 73 | I/O — User I/O pin (bank 2) |
| Broche 74 | I/O — User I/O pin (bank 2) |
| Broche 75 | I/O — User I/O pin (bank 2) |
| Broche 76 | I/O — User I/O pin (bank 2) |
| Broche 77 | VCC — Core 5V supply |
| Broche 78 | I/O — User I/O pin (bank 2) |
| Broche 79 | I/O — User I/O pin (bank 2) |
| Broche 80 | I/O — User I/O pin (bank 2) |
| Broche 81 | I/O — User I/O pin (bank 2) |
| Broche 82 | I/O — User I/O pin (bank 2) |
| Broche 83 | GND — Ground |
| Broche 84 | I/O — User I/O pin (bank 3) |
| Broche 85 | I/O — User I/O pin (bank 3) |
| Broche 86 | I/O — User I/O pin (bank 3) |
| Broche 87 | I/O — User I/O pin (bank 3) |
| Broche 88 | I/O — User I/O pin (bank 3) |
| Broche 89 | I/O — User I/O pin (bank 3) |
| Broche 90 | VCCO — Output supply voltage for bank 3 |
| Broche 91 | I/O — User I/O pin (bank 3) |
| Broche 92 | I/O — User I/O pin (bank 3) |
| Broche 93 | I/O — User I/O pin (bank 3) |
| Broche 94 | I/O — User I/O pin (bank 3) |
| Broche 95 | I/O — User I/O pin (bank 3) |
| Broche 96 | I/O — User I/O pin (bank 3) |
| Broche 97 | GND — Ground |
| Broche 98 | I/O — User I/O pin (bank 3) |
| Broche 99 | I/O — User I/O pin (bank 3) |
| Broche 100 | I/O — User I/O pin (bank 3) |
| Broche 101 | I/O — User I/O pin (bank 3) |
| Broche 102 | I/O — User I/O pin (bank 3) |
| Broche 103 | I/O — User I/O pin (bank 3) |
| Broche 104 | VCC — Core 5V supply |
| Broche 105 | I/O — User I/O pin (bank 3) |
| Broche 106 | I/O — User I/O pin (bank 3) |
| Broche 107 | I/O — User I/O pin (bank 3) |
| Broche 108 | I/O — User I/O pin (bank 3) |
| Broche 109 | I/O — User I/O pin (bank 3) |
| Broche 110 | GND — Ground |
| Broche 111 | I/O — User I/O pin (bank 4) |
| Broche 112 | I/O — User I/O pin (bank 4) |
| Broche 113 | I/O — User I/O pin (bank 4) |
| Broche 114 | I/O — User I/O pin (bank 4) |
| Broche 115 | I/O — User I/O pin (bank 4) |
| Broche 116 | I/O — User I/O pin (bank 4) |
| Broche 117 | VCCO — Output supply voltage for bank 4 |
| Broche 118 | I/O — User I/O pin (bank 4) |
| Broche 119 | I/O — User I/O pin (bank 4) |
| Broche 120 | I/O — User I/O pin (bank 4) |
| Broche 121 | I/O — User I/O pin (bank 4) |
| Broche 122 | I/O — User I/O pin (bank 4) |
| Broche 123 | GND — Ground |
| Broche 124 | I/O — User I/O pin (bank 4) |
| Broche 125 | I/O — User I/O pin (bank 4) |
| Broche 126 | I/O — User I/O pin (bank 4) |
| Broche 127 | I/O — User I/O pin (bank 4) |
| Broche 128 | I/O — User I/O pin (bank 4) |
| Broche 129 | I/O — User I/O pin (bank 4) |
| Broche 130 | VCC — Core 5V supply |
| Broche 131 | I/O — User I/O pin (bank 4) |
| Broche 132 | I/O — User I/O pin (bank 4) |
| Broche 133 | I/O — User I/O pin (bank 4) |
| Broche 134 | I/O — User I/O pin (bank 4) |
| Broche 135 | GND — Ground |
| Broche 136 | I/O — User I/O pin (bank 5) |
| Broche 137 | I/O — User I/O pin (bank 5) |
| Broche 138 | I/O — User I/O pin (bank 5) |
| Broche 139 | I/O — User I/O pin (bank 5) |
| Broche 140 | I/O — User I/O pin (bank 5) |
| Broche 141 | I/O — User I/O pin (bank 5) |
| Broche 142 | VCCO — Output supply voltage for bank 5 |
| Broche 143 | I/O — User I/O pin (bank 5) |
| Broche 144 | I/O — User I/O pin (bank 5) |
| Broche 145 | I/O — User I/O pin (bank 5) |
| Broche 146 | I/O — User I/O pin (bank 5) |
| Broche 147 | I/O — User I/O pin (bank 5) |
| Broche 148 | I/O — User I/O pin (bank 5) |
| Broche 149 | GND — Ground |
| Broche 150 | I/O — User I/O pin (bank 5) |
| Broche 151 | I/O — User I/O pin (bank 5) |
| Broche 152 | I/O — User I/O pin (bank 5) |
| Broche 153 | I/O — User I/O pin (bank 5) |
| Broche 154 | I/O — User I/O pin (bank 5) |
| Broche 155 | I/O — User I/O pin (bank 5) |
| Broche 156 | VCC — Core 5V supply |
| Broche 157 | I/O — User I/O pin (bank 5) |
| Broche 158 | I/O — User I/O pin (bank 5) |
| Broche 159 | I/O — User I/O pin (bank 5) |
| Broche 160 | I/O — User I/O pin (bank 5) |
| Broche 161 | GND — Ground |
| Broche 162 | INIT — Initialization signal / configuration status (active low) |
| Broche 163 | DONE — Configuration complete indicator (active high open-drain) |
| Broche 164 | CCLK — Configuration clock input |
| Broche 165 | DIN — Serial configuration data input |
| Broche 166 | DOUT — Serial configuration data output (daisy-chain) |
| Broche 167 | M0 — Configuration mode select bit 0 |
| Broche 168 | M1 — Configuration mode select bit 1 |
| Broche 169 | M2 — Configuration mode select bit 2 |
| Broche 170 | TDI — JTAG test data input |
| Broche 171 | TDO — JTAG test data output |
| Broche 172 | TMS — JTAG test mode select |
| Broche 173 | TCK — JTAG test clock |
| Broche 174 | PROGRAM — Active-low configuration reset |
| Broche 175 | XTL1 — Crystal oscillator pin 1 (or clock input) |
| Broche 176 | XTL2 — Crystal oscillator pin 2 (leave open if external clock used) |
Applications typiques
XC3090L-8TQ176I convient pour 6 applications: Industrial Control Glue Logic, Legacy Telecom Backplane Interface, Military and Aerospace Retrofit Boards, Educational Laboratory Trainers, ASIC Prototype Bridge Logic, Test and Measurement Front Ends.
Industrial Control Glue Logic
The XC3090L-8TQ176I's 320 CLBs and 144 user I/Os make it well suited for industrial control glue logic where 5V TTL-compatible signalling must interface with legacy microcontrollers, opto-isolated inputs, and 24V relay drivers. Its 80 MHz maximum clock and 6.7 ns CLB delay comfortably meet typical PLC scan-cycle budgets of 1-10 MHz. The industrial temperature grade (-40C to +85C) ensures operation on factory floors, while the volatile SRAM configuration allows last-minute firmware updates over JTAG during commissioning.
Recommandé
Legacy Telecom Backplane Interface
Telecom backplanes built in the mid-1990s often route 5V TTL signalling between line cards, and the XC3090L-8TQ176I was a popular glue-logic choice for protocol bridging, clock distribution, and alarm aggregation. Its 144 I/Os in the TQ176 footprint are sufficient for 8-bit-wide parallel buses plus chip selects and interrupt lines, while the 80 MHz clock supports E1/T1 framing at 2.048 MHz. Telecom maintenance programs now use this part to extend the service life of installed equipment rather than redesigning entire shelves.
Recommandé
Military and Aerospace Retrofit Boards
Defense and aerospace platforms with multi-decade service lives frequently retrofit avionics, radar signal conditioning, and secure-communication subsystems using legacy Xilinx XC3000 parts. The XC3090L-8TQ176I's industrial temperature grade, ceramic-friendly TQFP footprint, and documented timing closure behaviour (6.7 ns CLB delay) make it a low-risk replacement when a board fails and the original BOM must be honoured. Engineers maintain bitstream libraries so the new device uses identical place-and-route databases as the fielded hardware.
Recommandé
Educational Laboratory Trainers
University digital-logic and computer-architecture laboratories continue to use the XC3090L-8TQ176I on FPGA trainer boards because the XACT development system runs on legacy Windows and DOS environments that students learn without licensing fees. The 5000-gate capacity accommodates 8-bit CPUs, simple VGA controllers, and UART peripherals - all within reach of a single semester project. Its 5V I/O tolerance also lets students interface directly with classic 74-series TTL without level shifters.
Recommandé
ASIC Prototype Bridge Logic
Before committing to a gate-array ASIC, design teams frequently use the XC3090L-8TQ176I as a prototype vehicle for glue logic that will eventually move into the ASIC's standard-cell library. The 320 CLBs and 80 MHz clock provide a realistic timing baseline, and the JTAG port allows in-system reconfiguration as the design iterates. This pre-silicon prototyping stage reduces risk by validating pin-out and timing assumptions months before mask release.
Recommandé
Test and Measurement Front Ends
Bench-top instruments such as logic analyzers, protocol exercisers, and pattern generators use the XC3090L-8TQ176I for pattern sequencing, trigger logic, and front-end capture. Its 144 user I/Os accommodate up to 18 channels of 8-bit capture, while the 80 MHz clock supports 100 Mbps pattern generation when combined with an external serializer. The 5V TTL I/Os interface directly with legacy parallel-probe pods and front-panel connectors.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC3090L-8TQ176I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC3090L-8TQG176I | XC3090L-8TQ176C | XC3090L-7TQG176I | XC3090L-7TQ176I | XC3090L-6TQG176I | XC3090L-6TQ176I |
|---|---|---|---|---|---|---|---|
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Package | TQFP-176 (TQ176) | TQFP-176 (TQ176) - same | TQFP-176 (TQ176) - same | TQFP-176 (TQ176) - same | TQFP-176 (TQ176) - same | TQFP-176 (TQ176) - same | TQFP-176 (TQ176) - same |
| Speed Grade | -8 | -8 (same) | -8 (same) | -7 (slower) | -7 (slower) | -6 (slowest) | -6 (slowest) |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) |
| Lead Finish | SnPb (standard) | Pb-free (G suffix) | SnPb (standard) | Pb-free (G suffix) | SnPb (standard) | Pb-free (G suffix) | SnPb (standard) |
| Logic Cells (CLBs) | 320 | 320 (same) | 320 (same) | 320 (same) | 320 (same) | 320 (same) | 320 (same) |
| Maximum Clock Frequency | 80 MHz | 80 MHz (same) | 80 MHz (same) | ~70 MHz (slower) | ~70 MHz (slower) | ~60 MHz (slowest) | ~60 MHz (slowest) |
| Combinatorial CLB Delay | 6.7 ns | 6.7 ns (same) | 6.7 ns (same) | ~7.5 ns (slower) | ~7.5 ns (slower) | ~9 ns (slowest) | ~9 ns (slowest) |
| User I/Os | 144 | 144 (same) | 144 (same) | 144 (same) | 144 (same) | 144 (same) | 144 (same) |
| Supply Voltage | 5 V | 5 V (same) | 5 V (same) | 5 V (same) | 5 V (same) | 5 V (same) | 5 V (same) |
Principaux différenciateurs
- Industrial temperature grade (-40C to +85C) (vs XC3090L-8TQ176C)
- Mid-tier -8 speed grade (vs XC3090L-7TQG176I)
- Highest speed within the XC3090L TQ176 industrial family (vs XC3090L-6TQG176I)
Notes de conception
The XC3090L-8TQ176I uses volatile SRAM configuration, so the bitstream is lost at every power-down. A Xilinx XC17Vxx-series configuration PROM (or microcontroller bitstream loader) is mandatory for standalone boot. Estimate: assume ~250 ms configuration time from a 1 Mbit serial PROM at the default CCLK rate; design reset circuits to hold downstream logic in reset until DONE asserts.
The TQFP-176 package has gull-wing leads on a 0.5 mm pitch with a 24x24 mm body. Provide at least four vias under the exposed center pad (if present on the -L variant) or under the device body to dissipate heat and reduce ground bounce. Place 0.1 uF decoupling capacitors within 5 mm of every VCC/VCCO pin, plus a 10 uF bulk tantalum on each supply rail.
Estimated: at maximum toggle activity (~80 MHz internal logic toggling ~50% of 320 CLBs at 5V VCC), power dissipation is approximately 0.5-1 W. The TQFP-176 with theta_JA around 35 C/W (no airflow, no heat spreader) yields a 25-35 C junction rise, well within the industrial 85 C limit. For sealed enclosures, derate by 30% and verify with a thermocouple.
Informations de conformité
Standard (non-G) suffix parts use SnPb lead finish. For Pb-free assembly, choose the -G variants (XC3090L-8TQG176I). The XC3000 family predates AEC-Q100, so this part is not qualified for automotive safety applications.