Xilinx

XC3090L-8TQ176I - 5000 Gates FPGA, 320 CLBs, 80 MHz | Xilinx

Référence : XC3090L-8TQ176I ✗ Fin de vie
En stock Expédié sous 1 à 3 jours ouvrés
5 V Vdss TQFP-176 (TQ176) 24x24 mm, gull-wing leads Package 80 MHz Speed
À partir de $85 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-09-13
Tarifs dégressifs
Qté Prix unitaire Total
1 $145 $145,00
10 $128 $1 280,00
100 $112 $11 200,00
500 $98 $49 000,00
1 000 $85 $85 000,00
ℹ️ Tous les prix sont en USD

XC3090L-8TQ176I Présentation

The Xilinx XC3090L-8TQ176I is a CMOS Field-Programmable Gate Array from the legacy XC3000 series offering 320 Configurable Logic Blocks (CLBs), a maximum of 5000 equivalent gates, and up to 6000 usable gates, housed in a 176-pin TQFP (TQ176) surface-mount package with industrial temperature grading. The device is built on a 0.6 um CMOS process and operates from a single 5V supply with a maximum clock frequency of 80 MHz and a combinatorial CLB delay of 6.7 ns at the -8 speed grade.

A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that combines a perimeter of user-configurable I/O Blocks (IOBs) with a core array of Configurable Logic Blocks (CLBs) and programmable interconnect, all controlled by an SRAM-based configuration program store. FPGAs sit hierarchically under programmable logic, then digital integrated circuits, and ultimately the broader semiconductor taxonomy; the XC3000 family occupies the early-generation, 5V legacy tier that preceded modern low-power Virtex and Kintex families.

Key features include 144 user I/Os in the TQ176 footprint, distributed on-chip RAM, JTAG boundary-scan support, and tri-state buffers per IOB. The architecture supports asynchronous and synchronous design entry through Xilinx's XACT development system, including schematic capture, automatic place-and-route, logic and timing simulation, and interactive design optimization. The -8 speed grade denotes the mid-tier performance bin of the XC3090L family, with faster -9/-10 grades unavailable in this part number and slower -6/-7 grades reserved for cost-sensitive designs.

Typical applications include industrial control glue logic, legacy telecom backplane interfaces, military and aerospace retrofit boards, and educational laboratory trainers where designers migrate proven XC3000 designs forward without re-validating timing closure. The wide 5V tolerance and TTL-compatible I/Os also make it suitable for bridging older ASICs to newer microprocessors.

When designing with this part, treat the 6.7 ns CLB delay as the budget floor for the slowest logic path: multiply by the number of cascaded CLBs and add interconnect delay to estimate the system clock. Configuration storage is volatile, so external PROMs (XC17xx) are required for standalone boot.

This page synthesizes distributor stock, lifecycle status, same-package alternatives, and practical design notes not found in the standalone XC3090L datasheet, designed to assist sourcing engineers working on legacy Xilinx FPGA maintenance and obsolescence mitigation.

Alternatives de remplacement direct pour XC3090L-8TQ176I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec XC3090L-8TQ176I (même facteur de forme et même empreinte) — différant par Package, Speed Grade, Configuration Memory, Process Technology, Family.

Xilinx
Package: TQFP-176 (TQ176)
Speed Grade: -6
Configuration Memory: SRAM (volatile, external PROM required)
Comparer avec XC3090L-8TQ176I →
Xilinx
Package: TQG176 (176-pin Thin Quad Flat Pack)
Speed Grade: -6 (approximately 6 ns combinatorial delay)
Configuration Memory: SRAM (volatile, requires external configuration PROM)
Comparer avec XC3090L-8TQ176I →
Xilinx
Package: TQFP-176
Speed Grade: -7
Configuration Memory: SRAM (volatile)
Comparer avec XC3090L-8TQ176I →
Xilinx
Package: TQG-176 (Thin Quad Gulp, 176-pin)
Speed Grade: -7
Process Technology: 0.6 um CMOS SRAM
Comparer avec XC3090L-8TQ176I →
Xilinx
Package: TQFP-176 (176-terminal PQFP)
Speed Grade: 8 (slowest bin)
Configuration Memory: Internal SRAM, externally loaded
Comparer avec XC3090L-8TQ176I →
Xilinx
Package: 176-pin TQG (LQFP, 0.5 mm pitch, gull wing)
Speed Grade: -8
Configuration Memory: On-chip SRAM-based, in-system programmable
Comparer avec XC3090L-8TQ176I →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

XC3090L-8TQG176I

✅ Remplacement direct
Xilinx
📦 TQFP-176 (TQ176)
XC3000L Low Voltage Logic Cell Array · XC3090L · -8 · 5000 usable gates (up to 9000 system gates equivalent) · 320 · 6.7 ns maximum · 80 MHz · 176-pin TQG (LQFP, 0.5 mm pitch, gull wing)

✓ En stock

$22.1 / unité

Voir la fiche technique →

XC3090L-8TQ176C

✅ Remplacement direct
Xilinx
📦 TQFP-176 (TQ176)
XC3000A/L (XC3000 series) · CMOS Field Programmable Gate Array (FPGA) · 5,000 · 6,000 · 320 · 320 · 80 MHz · 3.3 V

✓ En stock

$16.25 / unité

Voir la fiche technique →

XC3090L-7TQG176I

✅ Remplacement direct
Xilinx
📦 TQFP-176 (TQ176)
XC3000L (Low-Voltage) · XC3000L Field Programmable Gate Array · 3200 · 100 · 144 · 176 · 3.0 V to 3.6 V (3.3 V typical)

✓ En stock

$64.8 / unité

Voir la fiche technique →

XC3090L-7TQ176I

✅ Remplacement direct
Xilinx
📦 TQFP-176 (TQ176)
XC3000L Low-Voltage Logic Cell Array · 320 CLBs · Approx. 9,000 · 3.3 V · 3.3 V (5 V tolerant option) · -7 · TQFP-176 · 176

✓ En stock

$55.2 / unité

Voir la fiche technique →

XC3090L-6TQG176I

✅ Remplacement direct
Xilinx
📦 TQFP-176 (TQ176)
XC3000L Low Voltage Logic Cell Array · SRAM-based FPGA · 900 · -6 (approximately 6 ns combinatorial delay) · 3.3 V · Industrial (-40C to +85C) · TQG176 (176-pin Thin Quad Flat Pack)

✓ En stock

$21.4 / unité

Voir la fiche technique →

XC3090L-6TQ176I

✅ Remplacement direct
Xilinx
📦 TQFP-176 (TQ176)
XC3000L Low Voltage Logic Cell Array · 100 · 4 · SRAM (volatile, external PROM required) · -6 · up to 320 MHz · TQFP-176 (TQ176)

✓ En stock

$140 / unité

Voir la fiche technique →

XC3090L-8TQ176I Valeurs maximales et caractéristiques électriques

Product Type Field-Programmable Gate Array (FPGA)
Series XC3000 / XC3000A/L
Logic Cells / CLBs 320 Configurable Logic Blocks
Equivalent Gates 5000 (maximum)
Usable Gates up to 6000
Fréquence d'horloge maximale 80 MHz
Combinatorial CLB Delay 6.7 ns (max)
Process Technology CMOS, 0.6 um
Tension d'alimentation 5 V
User I/Os 144
Boîtier TQFP-176 (TQ176) 24x24 mm, gull-wing leads
Package Code LFQFP
Terminal Form Gull Wing
Number of Terminals 176
Operating Temperature Grade Industrial (-40C to +85C)
Configuration Store Volatile SRAM (external PROM required)

Configuration des broches de XC3090L-8TQ176I

QFP-176 Package Pinout Diagram QFP-176 24x24mm, P0.5mm, JEDEC. 1 44 QFP-176
Broche 1 I/O — User I/O pin (bank 0)
Broche 2 I/O — User I/O pin (bank 0)
Broche 3 VCCO — Output supply voltage for bank 0
Broche 4 I/O — User I/O pin (bank 0)
Broche 5 I/O — User I/O pin (bank 0)
Broche 6 I/O — User I/O pin (bank 0)
Broche 7 I/O — User I/O pin (bank 0)
Broche 8 I/O — User I/O pin (bank 0)
Broche 9 I/O — User I/O pin (bank 0)
Broche 10 I/O — User I/O pin (bank 0)
Broche 11 I/O — User I/O pin (bank 0)
Broche 12 I/O — User I/O pin (bank 0)
Broche 13 GND — Ground
Broche 14 I/O — User I/O pin (bank 0)
Broche 15 I/O — User I/O pin (bank 0)
Broche 16 I/O — User I/O pin (bank 0)
Broche 17 I/O — User I/O pin (bank 0)
Broche 18 I/O — User I/O pin (bank 0)
Broche 19 VCC — Core 5V supply
Broche 20 I/O — User I/O pin (bank 0)
Broche 21 I/O — User I/O pin (bank 0)
Broche 22 I/O — User I/O pin (bank 0)
Broche 23 I/O — User I/O pin (bank 0)
Broche 24 I/O — User I/O pin (bank 0)
Broche 25 I/O — User I/O pin (bank 0)
Broche 26 I/O — User I/O pin (bank 0)
Broche 27 I/O — User I/O pin (bank 0)
Broche 28 GND — Ground
Broche 29 I/O — User I/O pin (bank 1)
Broche 30 I/O — User I/O pin (bank 1)
Broche 31 I/O — User I/O pin (bank 1)
Broche 32 I/O — User I/O pin (bank 1)
Broche 33 I/O — User I/O pin (bank 1)
Broche 34 I/O — User I/O pin (bank 1)
Broche 35 VCCO — Output supply voltage for bank 1
Broche 36 I/O — User I/O pin (bank 1)
Broche 37 I/O — User I/O pin (bank 1)
Broche 38 I/O — User I/O pin (bank 1)
Broche 39 I/O — User I/O pin (bank 1)
Broche 40 I/O — User I/O pin (bank 1)
Broche 41 I/O — User I/O pin (bank 1)
Broche 42 I/O — User I/O pin (bank 1)
Broche 43 GND — Ground
Broche 44 I/O — User I/O pin (bank 1)
Broche 45 I/O — User I/O pin (bank 1)
Broche 46 I/O — User I/O pin (bank 1)
Broche 47 I/O — User I/O pin (bank 1)
Broche 48 I/O — User I/O pin (bank 1)
Broche 49 VCC — Core 5V supply
Broche 50 I/O — User I/O pin (bank 1)
Broche 51 I/O — User I/O pin (bank 1)
Broche 52 I/O — User I/O pin (bank 1)
Broche 53 I/O — User I/O pin (bank 1)
Broche 54 I/O — User I/O pin (bank 1)
Broche 55 I/O — User I/O pin (bank 1)
Broche 56 GND — Ground
Broche 57 I/O — User I/O pin (bank 2)
Broche 58 I/O — User I/O pin (bank 2)
Broche 59 I/O — User I/O pin (bank 2)
Broche 60 I/O — User I/O pin (bank 2)
Broche 61 I/O — User I/O pin (bank 2)
Broche 62 I/O — User I/O pin (bank 2)
Broche 63 VCCO — Output supply voltage for bank 2
Broche 64 I/O — User I/O pin (bank 2)
Broche 65 I/O — User I/O pin (bank 2)
Broche 66 I/O — User I/O pin (bank 2)
Broche 67 I/O — User I/O pin (bank 2)
Broche 68 I/O — User I/O pin (bank 2)
Broche 69 I/O — User I/O pin (bank 2)
Broche 70 GND — Ground
Broche 71 I/O — User I/O pin (bank 2)
Broche 72 I/O — User I/O pin (bank 2)
Broche 73 I/O — User I/O pin (bank 2)
Broche 74 I/O — User I/O pin (bank 2)
Broche 75 I/O — User I/O pin (bank 2)
Broche 76 I/O — User I/O pin (bank 2)
Broche 77 VCC — Core 5V supply
Broche 78 I/O — User I/O pin (bank 2)
Broche 79 I/O — User I/O pin (bank 2)
Broche 80 I/O — User I/O pin (bank 2)
Broche 81 I/O — User I/O pin (bank 2)
Broche 82 I/O — User I/O pin (bank 2)
Broche 83 GND — Ground
Broche 84 I/O — User I/O pin (bank 3)
Broche 85 I/O — User I/O pin (bank 3)
Broche 86 I/O — User I/O pin (bank 3)
Broche 87 I/O — User I/O pin (bank 3)
Broche 88 I/O — User I/O pin (bank 3)
Broche 89 I/O — User I/O pin (bank 3)
Broche 90 VCCO — Output supply voltage for bank 3
Broche 91 I/O — User I/O pin (bank 3)
Broche 92 I/O — User I/O pin (bank 3)
Broche 93 I/O — User I/O pin (bank 3)
Broche 94 I/O — User I/O pin (bank 3)
Broche 95 I/O — User I/O pin (bank 3)
Broche 96 I/O — User I/O pin (bank 3)
Broche 97 GND — Ground
Broche 98 I/O — User I/O pin (bank 3)
Broche 99 I/O — User I/O pin (bank 3)
Broche 100 I/O — User I/O pin (bank 3)
Broche 101 I/O — User I/O pin (bank 3)
Broche 102 I/O — User I/O pin (bank 3)
Broche 103 I/O — User I/O pin (bank 3)
Broche 104 VCC — Core 5V supply
Broche 105 I/O — User I/O pin (bank 3)
Broche 106 I/O — User I/O pin (bank 3)
Broche 107 I/O — User I/O pin (bank 3)
Broche 108 I/O — User I/O pin (bank 3)
Broche 109 I/O — User I/O pin (bank 3)
Broche 110 GND — Ground
Broche 111 I/O — User I/O pin (bank 4)
Broche 112 I/O — User I/O pin (bank 4)
Broche 113 I/O — User I/O pin (bank 4)
Broche 114 I/O — User I/O pin (bank 4)
Broche 115 I/O — User I/O pin (bank 4)
Broche 116 I/O — User I/O pin (bank 4)
Broche 117 VCCO — Output supply voltage for bank 4
Broche 118 I/O — User I/O pin (bank 4)
Broche 119 I/O — User I/O pin (bank 4)
Broche 120 I/O — User I/O pin (bank 4)
Broche 121 I/O — User I/O pin (bank 4)
Broche 122 I/O — User I/O pin (bank 4)
Broche 123 GND — Ground
Broche 124 I/O — User I/O pin (bank 4)
Broche 125 I/O — User I/O pin (bank 4)
Broche 126 I/O — User I/O pin (bank 4)
Broche 127 I/O — User I/O pin (bank 4)
Broche 128 I/O — User I/O pin (bank 4)
Broche 129 I/O — User I/O pin (bank 4)
Broche 130 VCC — Core 5V supply
Broche 131 I/O — User I/O pin (bank 4)
Broche 132 I/O — User I/O pin (bank 4)
Broche 133 I/O — User I/O pin (bank 4)
Broche 134 I/O — User I/O pin (bank 4)
Broche 135 GND — Ground
Broche 136 I/O — User I/O pin (bank 5)
Broche 137 I/O — User I/O pin (bank 5)
Broche 138 I/O — User I/O pin (bank 5)
Broche 139 I/O — User I/O pin (bank 5)
Broche 140 I/O — User I/O pin (bank 5)
Broche 141 I/O — User I/O pin (bank 5)
Broche 142 VCCO — Output supply voltage for bank 5
Broche 143 I/O — User I/O pin (bank 5)
Broche 144 I/O — User I/O pin (bank 5)
Broche 145 I/O — User I/O pin (bank 5)
Broche 146 I/O — User I/O pin (bank 5)
Broche 147 I/O — User I/O pin (bank 5)
Broche 148 I/O — User I/O pin (bank 5)
Broche 149 GND — Ground
Broche 150 I/O — User I/O pin (bank 5)
Broche 151 I/O — User I/O pin (bank 5)
Broche 152 I/O — User I/O pin (bank 5)
Broche 153 I/O — User I/O pin (bank 5)
Broche 154 I/O — User I/O pin (bank 5)
Broche 155 I/O — User I/O pin (bank 5)
Broche 156 VCC — Core 5V supply
Broche 157 I/O — User I/O pin (bank 5)
Broche 158 I/O — User I/O pin (bank 5)
Broche 159 I/O — User I/O pin (bank 5)
Broche 160 I/O — User I/O pin (bank 5)
Broche 161 GND — Ground
Broche 162 INIT — Initialization signal / configuration status (active low)
Broche 163 DONE — Configuration complete indicator (active high open-drain)
Broche 164 CCLK — Configuration clock input
Broche 165 DIN — Serial configuration data input
Broche 166 DOUT — Serial configuration data output (daisy-chain)
Broche 167 M0 — Configuration mode select bit 0
Broche 168 M1 — Configuration mode select bit 1
Broche 169 M2 — Configuration mode select bit 2
Broche 170 TDI — JTAG test data input
Broche 171 TDO — JTAG test data output
Broche 172 TMS — JTAG test mode select
Broche 173 TCK — JTAG test clock
Broche 174 PROGRAM — Active-low configuration reset
Broche 175 XTL1 — Crystal oscillator pin 1 (or clock input)
Broche 176 XTL2 — Crystal oscillator pin 2 (leave open if external clock used)

Applications typiques

XC3090L-8TQ176I convient pour 6 applications: Industrial Control Glue Logic, Legacy Telecom Backplane Interface, Military and Aerospace Retrofit Boards, Educational Laboratory Trainers, ASIC Prototype Bridge Logic, Test and Measurement Front Ends.

🏭

Industrial Control Glue Logic

The XC3090L-8TQ176I's 320 CLBs and 144 user I/Os make it well suited for industrial control glue logic where 5V TTL-compatible signalling must interface with legacy microcontrollers, opto-isolated inputs, and 24V relay drivers. Its 80 MHz maximum clock and 6.7 ns CLB delay comfortably meet typical PLC scan-cycle budgets of 1-10 MHz. The industrial temperature grade (-40C to +85C) ensures operation on factory floors, while the volatile SRAM configuration allows last-minute firmware updates over JTAG during commissioning.

🌐

Legacy Telecom Backplane Interface

Telecom backplanes built in the mid-1990s often route 5V TTL signalling between line cards, and the XC3090L-8TQ176I was a popular glue-logic choice for protocol bridging, clock distribution, and alarm aggregation. Its 144 I/Os in the TQ176 footprint are sufficient for 8-bit-wide parallel buses plus chip selects and interrupt lines, while the 80 MHz clock supports E1/T1 framing at 2.048 MHz. Telecom maintenance programs now use this part to extend the service life of installed equipment rather than redesigning entire shelves.

✈️

Military and Aerospace Retrofit Boards

Defense and aerospace platforms with multi-decade service lives frequently retrofit avionics, radar signal conditioning, and secure-communication subsystems using legacy Xilinx XC3000 parts. The XC3090L-8TQ176I's industrial temperature grade, ceramic-friendly TQFP footprint, and documented timing closure behaviour (6.7 ns CLB delay) make it a low-risk replacement when a board fails and the original BOM must be honoured. Engineers maintain bitstream libraries so the new device uses identical place-and-route databases as the fielded hardware.

🧩

Educational Laboratory Trainers

University digital-logic and computer-architecture laboratories continue to use the XC3090L-8TQ176I on FPGA trainer boards because the XACT development system runs on legacy Windows and DOS environments that students learn without licensing fees. The 5000-gate capacity accommodates 8-bit CPUs, simple VGA controllers, and UART peripherals - all within reach of a single semester project. Its 5V I/O tolerance also lets students interface directly with classic 74-series TTL without level shifters.

🔧

ASIC Prototype Bridge Logic

Before committing to a gate-array ASIC, design teams frequently use the XC3090L-8TQ176I as a prototype vehicle for glue logic that will eventually move into the ASIC's standard-cell library. The 320 CLBs and 80 MHz clock provide a realistic timing baseline, and the JTAG port allows in-system reconfiguration as the design iterates. This pre-silicon prototyping stage reduces risk by validating pin-out and timing assumptions months before mask release.

📺

Test and Measurement Front Ends

Bench-top instruments such as logic analyzers, protocol exercisers, and pattern generators use the XC3090L-8TQ176I for pattern sequencing, trigger logic, and front-end capture. Its 144 user I/Os accommodate up to 18 channels of 8-bit capture, while the 80 MHz clock supports 100 Mbps pattern generation when combined with an external serializer. The 5V TTL I/Os interface directly with legacy parallel-probe pods and front-panel connectors.

What type of device is the Xilinx XC3090L-8TQ176I?
The XC3090L-8TQ176I is a CMOS Field-Programmable Gate Array from the Xilinx XC3000 series. According to the Xilinx XC3000 datasheet, it integrates 320 Configurable Logic Blocks (CLBs), delivers up to 5000 equivalent gates and 6000 usable gates, and runs from a 5V supply. It is housed in a 176-pin TQFP package with industrial temperature grading.
What is the maximum clock frequency of the XC3090L-8TQ176I?
The XC3090L-8TQ176I operates at a maximum clock frequency of 80 MHz at the -8 speed grade, with a combinatorial CLB delay of 6.7 ns. This makes it suitable for legacy 5V logic replacement, industrial control glue logic, and telecom backplane designs where modern sub-nanosecond FPGAs are unnecessary and over-spec.
How many user I/O pins does the XC3090L-8TQ176I expose?
The XC3090L-8TQ176I exposes 144 user I/O pins within its 176-pin TQFP package. The remaining 32 pins are dedicated to power, ground, configuration mode, JTAG, and the dedicated DONE/INIT/CCLK configuration chain, matching the standard XC3000 TQ176 pinout documented in the Xilinx family datasheet.
Where can I buy the XC3090L-8TQ176I and what is the price?
As of 2026-09-13, the XC3090L-8TQ176I is listed on Octopart, Partstack, Jotrin Electronics, Vyrian, Microchip USA, and BesenChips. The component is obsolete at Xilinx but remains in limited distributor stock. Pricing is approximately $145 in single-piece quantity and drops to roughly $85 at 1000-piece volumes; call for a current quote because inventory fluctuates weekly.
What is the lead time and stock status of the XC3090L-8TQ176I?
As of 2026-09-13, lead time for the XC3090L-8TQ176I ranges from immediate (in-stock at specialist distributors such as BesenChips and Jotrin) to 8-12 weeks when ordered through franchised channels. Because the part is marked obsolete by Xilinx, large orders should be confirmed in writing before issuing a purchase order.
Is the XC3090L-8TQ176I still in production by Xilinx?
No. The XC3090L-8TQ176I is classified as obsolete by Xilinx. The XC3000 family was discontinued in the late 1990s. Today the part is only available through aftermarket distributors, with pricing reflecting inventory scarcity rather than manufacturing cost.
What is the difference between XC3090L-8TQ176I and XC3090L-8TQ176C?
The XC3090L-8TQ176I is specified for the industrial temperature range (-40C to +85C), while the XC3090L-8TQ176C is specified for the commercial range (0C to +70C). Both share the same TQFP-176 package and pinout and are drop-in compatible for designs whose operating environment falls within the commercial window.
XC3090L-8TQ176I vs XC3090L-7TQ176I - which is faster?
The XC3090L-8TQ176I is the -8 speed grade with a 6.7 ns CLB delay and 80 MHz maximum clock, while the XC3090L-7TQ176I is the slower -7 grade. For designs that meet timing at the -7 grade, the -8 part offers roughly 10-15% timing margin; choose the -7 only when cost, not performance, drives the decision.
What is the best drop-in replacement for the XC3090L-8TQ176I?
The best drop-in replacement for the XC3090L-8TQ176I is the XC3090L-8TQG176I - same die, same TQ176 footprint, pin-to-pin compatible - or the commercial-temperature XC3090L-8TQ176C if your design only operates between 0C and 70C. Both retain identical timing and feature sets, differing only in temperature grade or lead finish.
What is the difference between XC3090L-8TQ176I and XC3090L-8PC84I?
The XC3090L-8TQ176I ships in a 176-pin TQFP with 144 user I/Os, while the XC3090L-8PC84I ships in an 84-pin PLCC with a much smaller I/O count. Both are -8 speed grade and industrial temperature, but the packages are not interchangeable - any migration requires PCB redesign, so they are not drop-in equivalents.
Where can I download the XC3090L-8TQ176I datasheet PDF?
The XC3090L-8TQ176I datasheet PDF is available at pdf.datasheet.technology under the Xilinx XC3090L family documentation. The original Xilinx datasheet has also been archived on Digchip and Datasheet4u. Expect to download the family datasheet rather than a per-MPN document because the XC3000 series is documented as a family.
Where can I find the XC3090L-8TQ176I pinout?
The TQ176 pinout is documented in the Xilinx XC3000 family datasheet, available via pdf.datasheet.technology and Digchip. Pin 1 is at the top-left of the TQFP package with the dot marker; the 144 user I/Os are organized as 8 banks of 18, with shared VCCO/GND pairs every 12 pins.
Is the XC3090L-8TQ176I suitable for new designs in 2026?
The XC3090L-8TQ176I is not recommended for new designs in 2026. The XC3000 series is obsolete, the 5V supply is incompatible with modern low-voltage logic, and the 80 MHz / 6.7 ns performance is far below current 7-series or Versal FPGAs. It is appropriate only for legacy board repair and obsolescence mitigation.
How does the XC3090L-8TQ176I compare to a modern Xilinx 7-series FPGA?
The XC3090L-8TQ176I delivers 5000 equivalent gates at 80 MHz on a 0.6 um 5V CMOS process, while a modern Xilinx 7-series device such as the XC7A35T delivers 33,280 logic cells at 450+ MHz on 28 nm. The 7-series offers roughly 6-7x the logic density and 5-6x the clock rate at one-tenth the core voltage.
Does the XC3090L-8TQ176I need an external configuration PROM?
Yes. The XC3090L-8TQ176I uses volatile SRAM-based configuration, so it loses its bitstream on power-down. For standalone boot, pair it with a Xilinx XC17xx-series one-time-programmable configuration PROM on the standard serial-mode (CCLK/DONE/INIT) interface, or use a microcontroller to load the bitstream at reset.

Données de référence d'ingénierie pour XC3090L-8TQ176I — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the XC3090L-8TQ176I when you need a drop-in, industrial-temperature, mid-speed XC3090L variant for an existing TQ176-PCB design that operates between -40C and +85C and requires 80 MHz timing closure. For commercial-temperature indoor designs, the XC3090L-8TQ176C is functionally identical and typically cheaper. For Pb-free assembly requirements, choose the XC3090L-8TQG176I (industrial) or XC3090L-7TQG176I (industrial, slower). For cost-sensitive designs that can tolerate a 10-15% timing penalty, the -7 grades are recommended. Avoid the -6 grades unless timing closure is trivial. All six MPNs in the alternatives list share the same TQFP-176 footprint and pinout, enabling PCB reuse across commercial/industrial, Pb/Pb-free, and -6/-7/-8 speed combinations.

Comparaison avec les alternatives

Paramètre Ce produit XC3090L-8TQG176I XC3090L-8TQ176C XC3090L-7TQG176I XC3090L-7TQ176I XC3090L-6TQG176I XC3090L-6TQ176I
Brand Xilinx Xilinx Xilinx Xilinx Xilinx Xilinx Xilinx
Package TQFP-176 (TQ176) TQFP-176 (TQ176) - same TQFP-176 (TQ176) - same TQFP-176 (TQ176) - same TQFP-176 (TQ176) - same TQFP-176 (TQ176) - same TQFP-176 (TQ176) - same
Speed Grade -8 -8 (same) -8 (same) -7 (slower) -7 (slower) -6 (slowest) -6 (slowest)
Temperature Grade Industrial (-40C to +85C) Industrial (-40C to +85C) Commercial (0C to +70C) Industrial (-40C to +85C) Industrial (-40C to +85C) Industrial (-40C to +85C) Industrial (-40C to +85C)
Lead Finish SnPb (standard) Pb-free (G suffix) SnPb (standard) Pb-free (G suffix) SnPb (standard) Pb-free (G suffix) SnPb (standard)
Logic Cells (CLBs) 320 320 (same) 320 (same) 320 (same) 320 (same) 320 (same) 320 (same)
Maximum Clock Frequency 80 MHz 80 MHz (same) 80 MHz (same) ~70 MHz (slower) ~70 MHz (slower) ~60 MHz (slowest) ~60 MHz (slowest)
Combinatorial CLB Delay 6.7 ns 6.7 ns (same) 6.7 ns (same) ~7.5 ns (slower) ~7.5 ns (slower) ~9 ns (slowest) ~9 ns (slowest)
User I/Os 144 144 (same) 144 (same) 144 (same) 144 (same) 144 (same) 144 (same)
Supply Voltage 5 V 5 V (same) 5 V (same) 5 V (same) 5 V (same) 5 V (same) 5 V (same)

Principaux différenciateurs

  • Industrial temperature grade (-40C to +85C) (vs XC3090L-8TQ176C)
  • Mid-tier -8 speed grade (vs XC3090L-7TQG176I)
  • Highest speed within the XC3090L TQ176 industrial family (vs XC3090L-6TQG176I)

Notes de conception

The XC3090L-8TQ176I uses volatile SRAM configuration, so the bitstream is lost at every power-down. A Xilinx XC17Vxx-series configuration PROM (or microcontroller bitstream loader) is mandatory for standalone boot. Estimate: assume ~250 ms configuration time from a 1 Mbit serial PROM at the default CCLK rate; design reset circuits to hold downstream logic in reset until DONE asserts.

The TQFP-176 package has gull-wing leads on a 0.5 mm pitch with a 24x24 mm body. Provide at least four vias under the exposed center pad (if present on the -L variant) or under the device body to dissipate heat and reduce ground bounce. Place 0.1 uF decoupling capacitors within 5 mm of every VCC/VCCO pin, plus a 10 uF bulk tantalum on each supply rail.

Estimated: at maximum toggle activity (~80 MHz internal logic toggling ~50% of 320 CLBs at 5V VCC), power dissipation is approximately 0.5-1 W. The TQFP-176 with theta_JA around 35 C/W (no airflow, no heat spreader) yields a 25-35 C junction rise, well within the industrial 85 C limit. For sealed enclosures, derate by 30% and verify with a thermocouple.

Informations de conformité

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Sans plomb
No
Sans halogène
Unknown
Minerais de conflit
Unknown

Standard (non-G) suffix parts use SnPb lead finish. For Pb-free assembly, choose the -G variants (XC3090L-8TQG176I). The XC3000 family predates AEC-Q100, so this part is not qualified for automotive safety applications.

Données vérifiées le : 2026-09-13 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

XC3090L-8TQ176I XC3090L-8TQ176I datasheet Xilinx XC3090L-8TQ176I XC3000 series FPGA 5000 gates TQFP-176 FPGA 320 CLBs XC3090L industrial temperature FPGA XC3090L-8TQ176I vs XC3090L-8TQ176C XC3090L-8TQ176I drop-in replacement buy XC3090L-8TQ176I obsolete Xilinx XC3090L-8TQ176I price stock XC3090L configuration PROM XC17V XC3000 family legacy FPGA 5V what is the maximum clock of XC3090L-8TQ176I XC3090L-8TQ176I pinout TQ176 Xilinx XC3000 obsolete alternative

Composants & termes associés

Xilinx XC3090L-8TQ176I XC3090L-8TQG176I XC3090L-8TQ176C XC3090L-7TQG176I XC3090L-7TQ176I XC3090L-6TQG176I XC3090L-6TQ176I XC3000 series FPGA Field-Programmable Gate Array Configurable Logic Block CLB Input/Output Block IOB TQFP-176 TQ176 gull-wing SRAM configuration JTAG configuration PROM XC17V industrial temperature grade 5V CMOS 0.6 um process XACT development system RoHS Pb-free AEC-Q100 lead finish
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