XC3090L-8TQG176I - 9000 Gates FPGA, 80 MHz, 176-pin LQFP | Xilinx
MPN: XC3090L-8TQG176I β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.95 | $2,895.00 |
| 250 | $25.4 | $6,350.00 |
| 500 | $22.1 | $11,050.00 |
Drop-in alternatives for XC3090L-8TQG176I β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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XC3090L-8TQG176C
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$28.75 / Unit
View Datasheet βXC3090L-7TQG176I
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View Datasheet βXC3090L-6TQG176I
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View Datasheet βXC3090L-8TQ176I
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$85 / Unit
View Datasheet βXC3090L-8TQ176C
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View Datasheet βXC3090L-8TQG176I Maximum Ratings & Electrical Characteristics
| Family | XC3000L Low Voltage Logic Cell Array |
| Device | XC3090L |
| Speed Grade | -8 |
| Logic Capacity | 5000 usable gates (up to 9000 system gates equivalent) |
| Configurable Logic Blocks (CLBs) | 320 |
| Combinatorial Delay (CLB) | 6.7 ns maximum |
| Maximum Clock Frequency | 80 MHz |
| Package | 176-pin TQG (LQFP, 0.5 mm pitch, gull wing) |
| Operating Temperature Grade | Industrial (-40C to +85C), I suffix |
| Configuration Memory | On-chip SRAM-based, in-system programmable |
| Process Technology | CMOS |
| Mounting Type | Surface Mount |
| Number of Terminals | 176 |
| Terminal Form | Gull Wing |
| Package Code | LFQFP / TQFP |
| RoHS Status | Compliant (lead-free finish varies by date code) |
XC3090L-8TQG176I Pin Configuration
| Pin 1 | I/O β User I/O pin (IOB row) |
| Pin 2 | I/O β User I/O pin (IOB row) |
| Pin 3 | I/O β User I/O pin (IOB row) |
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| Pin 12 | I/O β User I/O pin (IOB row) |
| Pin 13 | VCC β Positive supply voltage |
| Pin 14 | I/O β User I/O pin (IOB row) |
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| Pin 24 | I/O β User I/O pin (IOB row) |
| Pin 25 | GND β Ground |
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| Pin 36 | I/O β User I/O pin (IOB row) |
| Pin 37 | VCC β Positive supply voltage |
| Pin 38 | I/O β User I/O pin (IOB row) |
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| Pin 48 | I/O β User I/O pin (IOB row) |
| Pin 49 | I/O β User I/O pin (IOB row) |
| Pin 50 | GND β Ground |
| Pin 51 | I/O β User I/O pin (IOB row) |
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| Pin 62 | I/O β User I/O pin (IOB row) |
| Pin 63 | VCC β Positive supply voltage |
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| Pin 76 | GND β Ground |
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| Pin 90 | VCC β Positive supply voltage |
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| Pin 104 | GND β Ground |
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| Pin 117 | VCC β Positive supply voltage |
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| Pin 129 | I/O β User I/O pin (IOB row) |
| Pin 130 | GND β Ground |
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| Pin 144 | VCC β Positive supply voltage |
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| Pin 156 | I/O β User I/O pin (IOB row) |
| Pin 157 | GND β Ground |
| Pin 158 | I/O β User I/O pin (IOB row) |
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| Pin 170 | I/O β User I/O pin (IOB row) |
| Pin 171 | VCC β Positive supply voltage |
| Pin 172 | I/O β User I/O pin (IOB row) |
| Pin 173 | I/O β User I/O pin (IOB row) |
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| Pin 176 | I/O β User I/O pin (IOB row) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC3090L-8TQG176I is suitable for 6 applications: Industrial Control Systems, ASIC Prototyping and Emulation, Telecommunications Glue Logic, Test and Measurement Fixtures, Legacy Avionics and Defense Subsystems, Educational HDL Development.
Industrial Control Systems
The XC3090L-8TQG176I fits industrial control applications because its 320 CLBs and 5000 usable gates deliver enough logic capacity for state machines, I/O expansion, protocol bridging (Modbus, Profibus slaves), and motor-control sequencers that previously required discrete TTL glue. The industrial -40C to +85C temperature rating (I suffix) and 80 MHz / 6.7 ns timing at the -8 grade are sufficient for 10-20 kHz control loops and 1-5 MHz encoder/decoder logic. The 176-pin LQFP provides 144+ user I/Os for parallel sensor acquisition and discrete control outputs without external bus-expanders. Designers should provision JTAG boundary-scan for in-system programming and use the on-chip configuration store to support field firmware updates.
Recommended
ASIC Prototyping and Emulation
The XC3090L-8TQG176I is well suited for ASIC prototyping because it provides enough CLBs and RAM to map gate-level netlists of small-to-medium ASICs (10k-20k gate-equivalent) onto a real, in-system device before committing to mask sets. Per the Xilinx XC3000 datasheet, the symmetric CLB array, predictable long-line routing, and JTAG-based configuration let designers iterate HDL revisions in minutes, dramatically reducing non-recurring engineering cost. The 176-pin TQG package exposes JTAG, mode pins, and 144 user I/Os to map ASIC pins one-to-one. Note that FPGA-to-ASIC migration requires re-synthesis because XC3000 LUTs are coarse-grained relative to modern ASIC standard cells.
Recommended
Telecommunications Glue Logic
The XC3090L-8TQG176I fits telecom glue-logic roles including T1/E1 framer interfacing, HDLC controller interfacing, custom serial-protocol bit-stuffing, and low-speed cross-connect matrices where dedicated ASICs are not cost-justified. Its 5000 usable gates and 80 MHz operation are sufficient for byte-parallel processing at T1 (1.544 MHz) and E1 (2.048 MHz) rates with margin for framing, alarming, and slip-buffer logic. The L-suffix low-voltage core reduces power dissipation in densely packed central-office equipment, and the 176-pin LQFP allows direct bus attachment to 8-bit or 16-bit telecom backplanes. For higher-rate interfaces like E3/DS3, designers should migrate to the XC4000 family.
Recommended
Test and Measurement Fixtures
The XC3090L-8TQG176I serves well in custom test fixtures and ATE pin-electronics because it can be reconfigured per test program, eliminating the need for multiple discrete-logic boards. The 320 CLBs and 144+ user I/Os support multi-channel pattern generators, programmable timing generators, and protocol-aware stimulus/response handlers. The in-system SRAM configuration allows fixture upgrade via JTAG without replacing hardware, reducing field-service cost. The 6.7 ns CLB delay at the -8 grade is acceptable for sub-100 MHz digital test rates; pair with external comparators for analog-domain stimulus. Plan for thermal management because continuous toggling of all 144 I/Os at full toggle rate can exceed 1W dissipation.
Recommended
Legacy Avionics and Defense Subsystems
The XC3090L-8TQG176I continues to be specified in legacy avionics and defense subsystems where the design was certified decades ago and the bill of materials cannot change without expensive re-qualification. Its industrial -40C to +85C temperature rating and CMOS process have demonstrated long-term reliability in flight-control, navigation, and weapons-system line-replaceable units. The 176-pin LQFP is suitable for through-hole adapter boards on legacy backplanes. For new defense designs, however, Xilinx recommends modern radiation-tolerant FPGAs such as Virtex-5QV or Kintex UltraScale; the XC3000 family is no longer supported by current Xilinx defense-grade programs.
Recommended
Educational HDL Development
The XC3090L-8TQG176I is frequently used in university HDL labs and digital-design courses because the mature Xilinx ISE toolchain and abundant XC3000 reference designs let students focus on Verilog/VHDL fundamentals rather than fighting modern tool quirks. Per the Xilinx XC3000 datasheet, the simple island-style CLB and IOB architecture is easy to teach and reason about, making it ideal for explaining LUT mapping, carry-chain propagation, and timing-closure concepts. The 176-pin LQFP is breadboard-friendly with breakout adapters, and the JTAG configuration interface is well-documented. Note that new Vivado releases do not support XC3000, so labs must install legacy ISE 14.7.
Recommended
Recommended Products Summary
Engineering reference data for XC3090L-8TQG176I β comparison, design guidance, and compliance information.
Selection Guide
Choose XC3090L-8TQG176C for the same logic in a commercial (0-70C) environment where lower price matters more than industrial qualification. Choose XC3090L-7TQG176I or -6TQG176I when you need faster timing closure but still want a footprint-compatible part. Choose XC3090L-8TQ176I when you need a tin-lead (SnPb) finish variant for aerospace or defense solder-process compatibility. For new designs in 2026, do not choose this family - migrate to CoolRunner-II CPLD (for small glue logic), Spartan-7 FPGA (for medium-density logic), or Lattice ECP5 (for low-power FPGA) to gain active lifecycle support, modern toolchains, and stronger supply continuity.
Comparison with Alternatives
| Parameter | This Product | XC3090L-8TQG176C | XC3090L-7TQG176I | XC3090L-6TQG176I | XC3090L-8TQ176I | XC3090L-8TQ176C |
|---|---|---|---|---|---|---|
| Package | 176-pin TQG (LQFP) | 176-pin TQG (LQFP) - same | 176-pin TQG (LQFP) - same | 176-pin TQG (LQFP) - same | 176-pin TQFP - same footprint | 176-pin TQFP - same footprint |
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Speed Grade | -8 | -8 | -7 (faster) | -6 (fastest) | -8 | -8 |
| Temperature Grade | Industrial (-40C to +85C) | Commercial (0C to +70C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +70C) |
| Logic Capacity (Usable Gates) | 5000 | 5000 | 5000 | 5000 | 5000 | 5000 |
| Configurable Logic Blocks (CLBs) | 320 | 320 | 320 | 320 | 320 | 320 |
| Max Clock Frequency | 80 MHz | 80 MHz | ~100 MHz | ~110 MHz | 80 MHz | 80 MHz |
| CLB Combinatorial Delay | 6.7 ns | 6.7 ns | 5.5 ns | 4.5 ns | 6.7 ns | 6.7 ns |
| Package Finish / Suffix | TQG (lead-free) | TQG (lead-free) | TQG (lead-free) | TQG (lead-free) | TQ (SnPb or matte tin) | TQ (SnPb or matte tin) |
Key Differentiators
- Same die and footprint in faster speed grades (vs XC3090L-7TQG176I / XC3090L-6TQG176I)
- Commercial and industrial variants share footprint (vs XC3090L-8TQG176C / XC3090L-8TQ176C)
- Mature, well-documented legacy architecture (vs Modern Spartan-6/7 FPGAs)
Design Notes
The XC3090L-8TQG176I is part of the legacy XC3000 family and is no longer supported by current Xilinx Vivado releases; designers must use legacy Xilinx ISE 14.7 (or earlier) for synthesis, place-and-route, and bitstream generation. Plan toolchain setup time accordingly and verify that any IP cores (FIFOs, block RAMs, multipliers) used in the design are XC3000-compatible - many modern IP cores target Spartan-6/7 or newer families and will not fit the XC3000 LUT architecture.
Estimated: at 80 MHz with 60% toggle activity on all 144 user I/Os, the XC3090L-8TQG176I dissipates approximately 0.8-1.2W from a 5V supply (L-suffix core voltage is typically 3.3V). The 176-pin LQFP has no exposed thermal pad, so heat removal depends on the PCB copper pour connected to the GND pins. For continuous high-toggle applications, spread at least 8 GND pins across the PCB with stitched thermal vias to an internal ground plane, and consider an airflow of 100 LFM if junction temperature must stay below 100C.
The XC3090L-8TQG176I is highly pin-sensitive: multiple configuration modes (slave-serial, master-serial, JTAG, Express) are selected by sampling specific pins (M0, M1, M2) at power-up. Per the Xilinx XC3000 datasheet, these mode pins must be held stable until the INIT pin goes high, and external pull-up or pull-down resistors are required to define the boot mode. Decouple each VCC pin with a 0.1uF ceramic capacitor placed within 5mm of the pin, and add a 10uF bulk tantalum or ceramic near the package for supply-bypass margin.
Compliance Information
RoHS compliant per TQG (lead-free) suffix; the non-TQG TQ176 variants may have SnPb finish for legacy defense/aerospace processes. AEC-Q100 qualification status is unknown for automotive; consult Xilinx for defense-grade equivalents if required.
