XC3090L-8TQ176C - 6K-Gate 80MHz CMOS FPGA | Xilinx TQFP-176
MPN: XC3090L-8TQ176C ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $25.4 | $254.00 |
| 100 | $21.75 | $2,175.00 |
| 500 | $18.9 | $9,450.00 |
| 1,000 | $16.25 | $16,250.00 |
Drop-in alternatives for XC3090L-8TQ176C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC3090L-7TQ176C
✅ Drop-In✓ In Stock
$47.5 / Unit
View Datasheet →XC3090L-6TQ176C
✅ Drop-In✓ In Stock
$9.95 / Unit
View Datasheet →XC3090L-7TQG176C
✅ Drop-In✓ In Stock
$21.2 / Unit
View Datasheet →XC3090L-6TQG176C
✅ Drop-In✓ In Stock
$63 / Unit
View Datasheet →XC3090L-8TQG176C
✅ Drop-In✓ In Stock
$28.75 / Unit
View Datasheet →XC3090L-8TQ176C Maximum Ratings & Electrical Characteristics
| Family | XC3000A/L (XC3000 series) |
| Product Type | CMOS Field Programmable Gate Array (FPGA) |
| Usable Gates | 5,000 |
| Maximum Usable Gates | 6,000 |
| Configurable Logic Blocks (CLBs) | 320 |
| Logic Cells | 320 |
| Maximum Internal Frequency | 80 MHz |
| Supply Voltage (VCC) | 3.3 V |
| Process Technology | CMOS (SRAM configuration) |
| Configuration Memory | Internal SRAM, externally loaded |
| Package | TQFP-176 (176-terminal PQFP) |
| Package Code | LFQFP / TQFP |
| Terminal Pitch | 0.500 mm |
| Terminal Form | Gull Wing |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Commercial (C) |
| Speed Grade | 8 (slowest bin) |
| Boundary Scan | JTAG IEEE 1149.1-compatible |
XC3090L-8TQ176C lfqfp / tqfp Pin Configuration Guide
Complete pinout information for XC3090L-8TQ176C (lfqfp / tqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for XC3090L-8TQ176C.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC3090L-8TQ176C is suitable for 6 applications: Legacy Glue Logic Replacement, ISA-to-Local Bus Bridge Adapter, Industrial Controller Front-End, Educational FPGA Trainer Platform, Aerospace Avionics Heritage System, Military Communication Backplane Interface.
Legacy Glue Logic Replacement
The XC3090L-8TQ176C remains a fit for legacy glue-logic replacement in industrial control boards whose original schematics called for an XC3000-series FPGA. Its 320 CLBs and 80 MHz grade-8 timing handle discrete TTL/CMOS replacement tasks such as address decoding, bus arbitration, and state-machine conversion. The TQFP-176 footprint matches the original board layout, eliminating the need for respinning the PCB when repairing obsolete equipment. Designers should validate that existing bitstreams from the XC3090L-8TQ176C source continue to operate at the target clock rate after reflow.
Recommended
ISA-to-Local Bus Bridge Adapter
The XC3090L-8TQ176C's 5 V-tolerant I/O and 320-CLB capacity make it well suited to legacy ISA-to-local-bus bridge adapters in industrial PCs and test equipment. Its 3.3 V core reduces power consumption relative to the original 5 V XC3090 while maintaining compatibility with 5 V bus signaling. The 80 MHz grade-8 timing accommodates typical ISA-bus cycle times with margin, and the TQFP-176 package provides sufficient I/O count for both ISA and local-bus signals plus control glue. Configuration via master serial mode is straightforward with a standard XC17S00 PROM.
Recommended
Industrial Controller Front-End
The XC3090L-8TQ176C is commonly deployed as the front-end programmable controller in industrial automation modules where its TQFP-176 footprint and XC3000 bitstream compatibility are pre-established on the board. The 5,000-gate capacity handles sensor-multiplexing logic, PWM generation, and protocol translation to CAN or RS-485 backbones. Its commercial operating temperature grade supports factory-floor enclosure environments when paired with adequate thermal management. Replacement parts must preserve the same JTAG and SelectI/O configuration modes to avoid firmware rework.
Recommended
Educational FPGA Trainer Platform
The XC3090L-8TQ176C supports educational FPGA training boards where the Xilinx XC3000 toolchain (XACTstep) is used to teach fundamental FPGA design concepts. Its 320-CLB architecture illustrates CLB-based logic implementation without overwhelming beginners, while the TQFP-176 package exposes ample general-purpose I/O for breadboard-style peripheral attachment. Despite its obsolete status, it remains valuable for teaching labs preserving vintage design flows. Modern curricula should pair it with a Spartan-7 migration exercise.
Recommended
Aerospace Avionics Heritage System
Long-lifecycle aerospace platforms may still contain XC3090L-8TQ176C parts in heritage avionics subsystems where board redesign is prohibitively expensive. The device's commercial temperature grade is acceptable when mounted in a temperature-controlled avionics bay. Sustaining engineering teams rely on same-family drop-in parts such as the XC3090L-7TQ176C and XC3090L-8TQG176C to manage obsolescence. Configuration bitstreams remain compatible across the speed-grade family, simplifying field replacement.
Recommended
Military Communication Backplane Interface
The XC3090L-8TQ176C serves in military communication backplanes where board revisions are frozen and the XC3000 bitstream is already deployed across a fleet. Its 5 V-tolerant I/O interfaces with legacy TTL-level backplane signaling, and the 320-CLB capacity handles protocol-conversion glue logic between proprietary bus standards. The TQFP-176 footprint supports high pin-count signal fan-out without requiring PCB rework. Bitstream compatibility with all XC3090L speed grades enables flexible drop-in field replacement.
Recommended
Recommended Products Summary
Engineering reference data for XC3090L-8TQ176C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC3090L-7TQ176C | XC3090L-6TQ176C | XC3090L-7TQG176C | XC3090L-6TQG176C | XC3090L-8TQG176C |
|---|---|---|---|---|---|---|
| Package | TQFP-176 | TQFP-176 - same | TQFP-176 - same | TQFP-176 - same | TQFP-176 - same | TQFP-176 - same |
| Brand | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx | Xilinx |
| Usable Gates | 5,000 | 5,000 | 5,000 | 5,000 | 5,000 | 5,000 |
| CLBs | 320 | 320 | 320 | 320 | 320 | 320 |
| Maximum Frequency | 80 MHz (grade 8) | ~85 MHz (grade 7) | ~100 MHz (grade 6) | ~85 MHz (grade 7) | ~100 MHz (grade 6) | 80 MHz (grade 8) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Speed Grade | 8 | 7 (faster) | 6 (fastest) | 7 (faster) | 6 (fastest) | 8 (same) |
| Pb-Free Finish | No (standard SnPb) | No (standard SnPb) | No (standard SnPb) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Bitstream Compatible | Yes (XC3000 family) | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Slowest speed grade provides widest timing margin for legacy designs (vs XC3090L-6TQ176C)
- Original leaded solder finish preserves compatibility with vintage reflow profiles (vs XC3090L-8TQG176C)
- TQFP-176 commercial temperature grade suits non-extended thermal environments (vs XC3090L-8TQ176I)
Design Notes
The XC3090L-8TQ176C operates from a 3.3 V core supply (VCC) with 5 V-tolerant I/O pins. Decouple VCC with at least one 0.1 uF ceramic capacitor per VCC pin plus a single 10 uF bulk capacitor near the device. Estimated: assuming 320 CLBs fully utilized at 80 MHz, expect ICC core current in the 50-150 mA range per the XC3000 family datasheet; derate at higher junction temperatures. I/O supply (VCCIO) may be tied to 3.3 V or 5 V depending on the bus interface standard; verify against absolute-maximum ratings in the datasheet before applying.
The TQFP-176 package has a 0.500 mm pitch that requires precise PCB layout. Route signals on inner layers to escape the dense perimeter pin field, and use via-in-pad or microvia technology on inner escape traces. Maintain a continuous ground plane beneath the device to provide reference for I/O signals and to dissipate thermal load. Estimated: thermal resistance theta_JA for TQFP-176 on a 4-layer PCB with ground plane is approximately 35-45 C/W; full-power operation may require thermal vias to an internal copper pour.
Configuration mode selection must be hard-wired correctly via the M0, M1, and M2 mode pins on the XC3090L-8TQ176C. Connecting these pins to the wrong logic level will prevent the device from entering the desired configuration mode (master serial, slave serial, peripheral, or express). Additionally, ensure that the DONE pin pull-up is present and that the configuration clock (CCLK) driver matches the selected mode's timing requirements. Readback is not supported on all XC3000A/L variants; verify in the datasheet before relying on readback for in-system verification.
Compliance Information
XC3090L-8TQ176C is an obsolete legacy FPGA supplied in standard SnPb finish (lead-free=false). RoHS, REACH, halogen-free, and conflict-minerals compliance not verified from the provided distributor data; consult the manufacturer or the XAIPART procurement team for confirmation. Pb-free TQG variants (XC3090L-8TQG176C) are likely RoHS-compliant but require verification.
