XC7A100T-2FBG484I - Artix-7 FPGA, 101K Logic Cells | AMD
Référence : XC7A100T-2FBG484I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $63.38 | $63,38 |
| 10 | $58.5 | $585,00 |
| 100 | $52 | $5 200,00 |
| 500 | $47.5 | $23 750,00 |
| 1 000 | $43 | $43 000,00 |
XC7A100T-2FBG484I Présentation
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. FPGAs sit between ASICs (application-specific ICs) and microprocessors in the design hierarchy: they offer the parallelism and determinism of custom hardware with the reconfigurability of software. The Artix-7 family is optimized for the lowest power and cost at 28nm, making it a popular choice for embedded vision, software-defined radio, and industrial automation.
Key features of the XC7A100T-2FBG484I include 285 user I/Os, 4,976,640 bits of block RAM, 240 DSP slices, and support for MMCM and PLL clock management. The -2 speed grade provides a maximum clock frequency of 628 MHz, while the industrial temperature rating ensures reliable operation in harsh environments. The device supports VCCINT from 0.95V to 1.05V, enabling flexible power supply design.
Architecturally, the Artix-7 fabric is built on a 28nm high-k metal gate (HKMG) process, delivering a 50% reduction in power consumption compared to previous generations. The device integrates AMS (Analog Mixed Signal) blocks, including a 12-bit 1 MSPS ADC, for on-chip monitoring of voltage and temperature. This integration reduces external component count and simplifies board design.
Typical applications include software-defined radio, motor control, industrial Ethernet, and medical imaging. The 484-ball FBGA package provides a balanced pin count for medium-complexity designs, while the industrial temperature range makes it suitable for outdoor and automotive-adjacent deployments.
When designing with this device, ensure adequate decoupling on all power rails (VCCINT, VCCAUX, VCCO) and follow AMD's power-on sequencing guidelines to avoid latch-up. The configuration bitstream can be stored in external SPI flash or loaded via JTAG, with support for multi-boot for remote updates.
Alternatives de remplacement direct pour XC7A100T-2FBG484I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC7A100T-2FBG484I (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, DSP Slices, Package Dimensions.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC7A100T-2FGG484I
✅ Remplacement direct✓ En stock
$45.9375 / unité
Voir la fiche technique →XC7A100T-2FG484I
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XC7A100T-2FBG484C
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7A200T-2FBG484I
✅ Remplacement direct✓ En stock
$89.15 / unité
Voir la fiche technique →XC7A100T-2FBG484I Valeurs maximales et caractéristiques électriques
| Family | Artix-7 |
| Logic Cells | 101440 |
| Block RAM | 4976640 bits |
| DSP Slices | 240 |
| User I/Os | 285 |
| Fréquence d'horloge maximale | 628 MHz |
| Température de fonctionnement | -40C to +100C |
| Boîtier | 484-BBGA (FBG484) |
| Package Dimensions | 23mm x 23mm |
| Supply Voltage (VCCINT) | 0.95V to 1.05V |
| Speed Grade | -2 |
| Configuration | SRAM-based, external flash |
| Clock Management | MMCM, PLL |
| Statut RoHS | Compliant |
| Type de montage | Surface Mount |
Configuration des broches de XC7A100T-2FBG484I
| Broche A1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| Broche A2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| Broche B1 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| Broche B2 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| Broche C1 | VCCINT — Core logic supply voltage (0.95V-1.05V) |
| Broche C2 | GND — Ground |
| Broche D1 | VCCAUX — Auxiliary supply voltage (1.8V) |
| Broche D2 | VCCO_0 — I/O bank 0 supply voltage |
| Broche E1 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| Broche E2 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| Broche F1 | IO_L4P_T0 — User I/O bank 0, differential pair P |
| Broche F2 | IO_L4N_T0 — User I/O bank 0, differential pair N |
Applications typiques
XC7A100T-2FBG484I convient pour 6 applications: Software-Defined Radio, Industrial Motor Control, Medical Imaging, Industrial Ethernet, Video Processing, Aerospace & Defense.
Software-Defined Radio
The XC7A100T-2FBG484I is ideal for software-defined radio (SDR) systems due to its high DSP throughput and flexible I/O. With 240 DSP slices and 285 user I/Os, it can handle complex modulation schemes and multiple channels. The industrial temperature range ensures reliable operation in field-deployed radios. The device's 628 MHz maximum clock frequency supports high-speed ADC/DAC interfaces, while the block RAM provides buffering for continuous data streams. Designers can implement digital down-conversion, filtering, and demodulation in the FPGA fabric, reducing the load on the host processor.
Recommandé
Industrial Motor Control
The XC7A100T-2FBG484I excels in industrial motor control applications, where its 240 DSP slices enable high-speed PWM generation and FOC (Field-Oriented Control) algorithms. The 285 user I/Os provide ample connections for encoder feedback, current sensing, and gate driver signals. The device's 628 MHz clock capability allows for high-resolution PWM, improving motor efficiency and reducing torque ripple. The industrial temperature range (-40°C to +100°C) makes it suitable for factory floor environments. The FPGA's parallel processing ensures deterministic control loop timing, critical for safety-critical applications.
Recommandé
Medical Imaging
The XC7A100T-2FBG484I is well-suited for medical imaging systems, such as ultrasound and CT scanners, where high-speed data processing is essential. Its 4,976,640 bits of block RAM enable large frame buffers, while the 240 DSP slices handle image filtering and enhancement algorithms. The 285 user I/Os connect to high-speed ADCs and display interfaces. The device's 628 MHz clock capability supports real-time image processing, and the industrial temperature range ensures reliability in clinical environments. The FPGA's reconfigurability allows for algorithm updates without hardware changes, extending product lifespan.
Recommandé
Industrial Ethernet
The XC7A100T-2FBG484I is an excellent choice for industrial Ethernet switches and gateways, offering 285 user I/Os for multiple Ethernet PHY interfaces. The device's 4,976,640 bits of block RAM support large packet buffers, while the 240 DSP slices can implement QoS and traffic shaping algorithms. The 628 MHz clock capability enables line-rate forwarding, and the industrial temperature range ensures operation in harsh factory environments. The FPGA's flexibility allows for support of multiple protocols (EtherCAT, PROFINET, EtherNet/IP) on the same hardware, reducing inventory costs.
Recommandé
Video Processing
The XC7A100T-2FBG484I is ideal for video processing applications, such as video surveillance and display controllers. Its 4,976,640 bits of block RAM can store multiple video lines for scaling and filtering, while the 240 DSP slices handle color space conversion and edge detection. The 285 user I/Os connect to HDMI, LVDS, and MIPI interfaces. The device's 628 MHz clock capability supports 1080p60 video processing, and the industrial temperature range ensures reliable operation in outdoor surveillance cameras. The FPGA's parallel architecture enables real-time processing without external frame buffers.
Recommandé
Aerospace & Defense
The XC7A100T-2FBG484I is suitable for aerospace and defense applications, including radar processing and flight control systems. Its 240 DSP slices enable complex signal processing, while the 285 user I/Os connect to sensors and actuators. The industrial temperature range (-40°C to +100°C) meets the requirements for many military and avionics environments. The device's 628 MHz clock capability supports high-speed data acquisition, and the block RAM provides storage for mission data. The FPGA's reconfigurability allows for in-field updates, critical for evolving mission requirements.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7A100T-2FBG484I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7A100T-2FGG484I | XC7A100T-2FG484I | XC7A100T-2FBG484C | XC7A100T-2CSG324I |
|---|---|---|---|---|---|
| Package | 484-BBGA (FBG484) | 484-BBGA (FBG484) - same | 484-BBGA (FBG484) - same | 484-BBGA (FBG484) - same | 324-CSPBGA (CSG324) - different |
| Brand | AMD | AMD | AMD | AMD | AMD |
| Logic Cells | 101440 | 101440 | 101440 | 101440 | 101440 |
| Block RAM (bits) | 4976640 | 4976640 | 4976640 | 4976640 | 4976640 |
| DSP Slices | 240 | 240 | 240 | 240 | 240 |
| User I/Os | 285 | 285 | 285 | 285 | 210 |
| Max Clock Frequency | 628 MHz | 628 MHz | 628 MHz | 628 MHz | 628 MHz |
| Temperature Range | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C | -40C to +100C |
Principaux différenciateurs
- Industrial temperature range (vs XC7A100T-2FBG484C)
- Lead-free (RoHS) finish (vs XC7A100T-2FG484I)
- Higher logic density (vs XC7A100T-2CSG324I)
Notes de conception
The XC7A100T-2FBG484I requires multiple power rails: VCCINT (0.95V-1.05V), VCCAUX (1.8V), and VCCO (bank-specific, typically 1.8V, 2.5V, or 3.3V). Use low-dropout regulators or DC-DC converters with adequate decoupling. Place 100nF ceramic capacitors close to each power pin and a 10uF bulk capacitor per rail. Follow AMD's power-on sequencing: VCCINT first, then VCCAUX, then VCCO.
The XC7A100T-2FBG484I can dissipate significant power, especially at high utilization and clock frequencies. The FBG484 package has a thermal resistance of approximately 10-15 C/W (theta_JA) with proper airflow. For designs exceeding 2W, add a heatsink or forced-air cooling. Use thermal vias under the package to improve heat transfer to the PCB ground plane. Monitor junction temperature using the on-chip ADC to prevent overheating.
For the 484-ball FBGA package, use a 4-layer or more PCB with dedicated power and ground planes. Route high-speed signals with controlled impedance (50 ohm single-ended, 100 ohm differential). Keep trace lengths matched for differential pairs. Place configuration pins (MODE, DONE, PROGRAM_B) with pull-up resistors as specified in UG475. Ensure adequate clearance for BGA routing and use via-in-pad if necessary.
Informations de conformité
RoHS compliant per AMD product documentation. Not AEC-Q100 qualified; for automotive use, consider XA7A100T-2FGG484I.
