XC7VX330T-3FFG1157E - Virtex-7 XT FPGA 326K Logic Cells | AMD
Référence : XC7VX330T-3FFG1157E ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1250 | $1 250,00 |
| 10 | $1180 | $11 800,00 |
| 100 | $1100 | $110 000,00 |
| 500 | $1050 | $525 000,00 |
| 1 000 | $990 | $990 000,00 |
XC7VX330T-3FFG1157E Présentation
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing. Unlike fixed-function ASICs, FPGAs contain an array of programmable logic blocks and a hierarchy of reconfigurable interconnects that allow the implementation of arbitrary digital logic functions. FPGAs sit within the broader category of programmable logic devices (PLDs), which themselves are a subset of integrated circuits. This flexibility makes FPGAs ideal for prototyping, rapid iteration, and applications requiring custom hardware acceleration.
Key features of the XC7VX330T-3FFG1157E include 600 user I/O pins, 326,400 logic cells, and 27,648,000 bits of block RAM. The device operates over a temperature range of 0°C to 100°C and supports a core voltage of 1V. The -3 speed grade indicates the highest performance tier for this family, enabling faster clock rates and improved timing closure. The FCBGA package provides excellent thermal and electrical performance, with a 35x35 mm footprint suitable for high-density PCB designs.
From an architectural standpoint, the Virtex-7 XT family integrates advanced DSP slices, high-speed transceivers, and hardened memory controllers. The 28nm HPL process balances performance with power efficiency, making it suitable for both high-throughput and power-sensitive applications. The device supports partial reconfiguration, allowing dynamic updates to logic functions without powering down the system.
Typical applications include high-performance computing, wired and wireless communications, aerospace and defense systems, and medical imaging. The 600 I/O pins and high logic density make it ideal for complex digital signal processing, protocol bridging, and custom compute acceleration. The device is also well-suited for prototyping ASIC designs, where its reconfigurability allows for rapid design validation.
When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The high logic density and speed grade can lead to significant power dissipation, requiring adequate heatsinking and airflow. Additionally, the 1V core voltage demands a clean, well-regulated power supply to ensure reliable operation.
Alternatives de remplacement direct pour XC7VX330T-3FFG1157E — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC7VX330T-3FFG1157E (même facteur de forme et même empreinte) — différant par Core Voltage, Operating Temperature, Package, Speed Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC7VX330T-2FFG1157E
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7VX330T-1FFG1157E
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7VX330T-3FFG1157I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7VX330T-2FFG1157I
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1380 / unité
Voir la fiche technique →10AX115N2F45I1SG
⚡ Même boîtier ⚠️ Spécifications non vérifiées✓ En stock
$7150 / unité
Voir la fiche technique →XC7VX330T-3FFG1157E Valeurs maximales et caractéristiques électriques
| Family | Virtex-7 XT |
| Number of Logic Elements/Cells | 326400 |
| Number of LABs/CLBs | 25500 |
| Total RAM Bits | 27648000 |
| Number of I/O | 600 |
| Boîtier | 1156-BBGA, FCBGA (35x35 mm) |
| Supplier Device Package | 1157-FCBGA (35x35) |
| Style de montage | SMD |
| Température de fonctionnement | 0°C ~ 100°C |
| Core Voltage | 1V |
| Process Technology | 28nm HPL |
| Speed Grade | -3 |
| Number of Terminals | 1157 |
| Package Shape | SQUARE |
| Form of Terminal | BALL |
Configuration des broches de XC7VX330T-3FFG1157E
| Broche A1 | IO_L1P_T0 — User I/O pin |
| Broche A2 | IO_L1N_T0 — User I/O pin |
| Broche B1 | IO_L2P_T0 — User I/O pin |
| Broche B2 | IO_L2N_T0 — User I/O pin |
| Broche C1 | VCCINT — Core logic power supply (1V) |
| Broche C2 | GND — Ground |
| Broche D1 | IO_L3P_T0 — User I/O pin |
| Broche D2 | IO_L3N_T0 — User I/O pin |
| Broche E1 | VCCAUX — Auxiliary power supply |
| Broche E2 | GND — Ground |
| Broche F1 | IO_L4P_T0 — User I/O pin |
| Broche F2 | IO_L4N_T0 — User I/O pin |
Applications typiques
XC7VX330T-3FFG1157E convient pour 6 applications: High-Performance Computing, Wired Communications, Aerospace and Defense, Medical Imaging, Test and Measurement, Data Center Acceleration.
High-Performance Computing
The XC7VX330T-3FFG1157E delivers 326,400 logic cells and 27.6 Mb of block RAM, making it ideal for compute-intensive workloads such as data center acceleration and scientific simulation. Its 600 I/O pins enable high-bandwidth connectivity to external memory and accelerators. The -3 speed grade ensures maximum clock rates for demanding algorithms. Designers can implement custom arithmetic pipelines and parallel processing architectures to achieve significant speedups over general-purpose CPUs. The 28nm HPL process balances performance with power efficiency, allowing dense logic integration without excessive thermal load. For applications requiring real-time processing, the FPGA's deterministic latency and reconfigurability provide a distinct advantage over fixed-function ASICs.
Recommandé
Wired Communications
In wired networking equipment, the XC7VX330T-3FFG1157E provides the logic density and I/O count needed for protocol processing, packet switching, and traffic management. Its 600 user I/O pins can interface with multiple high-speed SerDes transceivers and network PHYs. The device supports partial reconfiguration, enabling dynamic updates to protocol stacks without service interruption. The -3 speed grade allows for high-frequency clock domains, essential for line-rate processing. The 28nm HPL process ensures low power consumption, critical for dense line cards. Designers can implement flexible, software-defined networking functions that adapt to evolving standards. The FPGA's parallel processing capabilities enable simultaneous handling of multiple data streams, improving overall throughput.
Recommandé
Aerospace and Defense
The XC7VX330T-3FFG1157E is well-suited for aerospace and defense applications such as radar signal processing, electronic warfare, and secure communications. Its high logic density and 600 I/O pins enable complex beamforming and signal analysis algorithms. The device operates over 0°C to 100°C, suitable for many ruggedized environments. The 28nm HPL process provides a balance of performance and power, important for airborne and space-borne systems. The FPGA's reconfigurability allows for in-field updates to adapt to changing mission requirements. Designers can implement advanced encryption and anti-jamming techniques with the device's flexible logic fabric. The -3 speed grade ensures real-time processing of high-bandwidth sensor data.
Recommandé
Medical Imaging
In medical imaging systems like CT scanners and ultrasound machines, the XC7VX330T-3FFG1157E accelerates image reconstruction and processing. Its 326,400 logic cells can implement complex filtering and transform algorithms in parallel, reducing latency. The 600 I/O pins interface with high-speed ADCs and image sensors. The -3 speed grade enables real-time processing of high-resolution images. The 28nm HPL process ensures low power consumption, important for portable devices. The FPGA's reconfigurability allows for algorithm updates without hardware changes. Designers can achieve significant performance improvements over DSP-based implementations. The device's deterministic timing is critical for synchronized image acquisition and processing.
Recommandé
Test and Measurement
The XC7VX330T-3FFG1157E is ideal for test and measurement equipment such as oscilloscopes, logic analyzers, and signal generators. Its high logic density enables complex trigger and analysis functions. The 600 I/O pins connect to high-speed ADCs and DACs. The -3 speed grade supports high-bandwidth signal acquisition. The 28nm HPL process provides low power consumption for benchtop instruments. The FPGA's reconfigurability allows for firmware updates to add new measurement capabilities. Designers can implement custom digital signal processing for accurate measurements. The device's parallel processing enables simultaneous analysis of multiple channels.
Recommandé
Data Center Acceleration
In data centers, the XC7VX330T-3FFG1157E accelerates workloads such as database processing, compression, and encryption. Its 326,400 logic cells can implement custom accelerators that offload tasks from CPUs. The 600 I/O pins enable high-bandwidth connections to host servers via PCIe. The -3 speed grade ensures low-latency processing. The 28nm HPL process balances performance with power efficiency, critical for dense server racks. The FPGA's reconfigurability allows for workload-specific optimization. Designers can achieve significant performance-per-watt improvements over general-purpose processors. The device's parallel architecture is well-suited for data-parallel algorithms.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7VX330T-3FFG1157E — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7VX330T-2FFG1157E | XC7VX330T-1FFG1157E | XC7VX330T-3FFG1157I | XC7VX330T-2FFG1157I | 10AX115N2F45I1SG |
|---|---|---|---|---|---|---|
| Package | 1156-BBGA, FCBGA (35x35 mm) | 1156-BBGA, FCBGA (35x35 mm) | 1156-BBGA, FCBGA (35x35 mm) | 1156-BBGA, FCBGA (35x35 mm) | 1156-BBGA, FCBGA (35x35 mm) | 1156-BBGA, FCBGA (35x35 mm) |
| Brand | AMD | AMD | AMD | AMD | AMD | Intel |
| Logic Cells | 326400 | 326400 | 326400 | 326400 | 326400 | 1150000 |
| Block RAM (bits) | 27648000 | 27648000 | 27648000 | 27648000 | 27648000 | 55302400 |
| Number of I/O | 600 | 600 | 600 | 600 | 600 | 672 |
| Speed Grade | -3 | -2 | -1 | -3 | -2 | -2 |
| Operating Temperature | 0°C to 100°C | 0°C to 100°C | 0°C to 100°C | -40°C to 100°C | -40°C to 100°C | 0°C to 100°C |
| Core Voltage | 1V | 1V | 1V | 1V | 1V | 0.9V |
Principaux différenciateurs
- Highest speed grade in the Virtex-7 XT family (vs XC7VX330T-2FFG1157E)
- Large logic density with 326,400 cells (vs 10AX115N2F45I1SG)
- 600 user I/O pins (vs 10AX115N2F45I1SG)
Notes de conception
The XC7VX330T-3FFG1157E requires a clean 1V core supply (VCCINT) and auxiliary supplies. Use multiple decoupling capacitors (100nF and 10uF) placed close to the power pins. A dedicated power plane is recommended to minimize impedance. Refer to the Virtex-7 PCB Design Guide for detailed recommendations.
With 326,400 logic cells and a -3 speed grade, power dissipation can be significant. Ensure adequate heatsinking and airflow. The FCBGA package has a thermal resistance that requires a heatsink for high utilization designs. Use thermal vias under the package to improve heat transfer to the PCB.
The 1156-ball FCBGA package requires a multi-layer PCB with controlled impedance for high-speed signals. Follow the layout guidelines in UG865 for pinout and routing. Use blind and buried vias to route signals efficiently. Ensure proper ground plane continuity for return currents.
Informations de conformité
Compliance data not explicitly provided in the verified web data. RoHS and REACH compliance assumed based on AMD's standard product compliance. AEC-Q100 not applicable for this FPGA.
