XDPE1A2G5B0000XUMA1 - 16-Phase Digital Multiphase Controller | Infineon
Référence : XDPE1A2G5B0000XUMA1 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $10.75 | $10,75 |
| 10 | $10.21 | $102,10 |
| 100 | $9.14 | $914,00 |
| 500 | $8.05 | $4 025,00 |
| 1 000 | $7.52 | $7 520,00 |
XDPE1A2G5B0000XUMA1 Présentation
What is a digital multiphase controller? A digital multiphase controller is a semiconductor device that orchestrates multiple parallel power stages (phases) to convert a higher input voltage to a tightly regulated lower output voltage for processors, ASICs, and memory. It sits in the hierarchy: multiphase controller -> DC-DC converter -> power management IC -> semiconductor. Digital controllers use firmware-configurable control loops, PMBus/SMBus telemetry, and adaptive voltage positioning to deliver faster transient response than analog controllers, while remaining programmable per rail.
Key features of the XDPE1A2G5B include up to 16 phases (dual loop, configurable as 8+8, 12+4, 16+0, etc.), per-loop digital control with adaptive transient response, integrated current and temperature sensing through the trivalent PWM interface, advanced fault detection (OVP, UVP, OCP, OTP), and PMBus 1.3.1 compliant telemetry for VOUT, IOUT, temperature, and status. The 56-pin PG-VQFN package includes an exposed thermal pad (EP) that must be soldered to a top-layer copper pour for heatsinking.
Architecturally, the device uses a 32-bit control core with on-chip non-volatile memory for configuration, dual high-resolution DPWM engines, and a per-phase current-share loop. Multi-vendor compatibility is achieved through the standard trivalent PWM protocol, allowing pairing with Infineon's OptiMOS power stages as well as third-party compliant stages. This design reduces BOM count by integrating temperature and current sense directly from the power stage, eliminating external sense elements.
Typical applications include high-current server and data-center processor rails (Intel/AMD VR13, VR14 compliant rails), telecom and networking ASIC power, DDR5 memory termination and VTT rails, GPU and AI accelerator core power, and high-end workstation voltage regulation. The dual-loop architecture also enables use cases such as powering a CPU core rail plus a separate memory/IO rail from a single controller.
When designing with the XDPE1A2G5B, follow Infineon's reference layout guidelines: a 4-layer PCB minimum with a dedicated ground plane, the exposed pad soldered to a 1 oz copper pour of at least 200 mm², and input capacitors placed within 5 mm of the power-stage inputs. Configuration firmware must be loaded via the Infineon configuration tool or compatible PMBus programmer before the rail becomes active; the device does not boot into a default operating mode without valid configuration.
This page synthesizes distributor pricing, the same-family Infineon XDPP1148 and XDPP1140 digital controllers for cross-reference, and practical layout guidance not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour XDPE1A2G5B0000XUMA1 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XDPE1A2G5B0000XUMA1 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XDPP1148100BXUMA1
✅ Remplacement direct✓ En stock
$5.25 / unité
Voir la fiche technique →XDPP1140100BXUMA1
✅ Remplacement direct✓ En stock
$4.2 / unité
Voir la fiche technique →XDPE1A2G5B-0000
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
XDPE1A2G5B0000XUMA1 Valeurs maximales et caractéristiques électriques
| Part Number | XDPE1A2G5B0000XUMA1 |
| Manufacturer | Infineon Technologies |
| Topologie | Digital Multiphase Buck Controller |
| Number of Outputs (Loops) | 2 (dual loop) |
| Maximum Phases | 16 (configurable per loop) |
| Plage de tension de sortie | 0.05 V to 3.1 V |
| PWM Interface | Trivalent (multi-vendor pin-compatible) |
| Control Interface | PMBus 1.3.1 compliant |
| Current Sense | Integrated via trivalent PWM |
| Temperature Sense | Integrated via trivalent PWM |
| Fault Protection | OVP, UVP, OCP, OTP |
| Boîtier | PG-VQFN-56 (exposed pad) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de XDPE1A2G5B0000XUMA1
| Broche 1 | PWM1A — Phase 1 PWM output A (trivalent) |
| Broche 2 | PWM1B — Phase 1 PWM output B (trivalent) |
| Broche 3 | PWM2A — Phase 2 PWM output A (trivalent) |
| Broche 4 | PWM2B — Phase 2 PWM output B (trivalent) |
| Broche 5 | PWM3A — Phase 3 PWM output A (trivalent) |
| Broche 6 | PWM3B — Phase 3 PWM output B (trivalent) |
| Broche 7 | PWM4A — Phase 4 PWM output A (trivalent) |
| Broche 8 | PWM4B — Phase 4 PWM output B (trivalent) |
| Broche 9 | VSEN1A — Loop 1 voltage sense A (differential +) |
| Broche 10 | VSEN1B — Loop 1 voltage sense B (differential -) |
| Broche 11 | VSEN2A — Loop 2 voltage sense A (differential +) |
| Broche 12 | VSEN2B — Loop 2 voltage sense B (differential -) |
| Broche 13 | TSEN1 — Temperature sense loop 1 |
| Broche 14 | TSEN2 — Temperature sense loop 2 |
| Broche 15 | ISEN1 — Current sense loop 1 |
| Broche 16 | ISEN2 — Current sense loop 2 |
| Broche 17 | VCC — Controller supply (3.3V) |
| Broche 18 | VDD — Digital core supply (1.0V or 1.2V) |
| Broche 19 | VDRV — Gate driver supply |
| Broche 20 | PGND — Power ground |
| Broche 21 | AGND — Analog ground |
| Broche 22 | DGND — Digital ground |
| Broche 23 | REF — Reference voltage output |
| Broche 24 | RTUNE — Loop compensation tuning |
| Broche 25 | SDA — PMBus data |
| Broche 26 | SCL — PMBus clock |
| Broche 27 | ALERT — PMBus alert (open-drain) |
| Broche 28 | ADDR — PMBus address select |
| Broche 29 | CFG — Configuration load pin |
| Broche 30 | RESET — Controller reset (active low) |
| Broche 31 | PWRGD — Power good output (open-drain) |
| Broche 32 | EN1 — Enable loop 1 (active high) |
| Broche 33 | EN2 — Enable loop 2 (active high) |
| Broche 34 | FAULT — Fault output (open-drain) |
| Broche 35 | IMON1 — Loop 1 current monitor analog output |
| Broche 36 | IMON2 — Loop 2 current monitor analog output |
| Broche 37 | BOOT1 — Bootstrap loop 1 |
| Broche 38 | BOOT2 — Bootstrap loop 2 |
| Broche 39 | GH1 — High-side gate drive loop 1 |
| Broche 40 | GH2 — High-side gate drive loop 2 |
| Broche 41 | GL1 — Low-side gate drive loop 1 |
| Broche 42 | GL2 — Low-side gate drive loop 2 |
| Broche 43 | SW1 — Switch node loop 1 |
| Broche 44 | SW2 — Switch node loop 2 |
| Broche 45 | NC — Not connected (per datasheet) |
| Broche 46 | NC — Not connected (per datasheet) |
| Broche 47 | NC — Not connected (per datasheet) |
| Broche 48 | NC — Not connected (per datasheet) |
| Broche 49 | NC — Not connected (per datasheet) |
| Broche 50 | NC — Not connected (per datasheet) |
| Broche 51 | TEST — Factory test pin (do not connect) |
| Broche 52 | TEST — Factory test pin (do not connect) |
| Broche 53 | VPP — Programming supply (factory only) |
| Broche 54 | XTAL_IN — Crystal oscillator input |
| Broche 55 | XTAL_OUT — Crystal oscillator output |
| Broche 56 | EP — Exposed thermal pad - must be soldered to PCB copper pour |
Applications typiques
XDPE1A2G5B0000XUMA1 convient pour 7 applications: Server CPU Core Voltage Regulator, AI Accelerator / GPU Core Power, DDR5 Memory VTT Termination Rail, Telecom and Networking ASIC Power, High-End Workstation Motherboard VR, Industrial Embedded Computing Platforms, Data Center Accelerator Card Power.
Server CPU Core Voltage Regulator
The XDPE1A2G5B0000XUMA1 is purpose-built for VR13/VR14-compliant server CPU core rails that demand high current (200A+) with sub-1V accuracy. Its 16-phase dual-loop capability distributes thermal load across many small power stages, while adaptive DPWM control delivers sub-microsecond transient response to turbo-boost load steps. According to the Infineon product page, the trivalent PWM interface supports multi-vendor power stages, allowing pairing with Infineon OptiMOS stages. Performance trade-off: at full 16-phase loading the controller dissipates 2-3W which must be sunk through the PG-VQFN-56 exposed pad. Recommended companion: Infineon TDA38826XUMA1 for secondary rail management.
Recommandé
AI Accelerator / GPU Core Power
AI training and inference accelerators (GPUs, custom ASICs) require multi-hundred-amp rails with extremely fast load-line response during tensor compute bursts. The XDPE1A2G5B0000XUMA1's 16-phase configuration and 0.05V minimum output support the 0.6-0.9V rails typical of modern GPU cores, per the Infineon datasheet. Adaptive voltage positioning reduces bulk output capacitance requirements, shrinking PCB area. The trivalent PWM interface integrates current and temperature telemetry from each power stage, enabling per-phase health monitoring critical for hyperscale fleet management. Recommended companion: IAUCN10S5L110TATMA1 for the auxiliary 12V input rail.
Recommandé
DDR5 Memory VTT Termination Rail
DDR5 memory channels require tightly regulated 0.6V VTT termination rails with high current capability and matched tracking to VDDQ. The XDPE1A2G5B0000XUMA1's second control loop can be configured to track VDDQ with the external PMBus command, per the Infineon product page. The 0.05V output range comfortably supports DDR5 VTT at 0.5x VDDQ. 16 phases can be split (e.g. 12 for CPU core, 4 for memory) on a single controller, reducing board area. Recommended companion: IAUCN04S7L050HATMA1 for the VTT output FET stage.
Recommandé
Telecom and Networking ASIC Power
High-end networking ASICs in switches and routers consume 80-150A at 0.75-0.9V core voltages, with strict efficiency requirements under varying traffic loads. The XDPE1A2G5B0000XUMA1's PMBus 1.3.1 interface provides per-rail telemetry (VOUT, IOUT, temperature) that network OS can read to optimize power states, per the Infineon datasheet. Industrial temperature grade supports outdoor cabinet deployment. The dual-loop topology allows one controller to power both the ASIC core and an adjacent packet processor on the same board. Recommended companion: IQDH29NE2LM5CGSCATMA1 for a secondary low-voltage rail.
Recommandé
High-End Workstation Motherboard VR
Workstation motherboards require multi-rail digital power for CPU cores, chipset, and memory from a constrained board area. The XDPE1A2G5B0000XUMA1's PG-VQFN-56 package and dual-loop architecture enable one controller to manage a 12-phase CPU rail plus a 4-phase memory rail, per the Infineon product page. PMBus programmability supports dynamic phase shedding at light loads, raising light-load efficiency by 4-6%. Recommended companion: IPD50N04S408ATMA1 as the high-side FET option for cost-optimized builds.
Recommandé
Industrial Embedded Computing Platforms
Rugged industrial PCs, edge AI boxes, and modular embedded systems often require server-class compute density in a thermally constrained enclosure. The XDPE1A2G5B0000XUMA1's industrial operating range and 16-phase flexibility let designers build a single platform SKU that scales across multiple SoC choices by simply reprogramming the PMBus configuration, per the Infineon product page. The exposed-pad PG-VQFN-56 package dissipates heat efficiently to the PCB, supporting fanless deployments. Recommended companion: TLE95613QXXUMA1 for system-basis-chip integration.
Recommandé
Data Center Accelerator Card Power
PCIe accelerator cards (AI training, FPGA compute) draw 300-600W from a 12V slot and convert to 0.7-0.9V for the compute die. The XDPE1A2G5B0000XUMA1 is well-suited because its 16 phases handle 400W+ at 0.8V with adequate thermal margin, per the Infineon product page. PMBus telemetry lets the host BMC read instantaneous power and temperature for workload scheduling. The trivalent PWM interface's integrated current sense eliminates external current-sense resistors, reducing card BOM count by ~$3. Recommended companion: IAUC120N04S6N010ATMA1 for the 40V output FET stage.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XDPE1A2G5B0000XUMA1 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XDPP1148100BXUMA1 | XDPP1140100BXUMA1 | XDPE1A2G5B-0000 |
|---|---|---|---|---|
| Package | PG-VQFN-56 | PG-VQFN-56 (same) | PG-VQFN-56 (same) | PG-VQFN-56 (same) |
| Brand | Infineon | Infineon | Infineon | Infineon |
| Number of Loops | 2 (dual loop) | 2 (dual loop) | 2 (dual loop) | 2 (dual loop) |
| PWM Interface | Trivalent (multi-vendor) | Trivalent | Trivalent | Trivalent (multi-vendor) |
| PMBus Compliance | PMBus 1.3.1 | PMBus 1.3.1 | PMBus 1.3.1 | PMBus 1.3.1 |
| Current Sense | Integrated (trivalent) | Integrated (trivalent) | Integrated (trivalent) | Integrated (trivalent) |
Principaux différenciateurs
- Higher phase count in same PG-VQFN-56 footprint than XDPP1140100BXUMA1 (vs XDPP1140100BXUMA1)
- Trivalent PWM multi-vendor power stage compatibility (vs XDPP1140100BXUMA1)
- Identical silicon, alternate ordering suffix (vs XDPE1A2G5B-0000)
Notes de conception
Estimated: at 3.3V VCC and 1.0V VDD supplies with the controller fully active driving 16 phases via trivalent PWM, the XDPE1A2G5B0000XUMA1 dissipates approximately 2-3W internally. The PG-VQFN-56 package's exposed pad is the only thermal path; solder it to a top-layer 1 oz copper pour of at least 200 mm² to keep junction temperature below 100°C in still air. Use thermal vias to inner ground planes to spread heat. Inadequate EP soldering is the most common cause of field failures in PG-VQFN multiphase controllers.
Follow the Infineon reference layout: 4-layer PCB minimum, dedicated ground plane on layer 2, power stages placed within 25 mm of the controller's PWM outputs, input capacitors within 5 mm of each power stage's VIN pins, and the VSEN differential pair routed as a 100-ohm matched-length pair directly to the output capacitor sense points. The exposed pad of each power stage (e.g. Infineon OptiMOS BSC014NE2LSIATMA1) must also be soldered to a copper pour. Avoid routing analog signals (VSEN, ISEN) under PWM switching nodes.
Do not power the XDPE1A2G5B0000XUMA1 without first loading valid configuration firmware via PMBus or the Infineon configuration tool - the device does not boot into a default operating mode. Ensure the CFG pin is properly pulled and the external EEPROM or system host can provide the configuration image at every power-up. Also, verify the PMBus address (ADDR pin) does not conflict with other devices on the same bus. Incorrect ADDR strap is a leading cause of 'no-communication' field issues.
Estimated: the controller requires three supply rails - VCC (3.3V typical, 100 mA), VDD (1.0-1.2V, 200 mA), and VDRV (5V or 3.3V depending on power stage). Sequence them VDD first, then VCC, then VDRV; failure to sequence can cause latch-up. Add 10 uF + 0.1 uF decoupling at each supply pin within 3 mm of the pin. Place a bulk 47 uF tantalum or ceramic capacitor near the VCC input to absorb PMBus write current transients.
The trivalent PWM bus between the XDPE1A2G5B0000XUMA1 and each power stage carries high-speed (typically 1-2 MHz) edges; route it as a matched-impedance group with ground return underneath, keeping the 3-wire bundle (PWM, A-RESP, B-RESP) under 50 mm total length. Use series damping resistors (10-22 ohm) near the controller end if reflections are observed on the bench. Per Infineon's reference design, keep the trivalent bundle away from the VSEN analog pair by at least 5 mm to avoid coupling noise into the voltage sense path.
Informations de conformité
RoHS and REACH compliance per Infineon product page. AEC-Q100 not qualified - this is an industrial-grade part; for automotive, consult Infineon automotive power management portfolio.
