EPF81500ARC240-3 - FLEX 8000 FPGA 16K Gates 240-RQFP | Intel
MPN: EPF81500ARC240-3 ✗ סוף ייצורEPF81500ARC240-3 סקירה
An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines the high integration of a gate array with the design flexibility of in-circuit reconfigurability. Within the broader semiconductor hierarchy, an FPGA sits under programmable logic, alongside CPLDs, and above fixed-function ASICs in design flexibility. The FLEX 8000 family occupies a unique position as one of the first register-rich, high-density SRAM-based PLD families designed for system-level integration with features such as in-circuit reconfigurability (ICR), multi-volt I/O support, and JTAG boundary-scan testing.
Key features of the EPF81500ARC240-3 include 16,000 usable gates, 1,500 flip-flops, embedded SRAM for fast on-chip memory, and continuous FastTrack interconnect routing. The device operates from a 5V core supply and supports 3.3V and 5V I/O standards through its multi-volt interface. A 240-pin RQFP package with exposed thermal pad supports high-I/O-count designs in industrial, telecom, and consumer applications. According to the Flex 8000 Device Family datasheet, configuration is performed at system power-up using industry-standard parallel EPROMs, Altera serial configuration devices (EPC1, EPC1213, EPC1064, EPC1441), or a system controller.
Typical applications include industrial automation controllers, telecommunications line cards, glue-logic consolidation in legacy 5V systems, and prototyping platforms for ASIC migration. The exposed thermal pad enables reliable operation at extended junction temperatures when properly soldered to a PCB thermal land pattern. When designing with this device, ensure adequate decoupling on the VCCINT and VCCIO rails and follow Altera's configuration schematic recommendations to prevent partial configuration states at power-up.
חלופות תחליף ישיר עבור EPF81500ARC240-3 — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם EPF81500ARC240-3 (אותו גורם צורה וטביעת רגל) — שונים ב Package, Configuration Method, Process Technology, Speed Grade, Mounting Type.
EPF81500ARC240-2
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPF81500AQC240-3
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPF81500AQC240-4
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPF81500AQC240-2
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPF81500AQC240-2N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPF81500ARC240-2A
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPF81500ARC240-3 דירוגים מרביים ומאפיינים חשמליים
| Family | FLEX 8000 |
| Logic Elements / Cells | 1296 |
| Usable Gates | 16,000 |
| Registers (Flip-Flops) | 1500 |
| User I/O Pins | 181 |
| Number of Logic Array Blocks (LABs) | 162 |
| Number of Embedded Array Blocks (EABs) | 12 |
| Process Technology | 0.42 µm CMOS |
| Core Supply Voltage (VCCINT) | 5 V |
| I/O Supply Voltage (VCCIO) | 3.3 V / 5 V |
| Maximum Internal Frequency | 125 MHz (speed grade -3) |
| מארז | 240-BFQFP Exposed Pad (240-RQFP) |
| Configuration Method | SRAM, serial or parallel EPROM, JTAG |
| סוג הרכבה | Surface Mount |
תצורת פינים של EPF81500ARC240-3
| פין 1 | I/O — User I/O pin |
| פין 2 | I/O — User I/O pin |
| פין 3 | I/O — User I/O pin |
| פין 4 | I/O — User I/O pin |
| פין 5 | VCCINT — Core supply voltage (5V) |
| פין 6 | GND — Ground |
| פין 7 | I/O — User I/O pin |
| פין 8 | I/O — User I/O pin |
| פין 9 | I/O — User I/O pin |
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| פין 180 | I/O — User I/O pin |
| פין 181 | I/O — User I/O pin |
| פין 182 | GND — Ground |
| פין 183 | VCCIO — I/O supply voltage (3.3V or 5V) |
| פין 184 | MSEL0 — Configuration mode select 0 |
| פין 185 | MSEL1 — Configuration mode select 1 |
| פין 186 | MSEL2 — Configuration mode select 2 |
| פין 187 | nSTATUS — Configuration status (open drain) |
| פין 188 | nCONFIG — Configuration control (active low) |
| פין 189 | DCLK — Configuration clock input |
| פין 190 | DATA0 — Configuration data input |
| פין 191 | CONF_DONE — Configuration complete (open drain) |
| פין 192 | nCE — Chip enable (active low) |
| פין 193 | I/O — User I/O pin |
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| פין 240 | I/O — User I/O pin |
יישומים טיפוסיים
EPF81500ARC240-3 מתאים עבור 6 יישוםs: Industrial Automation Controllers, Telecommunications Line Cards, Legacy 5V System Glue Logic, ASIC Prototyping Platform, Military and Aerospace Avionics (Legacy), Medical Imaging Front-End.
Industrial Automation Controllers
The EPF81500ARC240-3 fits industrial automation controllers because its 16,000 usable gates and 181 user I/O provide ample logic for state-machine-based machine control, encoder interfacing, and multi-axis motion sequencing. The FLEX 8000 architecture's embedded array blocks (EABs) implement FIFO buffers and look-up-table-based waveform generators used in PID loops, while the 5V core with 3.3V/5V multi-volt I/O enables direct interface to legacy 5V PLC peripherals and modern 3.3V sensors without level shifters. In-circuit reconfigurability (ICR) permits field firmware updates over JTAG or EPC serial devices, which is essential for deployed machinery that cannot be easily returned for service.
מומלץ
Telecommunications Line Cards
Telecommunications line cards benefit from the EPF81500ARC240-3's 181 user I/O and 1,296 logic cells, which provide enough capacity for T1/E1 framers, HDLC controllers, and time-slot interchangers common in legacy telecom equipment. The 240-RQFP package exposes the full FastTrack interconnect routing, ensuring predictable timing for synchronous serial interfaces. SRAM-based configuration allows remote firmware updates via JTAG or processor-driven serial configuration, important for central-office equipment that must support feature upgrades without physical access. The device's 5V-tolerant I/O bridges 3.3V backplane logic to legacy 5V line-interface units (LIUs) without external buffers.
מומלץ
Legacy 5V System Glue Logic
The EPF81500ARC240-3 is well-suited as a glue-logic consolidator in 5V systems where multiple discrete 74-series TTL/CMOS parts would otherwise be needed for address decoding, bus arbitration, or custom state machines. Its 5V VCCINT and 3.3V/5V VCCIO interface directly to both legacy 5V microprocessors (e.g. 8051, 68k) and modern 3.3V peripherals. With 1,500 registers and 162 LABs, designers can replace 20-30 discrete MSI/SSI packages with a single 240-RQFP FPGA, reducing board area, improving reliability, and simplifying ECO changes during product evolution.
מומלץ
ASIC Prototyping Platform
Designers prototyping ASIC designs use the EPF81500ARC240-3 to validate RTL before committing to mask fabrication. The FLEX 8000 family provides 16K usable gates and in-circuit reconfigurability, allowing fast design iterations via JTAG or EPC configuration devices. SRAM configuration eliminates the need for UV-erase cycles required by older CPLDs, dramatically shortening debug cycles. The 240-RQFP package with exposed pad supports real-world clock rates (~125 MHz) representative of ASIC target performance, and the 5V/3.3V multi-volt I/O replicates the I/O environment of many ASIC processes used in the late 1990s.
מומלץ
Military and Aerospace Avionics (Legacy)
Legacy avionics platforms use the EPF81500ARC240-3 in display drivers, sensor interfaces, and bus controllers where its wide operating voltage tolerance and exposed-pad thermal dissipation are valued. The 240-RQFP package is mechanically robust and qualified for many legacy MIL-spec environments. Designers must consult the original Flex 8000 datasheet for full military temperature grade information. For new aerospace designs, however, modern radiation-hardened FPGAs (e.g. Microsemi RTG4, Xilinx Virtex-5QV) should be evaluated instead, as FLEX 8000 is not radiation-hardened by design.
מומלץ
Medical Imaging Front-End
Legacy medical imaging front-ends (ultrasound beamformers, MRI receiver arrays) use the EPF81500ARC240-3 to implement channel-selection logic, gain control, and ADC-interface glue. The 181 user I/O accommodates parallel ADC data buses (10-16 bits per channel x multiple channels), while the 1,296 logic cells perform pipelined multiplexing and digital filtering. The 5V I/O tolerance interfaces directly to legacy medical-grade analog front-ends. Designers must verify biocompatibility, sterilization, and regulatory compliance separately; this FPGA is a logic component within a larger medical system subject to FDA/CE approvals.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור EPF81500ARC240-3 — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | EPF81500ARC240-2 | EPF81500AQC240-3 | EPF81500AQC240-4 | EPF81500AQC240-2 |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 240-BFQFP Exposed Pad (240-RQFP) | 240-BFQFP Exposed Pad (240-RQFP) | 240-BFQFP Exposed Pad (240-RQFP) | 240-BFQFP Exposed Pad (240-RQFP) | 240-BFQFP Exposed Pad (240-RQFP) |
| Family | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 | FLEX 8000 |
| Usable Gates | 16,000 | 16,000 | 16,000 | 16,000 | 16,000 |
| Logic Cells | 1296 | 1296 | 1296 | 1296 | 1296 |
| User I/O | 181 | 181 | 181 | 181 | 181 |
| Speed Grade | -3 (125 MHz) | -2 (~100 MHz) | -3 (125 MHz) | -4 (~150 MHz) | -2 (~100 MHz) |
| Temperature Grade | Industrial (A suffix) | Industrial | Commercial | Commercial | Commercial |
| Process / VCCINT | 0.42 µm CMOS / 5V | 0.42 µm CMOS / 5V | 0.42 µm CMOS / 5V | 0.42 µm CMOS / 5V | 0.42 µm CMOS / 5V |
מבדילים עיקריים
- Same silicon with different speed grade within FLEX 8000 family (לעומתEPF81500ARC240-2)
- Industrial temperature grade option (לעומתEPF81500AQC240-3)
- Higher performance option in same package (לעומתEPF81500AQC240-4)
הערות תכנון
The EPF81500ARC240-3 requires a stable 5V VCCINT supply and a separate VCCIO rail (3.3V or 5V). Place 0.1 µF decoupling capacitors as close as possible to every VCCINT/VCCIO pin pair, plus bulk 10-47 µF tantalum or ceramic capacitors near the package. According to FLEX 8000 datasheet guidelines, supply voltage must ramp monotonically from 0V to nominal during power-up to avoid latch-up or partial configuration. Use a supervisor IC (e.g. TL7705 or equivalent) to monitor VCCINT and hold nCONFIG low until all rails are stable.
The 240-RQFP Exposed Pad package requires a PCB thermal land pattern with at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) connecting the exposed pad to an internal copper plane. Estimated: with all 181 I/O toggling at 125 MHz, core dissipation is approximately 0.5-1.5 W; without the exposed pad soldered, junction temperature may exceed 100 °C in still air. Recommended copper area is at least 1 square inch on top plus 4 square inches on internal ground plane.
Route all configuration signals (DCLK, DATA0, nCONFIG, nSTATUS, CONF_DONE, MSEL[0:2]) as short and direct as possible. Keep DCLK traces length-matched if multiple FPGAs share a configuration chain. The 240-RQFP at 0.5 mm pitch requires precise PCB fabrication (laser-drilled or fine-pitch capable processes). Use a 4-layer PCB with continuous ground plane beneath the FPGA for signal integrity and EMI suppression.
Do not leave MSEL[0:2] floating - they must be tied to VCCINT or GND to select the correct configuration mode (e.g. 000 = PS mode with EPC1, 010 = AS mode). nSTATUS and CONF_DONE are open-drain outputs and require external pull-up resistors (typically 10 kΩ to VCCINT). Do not confuse EPF81500 (16K gates, 1296 cells, 181 I/O) with EPF81188 or EPF6010/6016/6024 - these are different FLEX 8000 family members with different logic capacities.
מידע על תאימות
FLEX 8000 family predates widespread RoHS adoption; specific compliance status for EPF81500ARC240-3 should be verified per lot via manufacturer declaration letter. AEC-Q100 not applicable (FPGA, not automotive-grade qualified).
