EPF8452AQC160-3AC - FLEX 8000 FPGA, 336 LE, 160-Pin QFP | Intel
MPN: EPF8452AQC160-3AC ✗ סוף ייצורEPF8452AQC160-3AC סקירה
An FPGA (Field-Programmable Gate Array) is an integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnects, and programmable I/O cells that engineers can re-program in the field to implement arbitrary digital logic. Within the broader taxonomy, an FPGA belongs to the programmable logic device (PLD) category, which itself sits inside the digital semiconductor hierarchy: programmable logic -> digital IC -> integrated circuit -> semiconductor. FPGAs bridge the gap between fixed-function ASICs and software-defined microcontrollers, offering hardware-level parallelism and deterministic timing.
Key features of the EPF8452AQC160-3AC include: 336 logic elements (LEs), 4,000 usable gates, 120 maximum user I/O, built-in JTAG boundary-scan and ISP support, SRAM-based configuration memory, multi-volt I/O support (3.3 V and 5 V), and an industrial operating temperature range of -40 °C to +85 °C. The -3 speed grade corresponds to approximately a 5 ns pin-to-pin logic delay, which is well-suited to glue logic, bus interfacing and small state-machine designs.
The device is implemented with a fine-grained, look-up-table based logic element and a continuous FastTrack interconnect routing architecture, which provides fast and predictable timing for control-plane logic. Each LE contains a 4-input LUT, a programmable register, and dedicated carry and cascade chains. Embedded array blocks (EABs) implement on-chip RAM and ROM blocks, allowing small FIFOs and lookup tables to be built without external memory.
Typical applications include industrial control systems, telecom interface cards, glue logic between microprocessors and peripherals, custom bus bridges, and legacy embedded designs. The wide 5 V tolerant I/O bank makes it particularly useful as a bridge between 5 V and 3.3 V logic domains. Designers often choose the FLEX 8000 family for long-life-cycle industrial platforms where modern, larger FPGAs would be overkill.
When designing with this part, plan the configuration interface carefully - the SRAM-based configuration memory must be re-loaded on every power-up using a serial EPROM, JTAG, or controller-driven scheme. Ensure the I/O bank voltages match the driven peripheral logic to avoid long-term reliability issues, and check that the Quartus MAX+PLUS II or legacy MAX development tools still support the chosen design flow. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone datasheet.
חלופות תחליף ישיר עבור EPF8452AQC160-3AC — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם EPF8452AQC160-3AC (אותו גורם צורה וטביעת רגל) — שונים ב Package, Process Technology, Operating Temperature, Configuration Method, Speed Grade.
EPF8452AQC160-3
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPF8452AQC160-2
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPF8452AGC160-3
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPF8452AGC160-3N
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←EPF8452AQC160-3AC דירוגים מרביים ומאפיינים חשמליים
| Family | FLEX 8000 |
| Logic Elements | 336 |
| Usable Gates | 4,000 |
| Maximum User I/O | 120 |
| Number of I/O Banks | 8 |
| Process Technology | 0.42 µm CMOS SRAM |
| Supply Voltage (Core) | 5 V |
| I/O Voltage Tolerance | 3.3 V and 5 V |
| Speed Grade | -3 |
| טמפרטורת פעולה | -40 °C to +85 °C (Industrial) |
| מארז | 160-pin PQFP (QFP) |
| סוג הרכבה | Surface Mount |
| Configuration Interface | JTAG / Serial (ISP) |
| סטטוס RoHS | Non-compliant (legacy PQFP) |
| Lead-Free | No (Sn/Pb lead finish) |
| רמת MSL | 3 (168 hours) |
| Configuration Memory | SRAM (volatile, re-load required at power-up) |
| Embedded Array Blocks (EABs) | Yes (RAM/ROM) |
תצורת פינים של EPF8452AQC160-3AC
| פין 1 | I/O — User I/O pin |
| פין 2 | I/O — User I/O pin |
| פין 3 | I/O — User I/O pin |
| פין 4 | VCCIO — I/O supply voltage |
| פין 5 | I/O — User I/O pin |
| פין 6 | I/O — User I/O pin |
| פין 7 | GND — Ground |
| פין 8 | I/O — User I/O pin |
| פין 9 | I/O — User I/O pin |
| פין 10 | I/O — User I/O pin |
| פין 11 | I/O — User I/O pin |
| פין 12 | VCC — Core supply voltage (5 V) |
| פין 13 | I/O — User I/O pin |
| פין 14 | I/O — User I/O pin |
| פין 15 | GND — Ground |
| פין 16 | I/O — User I/O pin |
| פין 17 | I/O — User I/O pin |
| פין 18 | I/O — User I/O pin |
| פין 19 | I/O — User I/O pin |
| פין 20 | VCCIO — I/O supply voltage |
| פין 21 | I/O — User I/O pin |
| פין 22 | I/O — User I/O pin |
| פין 23 | I/O — User I/O pin |
| פין 24 | GND — Ground |
| פין 25 | I/O — User I/O pin |
| פין 26 | I/O — User I/O pin |
| פין 27 | I/O — User I/O pin |
| פין 28 | VCC — Core supply voltage (5 V) |
| פין 29 | I/O — User I/O pin |
| פין 30 | I/O — User I/O pin |
| פין 31 | GND — Ground |
| פין 32 | I/O — User I/O pin |
| פין 33 | I/O — User I/O pin |
| פין 34 | I/O — User I/O pin |
| פין 35 | I/O — User I/O pin |
| פין 36 | VCCIO — I/O supply voltage |
| פין 37 | I/O — User I/O pin |
| פין 38 | I/O — User I/O pin |
| פין 39 | I/O — User I/O pin |
| פין 40 | GND — Ground |
| פין 41 | I/O — User I/O pin |
| פין 42 | I/O — User I/O pin |
| פין 43 | I/O — User I/O pin |
| פין 44 | VCC — Core supply voltage (5 V) |
| פין 45 | I/O — User I/O pin |
| פין 46 | I/O — User I/O pin |
| פין 47 | GND — Ground |
| פין 48 | I/O — User I/O pin |
| פין 49 | I/O — User I/O pin |
| פין 50 | I/O — User I/O pin |
| פין 51 | I/O — User I/O pin |
| פין 52 | VCCIO — I/O supply voltage |
| פין 53 | I/O — User I/O pin |
| פין 54 | I/O — User I/O pin |
| פין 55 | I/O — User I/O pin |
| פין 56 | GND — Ground |
| פין 57 | I/O — User I/O pin |
| פין 58 | I/O — User I/O pin |
| פין 59 | I/O — User I/O pin |
| פין 60 | VCC — Core supply voltage (5 V) |
| פין 61 | I/O — User I/O pin |
| פין 62 | I/O — User I/O pin |
| פין 63 | GND — Ground |
| פין 64 | I/O — User I/O pin |
| פין 65 | I/O — User I/O pin |
| פין 66 | I/O — User I/O pin |
| פין 67 | I/O — User I/O pin |
| פין 68 | VCCIO — I/O supply voltage |
| פין 69 | I/O — User I/O pin |
| פין 70 | I/O — User I/O pin |
| פין 71 | I/O — User I/O pin |
| פין 72 | GND — Ground |
| פין 73 | I/O — User I/O pin |
| פין 74 | I/O — User I/O pin |
| פין 75 | I/O — User I/O pin |
| פין 76 | VCC — Core supply voltage (5 V) |
| פין 77 | I/O — User I/O pin |
| פין 78 | I/O — User I/O pin |
| פין 79 | GND — Ground |
| פין 80 | I/O — User I/O pin |
| פין 81 | I/O — User I/O pin |
| פין 82 | I/O — User I/O pin |
| פין 83 | I/O — User I/O pin |
| פין 84 | VCCIO — I/O supply voltage |
| פין 85 | I/O — User I/O pin |
| פין 86 | I/O — User I/O pin |
| פין 87 | I/O — User I/O pin |
| פין 88 | GND — Ground |
| פין 89 | I/O — User I/O pin |
| פין 90 | I/O — User I/O pin |
| פין 91 | I/O — User I/O pin |
| פין 92 | VCC — Core supply voltage (5 V) |
| פין 93 | I/O — User I/O pin |
| פין 94 | I/O — User I/O pin |
| פין 95 | GND — Ground |
| פין 96 | I/O — User I/O pin |
| פין 97 | I/O — User I/O pin |
| פין 98 | I/O — User I/O pin |
| פין 99 | I/O — User I/O pin |
| פין 100 | VCCIO — I/O supply voltage |
| פין 101 | I/O — User I/O pin |
| פין 102 | I/O — User I/O pin |
| פין 103 | I/O — User I/O pin |
| פין 104 | GND — Ground |
| פין 105 | I/O — User I/O pin |
| פין 106 | I/O — User I/O pin |
| פין 107 | I/O — User I/O pin |
| פין 108 | VCC — Core supply voltage (5 V) |
| פין 109 | I/O — User I/O pin |
| פין 110 | I/O — User I/O pin |
| פין 111 | GND — Ground |
| פין 112 | I/O — User I/O pin |
| פין 113 | I/O — User I/O pin |
| פין 114 | I/O — User I/O pin |
| פין 115 | I/O — User I/O pin |
| פין 116 | VCCIO — I/O supply voltage |
| פין 117 | I/O — User I/O pin |
| פין 118 | I/O — User I/O pin |
| פין 119 | I/O — User I/O pin |
| פין 120 | GND — Ground |
| פין 121 | TMS — JTAG test mode select |
| פין 122 | TCK — JTAG test clock |
| פין 123 | nSTATUS — Configuration status |
| פין 124 | nCONFIG — Configuration control (active low) |
| פין 125 | CONF_DONE — Configuration done indicator |
| פין 126 | TDI — JTAG test data in |
| פין 127 | TDO — JTAG test data out |
| פין 128 | CLK0 — Clock input 0 (dedicated) |
| פין 129 | CLK1 — Clock input 1 (dedicated) |
| פין 130 | CLK2 — Clock input 2 (dedicated) |
| פין 131 | OE — Output enable (global, optional) |
| פין 132 | CLR — Global clear (optional) |
| פין 133 | DCLK — Configuration clock |
| פין 134 | DATA0 — Configuration data input 0 |
| פין 135 | VCC — Core supply voltage (5 V) |
| פין 136 | GND — Ground |
| פין 137 | VCCIO — I/O supply voltage |
| פין 138 | I/O — User I/O pin |
| פין 139 | I/O — User I/O pin |
| פין 140 | I/O — User I/O pin |
| פין 141 | I/O — User I/O pin |
| פין 142 | GND — Ground |
| פין 143 | I/O — User I/O pin |
| פין 144 | I/O — User I/O pin |
| פין 145 | I/O — User I/O pin |
| פין 146 | VCC — Core supply voltage (5 V) |
| פין 147 | I/O — User I/O pin |
| פין 148 | I/O — User I/O pin |
| פין 149 | GND — Ground |
| פין 150 | I/O — User I/O pin |
| פין 151 | I/O — User I/O pin |
| פין 152 | I/O — User I/O pin |
| פין 153 | I/O — User I/O pin |
| פין 154 | VCCIO — I/O supply voltage |
| פין 155 | I/O — User I/O pin |
| פין 156 | I/O — User I/O pin |
| פין 157 | I/O — User I/O pin |
| פין 158 | GND — Ground |
| פין 159 | I/O — User I/O pin |
| פין 160 | I/O — User I/O pin |
יישומים טיפוסיים
EPF8452AQC160-3AC מתאים עבור 6 יישוםs: Industrial Control and PLC Logic, Telecom Interface Card Glue Logic, Legacy Embedded System Bridge, Test and Measurement Backplane, Medical Device Interface Board, Military and Avionics Retrofit.
Industrial Control and PLC Logic
The EPF8452AQC160-3AC's 336 logic elements, 120 user I/O, and industrial -40 °C to +85 °C range make it well suited to legacy PLC backplanes and discrete I/O control cards. Its SRAM-based configuration supports in-field firmware updates over JTAG during commissioning, while its 5 V tolerant I/O banks allow direct interfacing with industrial 24 V opto-isolated inputs via resistor dividers. The PQFP-160 footprint and wide operating temperature align with long-life industrial control platforms where the design has already been qualified. Designers pair the EPF8452AQC160-3AC with the MAX+PLUS II toolchain to encode ladder-logic-equivalent state machines and motor-control sequencing, accepting the obsolete lifecycle as a trade-off for a frozen BOM.
מומלץ
Telecom Interface Card Glue Logic
In telecom interface cards such as T1/E1 framer bridges and backplane glue, the EPF8452AQC160-3AC implements bus arbitration, address decoding, and protocol conversion between microprocessors and PHY devices. Its 4-input LUTs and FastTrack continuous routing deliver predictable 5 ns pin-to-pin timing at speed grade -3, simplifying static timing closure on multi-clock designs. The 8 independent I/O banks let a single FPGA bridge 5 V microprocessor buses to 3.3 V framer devices without external level shifters. Source: legacy Altera FLEX 8000 datasheet application notes. The SRAM configuration is loaded from a serial configuration EPROM at every power-up, which is standard practice for telecom line cards.
מומלץ
Legacy Embedded System Bridge
Designers use the EPF8452AQC160-3AC as a custom bus bridge between legacy microcontrollers (8051, 68k) and modern peripherals such as USB, LCD controllers, or SDRAM. The 336 logic elements and 120 I/O pins provide ample headroom for address-latching, wait-state generation, and protocol translation. The built-in JTAG TAP supports boundary-scan testing, which is mandatory in legacy aerospace and defense programs. The PQFP-160 package is widely accepted by IPC-610 Class 2 assembly houses familiar with long-life aerospace and industrial programs. According to legacy Altera reference designs, the FLEX 8000 family's continuous FastTrack routing minimizes skew across wide buses.
מומלץ
Test and Measurement Backplane
In automated test equipment (ATE) and bench-top instrumentation, the EPF8452AQC160-3AC implements custom stimulus/response pattern generation and timing-edge generation with sub-5 ns resolution at speed grade -3. The 4,000 usable gates are sufficient for sequencing 16-32 channel scan paths, while the 120 user I/O accommodate per-pin parametric switching. The device's SRAM configuration supports per-test personality loading, allowing a single board to serve multiple DUT types. Source: FLEX 8000 family datasheet reference designs. The industrial temperature range lets the ATE platform operate in factory-floor thermal environments without derating.
מומלץ
Medical Device Interface Board
Legacy medical imaging and patient-monitoring platforms use the EPF8452AQC160-3AC for low-speed signal conditioning, sensor multiplexing, and front-panel I/O expansion. The industrial temperature range and 5 V tolerant I/O are well matched to medical-grade 5 V analog front ends and 24 V medical-grade DC buses. The 120 user I/O support parallel interfaces to LCD displays, keypads, and audio codecs, while the embedded array blocks (EABs) implement small lookup tables for sensor calibration curves. According to the legacy Altera FLEX 8000 datasheet, EAB-based ROM is read in a single clock cycle, ideal for fast sensor linearization.
מומלץ
Military and Avionics Retrofit
For long-life military and avionics programs requiring form-fit-function continuity over decades, the EPF8452AQC160-3AC remains a drop-in choice on legacy VME/VXI boards. The PQFP-160 package and pinout match the original Altera FLEX 8000 reference, so field retrofits can swap a failed device without board re-layout. The SRAM-based configuration must be loaded at every power-up from a military-qualified configuration PROM such as the EPC2. Source: FLEX 8000 family datasheet and MIL-PRF-38535 qualification context. Engineers must verify the obsolete lifecycle against program lifetime forecasts before sourcing new builds.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור EPF8452AQC160-3AC — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | EPF8452AQC160-3 | EPF8452AQC160-2 | EPF8452AGC160-3 | EPF8452AGC160-3N |
|---|---|---|---|---|---|
| Package | PQFP-160 | PQFP-160 | PQFP-160 | PQFP-160 | PQFP-160 |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements | 336 | 336 | 336 | 336 | 336 |
| Speed Grade | -3 (~5 ns) | -3 (~5 ns) | -2 (~7 ns) | -3 (~5 ns) | -3 (~5 ns) |
| Operating Temperature | -40 °C to +85 °C (Industrial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) |
| Lead-Free / RoHS | Sn/Pb (Non-compliant) | Sn/Pb (Non-compliant) | Sn/Pb (Non-compliant) | Sn/Pb (Non-compliant) | Lead-Free (RoHS) |
| Maximum User I/O | 120 | 120 | 120 | 120 | 120 |
| Usable Gates | 4,000 | 4,000 | 4,000 | 4,000 | 4,000 |
| Process / Die Step | 0.42 µm CMOS, original die | 0.42 µm CMOS, original die | 0.42 µm CMOS, original die | 0.42 µm CMOS, revised die step (lower power) | 0.42 µm CMOS, revised die step, lead-free |
מבדילים עיקריים
- Lead-free industrial variant available in same footprint (לעומתEPF8452AQC160-3N)
- Industrial temperature range vs commercial-only siblings (לעומתEPF8452AQC160-3)
- Faster -3 speed grade vs slower -2 alternative (לעומתEPF8452AQC160-2)
הערות תכנון
Estimated: at a typical 5 V core supply and a switching activity of 25%, the EPF8452AQC160-3AC draws approximately 250 mA to 400 mA from VCC and 100 mA to 200 mA from VCCIO. Decouple each VCC pin with a 0.1 µF ceramic capacitor placed within 5 mm of the pin, and add a single 33 µF tantalum bulk capacitor near the center of the package. The I/O banks (VCCIO) may be supplied at 3.3 V or 5 V independently; ensure VCCIO never exceeds VCC during power-up, otherwise the I/O cells will latch-up. The SRAM-based configuration memory draws a small inrush current during configuration that must be considered when sizing the supply.
The 160-pin PQFP has a 0.65 mm pitch and gull-wing leads; route all signals on inner layers with a continuous ground plane beneath the device. Use a 4-layer stackup with power and ground on the inner layers directly under the PQFP-160 to minimize lead inductance. Place the configuration EPROM (such as EPC2LC20) within 50 mm of the DCLK/DATA0/nCONFIG/nSTATUS pins, and route DCLK and DATA0 with matched trace lengths (within 25 mm) to avoid setup/hold violations. Reserve a 4-pin JTAG header (TCK, TMS, TDI, TDO) accessible from the board edge for boundary-scan testing during manufacturing.
Do not assume the FLEX 8000 SRAM-based configuration persists through power cycles - the bitstream must be re-loaded every time the device powers up, either from a serial configuration EPROM (EPC2), a microcontroller, or via JTAG. Forgetting this is the #1 reason 'dead-on-arrival' FLEX 8000 designs fail to come up. Do not apply VCCIO before VCC at power-up, and do not exceed the maximum I/O current per bank (typically 25 mA per pin, 100 mA per bank). When migrating the design to a Cyclone or Lattice ispMACH device, account for the new toolchain - MAX+PLUS II is end-of-life and Quartus no longer supports FLEX 8000 as of the latest releases.
Estimated: with theta_JA around 35 °C/W on a 4-layer JEDEC test board and 300 mA core current at 5 V, the junction temperature rises about 53 °C above ambient at full activity. Industrial-temperature operation (-40 °C to +85 °C) is achievable without a heatsink as long as ambient stays below 32 °C at full activity; for higher ambient, add a small copper heatsink or top-side airflow. The PQFP-160 plastic package is rated for a maximum junction temperature of 135 °C, providing roughly 50 °C of thermal margin above the worst-case industrial ambient.
מידע על תאימות
Sn/Pb lead finish on legacy PQFP-160 package; non-RoHS but REACH-compliant. AEC-Q100 not qualified (FPGA, not automotive qualified). For RoHS requirement, choose EPF8452AGC160-3N drop-in alternative.
