Intel

EPF8452AQC160-3AC - FLEX 8000 FPGA, 336 LE, 160-Pin QFP | Intel

Name: EPF8452AQC160-3AC - FLEX 8000 FPGA, 336 LE, 160-Pin QFP | Intel
Brand: Intel
SKU: EPF8452AQC160-3AC

MPN: EPF8452AQC160-3AC ✗ Cuối đời

5 V Vdss 160-pin PQFP (QFP) Package -3 Speed SRAM (volatile, re-load required at power-up) Memory

Yêu cầu báo giá

MOQ: 1 |

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EPF8452AQC160-3AC Tóm tắt

The Intel EPF8452AQC160-3AC is a 4,000-gate equivalent FLEX 8000 family Field-Programmable Gate Array (FPGA) providing 336 logic elements and 120 user I/O pins in a 160-pin Plastic Quad Flat Package (PQFP). It is built on a 0.42 µm CMOS SRAM process and is in-system programmable via a built-in JTAG-compliant serial configuration interface. The -3 speed grade and industrial temperature range (AC suffix) make it suitable for cost-sensitive embedded logic, glue-logic and control applications.

An FPGA (Field-Programmable Gate Array) is an integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnects, and programmable I/O cells that engineers can re-program in the field to implement arbitrary digital logic. Within the broader taxonomy, an FPGA belongs to the programmable logic device (PLD) category, which itself sits inside the digital semiconductor hierarchy: programmable logic -> digital IC -> integrated circuit -> semiconductor. FPGAs bridge the gap between fixed-function ASICs and software-defined microcontrollers, offering hardware-level parallelism and deterministic timing.

Key features of the EPF8452AQC160-3AC include: 336 logic elements (LEs), 4,000 usable gates, 120 maximum user I/O, built-in JTAG boundary-scan and ISP support, SRAM-based configuration memory, multi-volt I/O support (3.3 V and 5 V), and an industrial operating temperature range of -40 °C to +85 °C. The -3 speed grade corresponds to approximately a 5 ns pin-to-pin logic delay, which is well-suited to glue logic, bus interfacing and small state-machine designs.

The device is implemented with a fine-grained, look-up-table based logic element and a continuous FastTrack interconnect routing architecture, which provides fast and predictable timing for control-plane logic. Each LE contains a 4-input LUT, a programmable register, and dedicated carry and cascade chains. Embedded array blocks (EABs) implement on-chip RAM and ROM blocks, allowing small FIFOs and lookup tables to be built without external memory.

Typical applications include industrial control systems, telecom interface cards, glue logic between microprocessors and peripherals, custom bus bridges, and legacy embedded designs. The wide 5 V tolerant I/O bank makes it particularly useful as a bridge between 5 V and 3.3 V logic domains. Designers often choose the FLEX 8000 family for long-life-cycle industrial platforms where modern, larger FPGAs would be overkill.

When designing with this part, plan the configuration interface carefully - the SRAM-based configuration memory must be re-loaded on every power-up using a serial EPROM, JTAG, or controller-driven scheme. Ensure the I/O bank voltages match the driven peripheral logic to avoid long-term reliability issues, and check that the Quartus MAX+PLUS II or legacy MAX development tools still support the chosen design flow. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone datasheet.

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Các biến thể trong loạt này

Các mẫu cùng loạt có thể lắp đặt dễ dàng tương thích với EPF8452AQC160-3AC (cùng hình factor và footprint) — khác nhau ở Package, Process Technology, Operating Temperature, Configuration Method, Speed Grade.

EPF8452AGC160-3

Altera

Package: 160-pin PQFP (BQFP, 28x28 mm)

Process Technology: CMOS, SRAM-based

Operating Temperature: 0 C to +70 C (Commercial)