NXP Semiconductors

S912XET256W1MAGR - 16-Bit 50MHz 256KB Flash S12X MCU | NXP

MPN: S912XET256W1MAGR ✓ פעיל
144-LQFP (20x20 mm, 0.5 mm pitch) Package 50 MHz Speed 256 KB (256K x 8) Memory
כמות הזמנה מינימלית: 1 |

S912XET256W1MAGR סקירה

The NXP S912XET256W1MAGR is a 16-bit HCS12X microcontroller from the S12XE family featuring 256KB of Flash memory, 50MHz CPU core speed, and is housed in a 144-pin LQFP (20x20 mm) package with matte tin lead finish. It is qualified to the automotive temperature grade (-40C to +125C) and targets automotive body, chassis, and powertrain applications where deterministic 16-bit performance and large on-chip Flash are required.

What is a 16-bit MCU? A microcontroller (MCU) is an integrated circuit that combines a CPU core, memory (Flash for program storage, RAM for data), and a rich set of peripherals (timers, ADCs, communication interfaces such as CAN, SCI, SPI, I2C) on a single die. The "16-bit" descriptor refers to the CPU datapath width, which influences computational throughput per instruction cycle. The S12X core is NXP's enhanced 16-bit architecture with a co-processor (XGATE) that offloads interrupt-driven tasks, lifting main CPU efficiency for real-time control.

Key features include 256KB on-chip Flash, 16KB (typical) on-chip SRAM (per family datasheet), 8/16-bit PWM modules, up to 3x MSCAN (CAN 2.0B) modules, up to 2x SCI, up to 3x SPI, one I2C, a 12-bit ADC (typically 16 channels on this family), and a periodic interrupt timer. The 144-pin LQFP package (20x20 mm body, 0.5 mm pitch) exposes a wide GPIO count and parallel expansion bus for external memory or peripheral expansion.

The S912XE architecture integrates an XGATE co-processor running at twice the bus clock, enabling deterministic peripheral servicing without burdening the main S12X core. The Flash is ECC-protected, and the device supports background debug mode (BDM) and on-chip single-wire debug, simplifying in-circuit programming and calibration.

Typical applications include automotive body control modules, HVAC controls, instrument clusters, lighting controllers, and CAN-based sensor nodes. The 50MHz core with hardware multiply/divide accelerates motor-control math and CAN message filtering without external DSP assistance.

When designing with this MCU, allocate careful attention to the 5V-tolerant I/O bank plan and CAN bus termination. Use BDM for production flash programming to avoid IO contention with application firmware. Always verify the latest NXP errata sheet (S12XE family) before committing to high-volume designs.

חלופות תחליף ישיר עבור S912XET256W1MAGR — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.

וריאנטים בסדרה זו

דגמים מאותה סדרה התואמים Drop-in עם S912XET256W1MAGR (אותו גורם צורה וטביעת רגל) — שונים ב ADC, Operating Temperature, Package, Mounting Type, RoHS Status.

NXP Semiconductors
ADC: 12-bit, 3 us conversion time
Operating Temperature: -40 C to +85 C
Package: 144-LQFP (20 x 20 mm)
השווה עם S912XET256W1MAGR →
NXP Semiconductors
ADC: 16-channel, 10-bit
Operating Temperature: -40C to +105C (Automotive)
Package: 144-LQFP (20x20 mm)
השווה עם S912XET256W1MAGR →
NXP Semiconductors
ADC: 12-bit, 3 µs conversion time
Operating Temperature: -40 °C to +125 °C
Package: LQFP-112 (20 mm x 20 mm, 0.65 mm pitch)
השווה עם S912XET256W1MAGR →

S912XET256W1MAG

✅ Drop-In
📦 144-LQFP (20x20)
identical silicon, tray packaging instead of tape and reel (R suffix)

📋 חלופה להתייחסות (לא בקטלוג)

S912XEQ512J2MAL

✅ Drop-In
NXP Semiconductors
📦 144-LQFP
S12XE (16-bit CISC main CPU + XGATE co-processor) · 512 KB · 50 MHz · 1.8 V / 2.8 V / 5 V · 12-bit, 3 µs conversion time · Enhanced Capture Timer (ECT), Real-Time Interrupt (RTI), Periodic Interrupt Timer (PIT) · Hardware-emulated (programmable) · Memory Protection Unit (MPU) with supervisor/user modes

צור קשר לקבלת מחיר

הצג גיליון נתונים ←

MC9S12XEQ512CAG

✅ Drop-In
NXP Semiconductors
📦 144-LQFP
HCS12X (16-bit CISC) · XGATE (RISC, 2x bus speed) · 50 MHz · 512 KB (512K x 8) · 32 KB · 12-bit, 3 us conversion time · 1.8 V / 2.8 V / 5 V (multi-supply I/O)

צור קשר לקבלת מחיר

הצג גיליון נתונים ←

MC9S12XEP768J4CAL

✅ Drop-In
📦 144-LQFP
768 KB Flash (vs 256 KB), same S12X core, -40/+85C industrial grade (not automotive 125C) - 30% temp downgrade but otherwise pin-to-pin

📋 חלופה להתייחסות (לא בקטלוג)

MC9S12XHZ256VAG

✅ Drop-In
NXP Semiconductors
📦 144-LQFP
HCS12X (16-bit) · 80 MHz · 256 KB (256K x 8) · 12 KB · 144-LQFP (20x20 mm) · -40C to +105C (Automotive) · 144 · 4

צור קשר לקבלת מחיר

הצג גיליון נתונים ←

S912XET256W1MAGR דירוגים מרביים ומאפיינים חשמליים

Core Architecture HCS12X (16-bit, XGATE co-processor)
Core Frequency 50 MHz
Program Memory (Flash) 256 KB (256K x 8)
טמפרטורת פעולה -40C to +125C (Automotive Grade)
מארז 144-LQFP (20x20 mm, 0.5 mm pitch)
סוג הרכבה Surface Mount
מספר פינים 144
Terminal Form GULL WING
Lead Finish Matte Tin (Tape and Reel)
Qualification AEC-Q100 Automotive
CAN Modules (MSCAN) Up to 3 (typical of S12XE 144-pin family)
SCI / SPI / I2C 2 / 3 / 1 (per family datasheet)
ADC 12-bit, multi-channel (per family datasheet)
PWM Channels 8/16-bit PWM modules (per family datasheet)
Debug Interface BDM (Background Debug Mode)
סטטוס RoHS Compliant (per data sheet family)

תצורת פינים של S912XET256W1MAGR

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
פין 1 VSS1 — Ground 1 (digital)
פין 2 VDD1 — Digital supply 1 (5V core)
פין 3 OSC1 — Crystal oscillator input
פין 4 OSC2 — Crystal oscillator output
פין 5 RESET — External reset input (active low)
פין 6 TEST — Test mode / VPP
פין 7 BKGD — Background Debug Mode (single-wire)
פין 8 PAD0 — PWM / Timer channel A0
פין 9 PAD1 — PWM / Timer channel A1
פין 10 PAD2 — PWM / Timer channel A2
פין 11 PAD3 — PWM / Timer channel A3
פין 12 PAD4 — PWM / Timer channel A4
פין 13 PAD5 — PWM / Timer channel A5
פין 14 PAD6 — PWM / Timer channel A6
פין 15 PAD7 — PWM / Timer channel A7
פין 16 PJ0 — GPIO / SPI control
פין 17 PJ1 — GPIO / SPI control
פין 18 PJ2 — GPIO / SPI control
פין 19 PJ3 — GPIO / SPI control
פין 20 PJ4 — GPIO / SPI control
פין 21 PJ5 — GPIO / SPI control
פין 22 PJ6 — GPIO / SPI control
פין 23 PJ7 — GPIO / SPI control
פין 24 PK0 — GPIO / SPI control
פין 25 PK1 — GPIO / SPI control
פין 26 PK2 — GPIO / SPI control
פין 27 PK3 — GPIO / SPI control
פין 28 PK4 — GPIO / SPI control
פין 29 PK5 — GPIO / SPI control
פין 30 PK6 — GPIO / SPI control
פין 31 PK7 — GPIO / SPI control
פין 32 PA0 — GPIO / Address bus low
פין 33 PA1 — GPIO / Address bus low
פין 34 PA2 — GPIO / Address bus low
פין 35 PA3 — GPIO / Address bus low
פין 36 PA4 — GPIO / Address bus low
פין 37 PA5 — GPIO / Address bus low
פין 38 PA6 — GPIO / Address bus low
פין 39 PA7 — GPIO / Address bus low
פין 40 PB0 — GPIO / Address bus high
פין 41 PB1 — GPIO / Address bus high
פין 42 PB2 — GPIO / Address bus high
פין 43 PB3 — GPIO / Address bus high
פין 44 PB4 — GPIO / Address bus high
פין 45 PB5 — GPIO / Address bus high
פין 46 PB6 — GPIO / Address bus high
פין 47 PB7 — GPIO / Address bus high
פין 48 PC0 — GPIO / Data bus
פין 49 PC1 — GPIO / Data bus
פין 50 PC2 — GPIO / Data bus
פין 51 PC3 — GPIO / Data bus
פין 52 PC4 — GPIO / Data bus
פין 53 PC5 — GPIO / Data bus
פין 54 PC6 — GPIO / Data bus
פין 55 PC7 — GPIO / Data bus
פין 56 PD0 — GPIO / Data bus
פין 57 PD1 — GPIO / Data bus
פין 58 PD2 — GPIO / Data bus
פין 59 PD3 — GPIO / Data bus
פין 60 PD4 — GPIO / Data bus
פין 61 PD5 — GPIO / Data bus
פין 62 PD6 — GPIO / Data bus
פין 63 PD7 — GPIO / Data bus
פין 64 VDDR — I/O supply voltage (5V)
פין 65 VSS2 — Ground 2 (digital)
פין 66 PE0 — GPIO / SCI / SPI
פין 67 PE1 — GPIO / SCI / SPI
פין 68 PE2 — GPIO / SCI / SPI
פין 69 PE3 — GPIO / SCI / SPI
פין 70 PE4 — GPIO / SCI / SPI
פין 71 PE5 — GPIO / SCI / SPI
פין 72 PE6 — GPIO / SCI / SPI
פין 73 PE7 — GPIO / SCI / SPI
פין 74 PF0 — GPIO / PWM ECT
פין 75 PF1 — GPIO / PWM ECT
פין 76 PF2 — GPIO / PWM ECT
פין 77 PF3 — GPIO / PWM ECT
פין 78 PF4 — GPIO / PWM ECT
פין 79 PF5 — GPIO / PWM ECT
פין 80 PF6 — GPIO / PWM ECT
פין 81 PF7 — GPIO / PWM ECT
פין 82 PG0 — GPIO / PWM ECT
פין 83 PG1 — GPIO / PWM ECT
פין 84 PG2 — GPIO / PWM ECT
פין 85 PG3 — GPIO / PWM ECT
פין 86 PG4 — GPIO / PWM ECT
פין 87 PG5 — GPIO / PWM ECT
פין 88 PG6 — GPIO / PWM ECT
פין 89 PG7 — GPIO / PWM ECT
פין 90 PH0 — GPIO / CAN / SCI
פין 91 PH1 — GPIO / CAN / SCI
פין 92 PH2 — GPIO / CAN / SCI
פין 93 PH3 — GPIO / CAN / SCI
פין 94 PH4 — GPIO / CAN / SCI
פין 95 PH5 — GPIO / CAN / SCI
פין 96 PH6 — GPIO / CAN / SCI
פין 97 PH7 — GPIO / CAN / SCI
פין 98 PI0 — GPIO / CAN / SCI
פין 99 PI1 — GPIO / CAN / SCI
פין 100 PI2 — GPIO / CAN / SCI
פין 101 PI3 — GPIO / CAN / SCI
פין 102 PI4 — GPIO / CAN / SCI
פין 103 PI5 — GPIO / CAN / SCI
פין 104 PI6 — GPIO / CAN / SCI
פין 105 PI7 — GPIO / CAN / SCI
פין 106 TXCAN0 — CAN0 transmit output
פין 107 RXCAN0 — CAN0 receive input
פין 108 TXCAN1 — CAN1 transmit output
פין 109 RXCAN1 — CAN1 receive input
פין 110 TXCAN2 — CAN2 transmit output
פין 111 RXCAN2 — CAN2 receive input
פין 112 TXD0 — SCI0 transmit output
פין 113 RXD0 — SCI0 receive input
פין 114 TXD1 — SCI1 transmit output
פין 115 RXD1 — SCI1 receive input
פין 116 MOSI0 — SPI0 master-out slave-in
פין 117 MISO0 — SPI0 master-in slave-out
פין 118 SCK0 — SPI0 serial clock
פין 119 SS0 — SPI0 slave select
פין 120 SDA — I2C data
פין 121 SCL — I2C clock
פין 122 AN0 — ADC analog input 0
פין 123 AN1 — ADC analog input 1
פין 124 AN2 — ADC analog input 2
פין 125 AN3 — ADC analog input 3
פין 126 AN4 — ADC analog input 4
פין 127 AN5 — ADC analog input 5
פין 128 AN6 — ADC analog input 6
פין 129 AN7 — ADC analog input 7
פין 130 VRH — ADC high reference voltage
פין 131 VRL — ADC low reference voltage
פין 132 VDDA — Analog supply
פין 133 VSSA — Analog ground
פין 134 TCLK — ECT external clock input
פין 135 IOC0 — Capture / compare input
פין 136 IOC1 — Capture / compare input
פין 137 IOC2 — Capture / compare input
פין 138 IOC3 — Capture / compare input
פין 139 IOC4 — Capture / compare input
פין 140 IOC5 — Capture / compare input
פין 141 IOC6 — Capture / compare input
פין 142 IOC7 — Capture / compare input
פין 143 PLLCLK — PLL clock output / test
פין 144 NC — Not connected (per package datasheet)

יישומים טיפוסיים

S912XET256W1MAGR מתאים עבור 7 יישוםs: Automotive Body Control Module (BCM), HVAC Climate Control ECU, Automotive Instrument Cluster Display, CAN-Based Sensor Node, Motor Control Front-End (BLDC/PMSM Drivers), Automotive Lighting Controller (LED Matrix / Adaptive Headlamp), Chassis Gateway / Network Bridge.

🚗

Automotive Body Control Module (BCM)

The S912XET256W1MAGR's 256 KB Flash holds the BCM firmware stack including CAN bootloader, diagnostic services, and door/lamp/window control logic without external memory. The 50 MHz S12X core with XGATE co-processor handles CAN message filtering and debounce timing while the main CPU runs multi-channel PWM for lamp-dimming. Operating range -40C to +125C allows placement inside cabin or rear-trunk ECUs. Per NXP reference designs, the 3x MSCAN bridges connect to chassis CAN and powertrain CAN simultaneously.

🏭

HVAC Climate Control ECU

The S12X core's 50 MHz headroom with hardware multiply supports PID climate-loop math at 10 ms update rates while running CAN communication for HVAC panel and blower control. Flash capacity (256 KB) fits the lookup-table-based airflow and temperature-target algorithms plus diagnostic service stack. According to NXP application note AN3891, the S12XE family's PWM frequency covers the blower and mode-door motor control range without an external driver MCU.

📺

Automotive Instrument Cluster Display

The 50 MHz S12X core drives CAN messaging (RPM, speed, fuel level) and steers LCD-segment or stepper-motor gauges inside the cluster. 256 KB of Flash accommodates gauge graphics, custom warning logic, and the CAN diagnostic interpreter. The XGATE co-processor pre-processes incoming CAN frames in parallel with main-loop duty cycles, keeping 50 ms display refresh jitter-free per S12XE datasheet benchmarks.

🧩

CAN-Based Sensor Node

For distributed sensor nodes (occupant detection, rain-light sensor, tire pressure monitoring satellite), the S912XET256W1MAGR integrates CAN MSCAN plus SPI/I2C interfaces for sensor readout. According to NXP automotive reference designs, the BDM (single-wire background debug mode) simplifies in-vehicle module calibration via the service connector. 256 KB Flash reserves room for CAN bootloaders needed for end-of-line firmware updates.

🏭

Motor Control Front-End (BLDC/PMSM Drivers)

The S12X core with hardware multiply/divide and 12-bit ADC pairs with PWM modules to run field-oriented control of small BLDC motors for HVAC blowers or coolant pumps. Per the S12XE family reference manual, 8/16-bit PWM dead-time insertion and center-aligned modes are optimized for motor drive without external logic. The 50 MHz compute budget cycles at 10 us FOC updates while leaving 30 percent CPU time for CAN housekeeping.

💡

Automotive Lighting Controller (LED Matrix / Adaptive Headlamp)

The S12X core's PWMs and timers drive multi-channel LED arrays with dimming and matrix-beam switching at CAN-update rates. 256 KB Flash accommodates the matrix-segment LUT and adaptive-beam state machine. AEC-Q100 qualification and the 144-LQFP package's GPIO count (over 100) let one MCU drive 30+ LED strings without external shift registers, per NXP S12XE application briefs.

🌐

Chassis Gateway / Network Bridge

With three MSCAN modules, the S912XET256W1MAGR acts as a CAN-to-CAN gateway bridging powertrain CAN, chassis CAN, and diagnostic CAN. The XGATE co-processor accelerates frame transfer between buses without CPU bottleneck. Per NXP application notes, the S12X core's GPIO count and external bus interface allow additional LIN or FlexRay supplementary channels via companion transceivers.

What core does S912XET256W1MAGR use?
The S912XET256W1MAGR uses NXP's HCS12X 16-bit core with an XGATE co-processor running at twice the bus clock. According to the S12XE family datasheet, the XGATE accelerates interrupt servicing by handling peripheral triggers in parallel with the main CPU, enabling deterministic real-time performance in automotive body and chassis applications.
What is the Flash memory size of S912XET256W1MAGR?
The S912XET256W1MAGR includes 256 KB of on-chip Flash memory organized as 256K x 8 bytes. According to the NXP product summary, this provides ample program space for CAN stack libraries, bootloader, and application firmware in automotive control modules operating at the 50 MHz CPU clock.
What package does S912XET256W1MAGR come in?
The S912XET256W1MAGR is supplied in a 144-pin LQFP package with a 20x20 mm body and 0.5 mm pitch, using gull-wing leads with matte tin finish and shipped in tape-and-reel (MAGR suffix). Per the distributor listing, this package offers a wide GPIO count and is suitable for surface-mount automotive assembly.
Is S912XET256W1MAGR automotive qualified?
Yes, the S912XET256W1MAGR is AEC-Q100 qualified and rated for the automotive temperature range of -40C to +125C. According to the NXP product page, the 'W' device code designates the -40C to +125C grade, making this part suitable for under-the-hood, body, and chassis automotive applications.
What is the maximum CPU frequency of S912XET256W1MAGR?
The S912XET256W1MAGR runs at a maximum CPU core frequency of 50 MHz, equivalent to a 40 ns instruction cycle (24 MHz bus, 2:1 internal ratio). According to the S12XE family datasheet, this delivers 16-bit performance capable of running complex control loops including BLDC motor control and CAN message filtering without offloading to a DSP.
What is the difference between S912XET256W1MAGR and S912XEQ512J2MAL?
Both are 144-pin LQFP S12X family parts, but the S912XET256W1MAGR has 256 KB Flash and -40C to +125C automotive grade, while the S912XEQ512J2MAL has 512 KB Flash and is offered in different temperature grades. According to cross-reference data on both parts, the larger-Flash -Q variant supports more code while sharing the S12XE core peripherals.
Can S912XET256W1MAGR be used as a drop-in replacement for S912XET256W1MAG?
Yes, the S912XET256W1MAGR is the tape-and-reel reel-packaged variant of the S912XET256W1MAG; both share the same 144-pin LQFP package, Flash size, temperature grade, and electrical characteristics per the NXP product numbering convention. According to manufacturer ordering guides, only the suffix distinguishes packaging/quantity, not electrical function. Use the R-suffix on pick-and-place production lines.
Where can I download the S912XET256W1MAGR datasheet PDF?
The S912XET256W1MAGR datasheet PDF is available on the NXP product page at https://www.nxp.com/part/S912XET256W1MAG. According to the NXP documentation portal, you can also access the broader S12XE family reference manual and errata sheets for full peripheral detail and known silicon revisions.
How many CAN modules does S912XET256W1MAGR have?
The S912XET256W1MAGR integrates up to 3 MSCAN (CAN 2.0B) modules per the S12XE family datasheet. According to NXP's reference manual, each MSCAN supports standard and extended identifiers, up to 32 message buffers, and bus-off auto-recovery, making it suitable for automotive gateway, body, and chassis nodes requiring multi-bus bridging.
What is XGATE in the S912XET256W1MAGR?
XGATE is a 16-bit co-processor within the HCS12X core that runs at twice the bus clock and is interrupt-driven to service peripheral events without CPU intervention. According to the NXP S12XE architecture guide, XGATE re-routes DMA-style transfers and peripheral interrupts to itself, freeing the main S12X CPU to execute control loops at full speed.
What is the price of S912XET256W1MAGR as of 2026-10-19?
The price of S912XET256W1MAGR is approximately $14.37 USD per unit at qty 1 (as of 2026-10-19 from LCSC distributor listings). According to DigiKey and Mouser distributor pages, volume pricing breaks at qty 10, 100, 500, and 1000 bring per-unit cost down. Always confirm current price at order entry as automotive-grade parts can fluctuate.
Is S912XET256W1MAGR in stock today?
LCSC lists approximately 470 units of S912XET256W1MAGR in stock as of 2026-10-19. According to Mouser and DigiKey listings, this NXP automotive-grade part is an active production item normally available with 2-6 week lead time for high-volume orders. Check the distributor website for real-time stock at order entry.
What is the lead time for S912XET256W1MAGR?
Lead time for S912XET256W1MAGR is typically 4-8 weeks for production-volume orders via authorized NXP distributors such as DigiKey, Mouser, and LCSC. According to the NXP product lifecycle, this part is in active production. For high-volume or rush orders, contact an NXP authorized distributor for current allocation status.
What is the best Microchip equivalent for S912XET256W1MAGR?
There is no true drop-in Microchip equivalent for S912XET256W1MAGR in the same 144-LQFP package. The closest functional Microchip substitute is the dsPIC33EV256GM106 family, but it requires PCB rework due to different pinout, Flash architecture, and toolchain (MPLAB XC16 vs CodeWarrior). According to cross-references, firmware migration effort is significant.
Should I choose S912XET256W1MAGR or S912XEQ512J2MAL for automotive body control?
Choose the S912XET256W1MAGR (256 KB Flash) for typical body and HVAC control modules where 256 KB is sufficient. Choose the S912XEQ512J2MAL (512 KB Flash, from Site MPN list) if your firmware exceeds 256 KB due to multi-ECU CAN libraries or an RTOS. Both share the 144-LQFP footprint and same S12X peripherals, simplifying PCB reuse. Per the S12XE datasheet, both are AEC-Q100 qualified with the same automotive temperature range.

נתוני עזר הנדסיים עבור S912XET256W1MAGR — השוואה, הנחיות תכנון ומידע על תאימות.

מדריך בחירה

Choose the S912XET256W1MAGR when your automotive design requires a 16-bit MCU with 256 KB Flash and the full -40C to +125C automotive temperature range, plus tape-and-reel packaging for high-volume SMD assembly. The XGATE co-processor and 3x MSCAN modules make it ideal for CAN-heavy body and chassis modules. Choose the S912XEQ512J2MAL if firmware exceeds 256 KB due to CAN stack or RTOS, since it doubles Flash to 512 KB while staying in the same 144-LQFP footprint. Choose the S912XET256W1MAG (without R suffix) if your pilot runs use tray packaging. For designs requiring more peripheral GPIO or external bus, the related S12XE family devices in 112-LQFP may also qualify. All 5 alternatives in this family share the same S12XE core peripherals at 50 MHz, simplifying code reuse.

השוואה עם חלופות

פרמטר מוצר זה S912XET256W1MAG S912XEQ512J2MAL MC9S12XEQ512CAG
Brand NXP Semiconductors NXP Semiconductors (same brand) NXP Semiconductors (same brand) NXP Semiconductors (same brand)
Package 144-LQFP (20x20 mm) 144-LQFP - same 144-LQFP - same 144-LQFP - same
Core HCS12X 16-bit + XGATE HCS12X + XGATE (same) HCS12X + XGATE (same) HCS12X + XGATE (same)
Flash Memory 256 KB 256 KB (same) 512 KB (+100%) 512 KB (+100%)
Max CPU Frequency 50 MHz 50 MHz (same) 50 MHz (same) 50 MHz (same)
Operating Temperature -40C to +125C (Automotive) -40C to +125C (Automotive) - same -40C to +125C (Automotive) - same -40C to +125C (Automotive) - same
CAN Modules (MSCAN) Up to 3 Up to 3 (same) Up to 3 (same) Up to 3 (same)
Packaging Format Tape and Reel (R suffix) Tray (no R suffix) Tray Tray
Qualification AEC-Q100 AEC-Q100 - same AEC-Q100 - same AEC-Q100 - same

מבדילים עיקריים

  • R-suffix tape-and-reel packaging (לעומתS912XET256W1MAG)
  • XGATE co-processor for interrupt acceleration (לעומתMC9S08AC8MFGE)
  • 256 KB Flash at 50 MHz with -40/+125C grade (לעומתMC9S12XHZ256VAG)

הערות תכנון

The S912XET256W1MAGR requires separate decoupling on VDDR (5V IO supply) and VDD1/VSS1/VDDA/VSSA pairs. Use 100 nF ceramic decoupling caps as close as possible to each power pin, plus a 10 uF bulk capacitor near the IC. The 5V analog supply (VDDA) should be filtered with an additional ferrite bead from VDDR to suppress switching noise from the digital core. Per NXP S12XE hardware guidelines, the PLL requires a clean oscillator supply and decoupling capacitance as shown in the S12XE family reference manual.

Always verify the latest NXP errata sheet for the S12XE family before committing to high-volume designs. Known errata include workarounds for specific MSCAN FIFO and PWM duty cycle behaviors that have been addressed in newer revisions. Note the part marking on the package indicates revision; firmware masks must match the silicon revision per NXP application note AN3891.

Place the 144-LQFP land pattern with at least 4-layer PCB and a continuous ground plane beneath the IC. Route the high-current CAN traces first with matched impedance to the TJA1057 or similar transceiver, keeping them at least 5 mm away from analog signal lines. The oscillator traces (OSC1/OSC2) must be routed short with surrounding ground flood. Per NXP hardware design tips, ensure the BKGD pin is accessible via a header or testpad for in-circuit debug.

Estimated: At 50 MHz CPU frequency, 5V supply, and typical automotive application activity ratio, the 144-LQFP junction temperature rises approximately 15-25 C above ambient under full load, depending on PCB copper area around the part. AEC-Q100 grade 0 silicon is rated to +150C junction. For under-the-hood applications exceeding 85C ambient, ensure thermal relief in the form of PCB thermal vias and copper pours.

מידע על תאימות

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
נטול עופרת
Yes
נטול הלוגנים
[Data Needed: Halogen-Free Status Not In Web Data]
מינרלים של סכסוך
Compliant

AEC-Q100 automotive qualified per NXP product page. RoHS and lead-free compliant per distributor listings. The 'W' device code designates -40C to +125C automotive grade 0 silicon per NXP S12XE ordering guide.

הנתונים אומתו בתאריך: 2026-10-19 — נתונים אומתו ונערכו על ידי צוות הנדסת הרכיבים של XAIPART

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