XC7K325T-1FB676C - Kintex-7 FPGA, 326080 Cells | AMD
MPN: XC7K325T-1FB676C ✓ פעילXC7K325T-1FB676C סקירה
A field-programmable gate array, or FPGA, is a programmable semiconductor whose digital logic blocks, I/O, memory, and dedicated processing resources are configured after manufacture. The FPGA hierarchy places this device in the Kintex-7 family, within the broader categories of programmable logic devices, semiconductors, and digital integrated circuits. Unlike fixed-function logic, an FPGA allows interface, protocol, and parallel-algorithm changes to be implemented through bitstream updates rather than PCB redesign.
The XC7K325T part combines 326080 logic cells with 400 I/O in one 676-BBGA FCBGA package. The -1 ordering code identifies a performance grade within the Kintex-7 speed-grade range. Programmable logic resources support parallel datapaths, while dedicated resources commonly address high-speed transceiver, DSP, and block RAM requirements in communications, industrial control, scientific instrumentation, and defense-oriented electronics.
Kintex-7 devices combine configurable logic with high-speed serial transceivers and programmable logic resources for demanding interface designs. The -1 grade targets general-purpose performance-oriented designs rather than the highest -3 speed grade. Because the exact timing, resource counts by type, voltage rails, and transceiver configuration depend on the specific Kintex-7 data sheet and device variant, use the manufacturer tables for final implementation decisions.
Typical deployments include 10G and 40G Ethernet interfaces, high-speed data acquisition, radar and electronic-warfare signal paths, industrial protocol bridges, video-processing pipelines, and test equipment. The large device and fine-pitch BGA package also make power delivery, decoupling, thermal management, and signal integrity central to successful implementation.
For a new board, reproduce the manufacturer reference power and decoupling layout, keep high-speed nets short and continuously referenced, and validate every power rail under maximum transceiver activity. For an existing design, compare the complete ball map, voltage rails, configuration pins, and transceiver assignments before treating another 676-ball device as a replacement.
This page consolidates package, resource, sourcing, and engineering information for the XC7K325T-1FB676C, including drop-in candidate comparisons and design guidance that help shorten component-selection and hardware-integration work.
חלופות תחליף ישיר עבור XC7K325T-1FB676C — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם XC7K325T-1FB676C (אותו גורם צורה וטביעת רגל) — שונים ב Package, Core Voltage, Device Type, Operating Temperature.
XC7K325T-1FBG676C
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←XC7K325T-1FBG676I
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
XC7K325T-1FFG676C
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←XC7K325T-1FB676I
✅ Drop-Inצור קשר לקבלת מחיר
הצג גיליון נתונים ←XC7K325T-1FB676E
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
XC7K325T-1FF676C
✅ Drop-In📋 חלופה להתייחסות (לא בקטלוג)
XC7K325T-1FB676C דירוגים מרביים ומאפיינים חשמליים
| Device Type | Kintex-7 Field Programmable Gate Array |
| Logic Cells | 326080 |
| User I/O | 400 |
| Speed Grade | -1 |
| מארז | 676-BBGA FCBGA |
| Package Pin Count | 676 balls |
| Package Type | FCBGA |
| Programmable Logic | Kintex-7 FPGA |
| Device Family | Kintex-7 |
| סוג הרכבה | Surface Mount |
| Terminal Type | Ball |
| Package Shape | Square |
מדריך תצורת פינים של XC7K325T-1FB676C square
תצורת פינים עבור XC7K325T-1FB676C (מארזת square). מעגל משולב דיגיטלי זה כולל GPIO, ממשקי תקשורת (UART, SPI, I2C) ופיני מתח. יש לעיין בגיליון הנתונים של היצרן לפונקציות פינים חלופיות ולאפשרויות תצורה. חיוני לתכנון מערכות משובצות ולפריסת PCB.
אין נתוני פריסת פינים מפורטים עבור XC7K325T-1FB676C.
עיינו ב- גיליון נתונים עבור תצורת פינים מלאה.
יישומים טיפוסיים
XC7K325T-1FB676C מתאים עבור 6 יישוםs: High-Speed Data Acquisition, Ethernet and Network Packet Processing, DSP and Digital Signal Processing, Industrial Control and Automation, Radar and Electronic-Warfare Signal Paths, Test and Measurement Instrumentation.
High-Speed Data Acquisition
The XC7K325T-1FB676C is suitable for parallel and multi-channel acquisition systems because it provides 326080 logic cells and 400 user I/O in a 676-ball FCBGA package. Engineers can use the programmable logic for channel alignment, digital filtering, triggering, packetization, and real-time data reduction. The 400 I/O allow multiple parallel buses or control interfaces to coexist, although actual channel count depends on the selected I/O standards. Implementation should use the manufacturer pinout files for exact ball assignments and controlled-impedance routing for high-rate interfaces.
מומלץ
Ethernet and Network Packet Processing
The XC7K325T-1FB676C fits Ethernet aggregation, protocol conversion, and line-rate packet-processing designs where parallel logic must operate alongside programmable serial interfaces. Its 326080 logic cells provide substantial capacity for queues, headers, lookup logic, and traffic management, while 400 I/O support ancillary interfaces. The Kintex-7 family is known for programmable high-speed connectivity, making the device appropriate for network-interface, test, and protocol-conversion equipment. Confirm the required transceiver configuration, reference clocks, and lane ratings in the manufacturer tables.
מומלץ
DSP and Digital Signal Processing
The XC7K325T-1FB676C can implement parallel filtering, correlation, waveform generation, and spectral-processing pipelines by combining programmable logic with dedicated FPGA processing resources. The 326080-cell footprint allows multiple channels to be processed concurrently without relying on a separate processor for every data path. Use pipelined multipliers, block RAM, and real-time constraints in the implementation to obtain predictable throughput. Exact DSP-slice and RAM availability must be read from the device tables, while the -1 grade provides the timing target for this design.
מומלץ
Industrial Control and Automation
The XC7K325T-1FB676C is appropriate for industrial controllers that combine deterministic logic, multiple I/O standards, communications, and supervisory control in one device. The 326080 logic cells allow motion control, sequencing, safety logic, and protocol stacks to share a single programmable platform, while 400 I/O reduce the need for external glue logic. The -1 speed grade supports general-purpose control timing. Industrial deployments should confirm temperature qualification, isolation strategy, protection networks, and EMC requirements before the design is released.
מומלץ
Radar and Electronic-Warfare Signal Paths
The XC7K325T-1FB676C offers the logic capacity required for parallel radar, electronic-warfare, and high-rate signal-chain functions such as pulse processing, correlation, filtering, and test-and-measurement logic. Its 326080 logic cells allow several data paths to operate concurrently, and the -1 grade addresses performance-oriented designs. The 676-ball package also provides substantial I/O and power-delivery capacity for complex boards. Design validation should include timing closure, transceiver usage, power analysis, thermal testing, and controlled-impedance layout review.
מומלץ
Test and Measurement Instrumentation
The XC7K325T-1FB676C supports high-performance measurement instruments that require wide parallel buses, programmable logic, and high-speed serial connectivity in one device. Logic resources can implement acquisition sequencing, real-time statistics, calibration tables, and instrument control, while 400 I/O provide flexible connections to converters, memory, and front-end modules. The large device allows prototype architectures to be consolidated before hardware completion. Engineers should use the exact AMD pinout files and confirm clocking, power rails, and transceiver population before releasing the PCB layout.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור XC7K325T-1FB676C — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | XC7K325T-1FBG676C | XC7K325T-1FBG676I | XC7K325T-1FFG676C | XC7K325T-1FB676I | XC7K325T-1FB676E | XC7K325T-1FF676C |
|---|---|---|---|---|---|---|---|
| Brand | AMD | AMD | AMD | AMD | AMD | AMD | AMD |
| Package | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA | 676-BBGA FCBGA |
| Device Family | Kintex-7 | Kintex-7 | Kintex-7 | Kintex-7 | Kintex-7 | Kintex-7 | Kintex-7 |
| Logic Cells | 326080 | 326080 | 326080 | 326080 | 326080 | 326080 | 326080 |
| User I/O | 400 | 400 | 400 | 400 | 400 | 400 | 400 |
| Speed Grade | -1 | -1 | -1 | -1 | -1 | -1 | -1 |
| Temperature-Grade Suffix | C | C | I | C | I | E | C |
| Package Designation | FB676 | FBG676 | FBG676 | FFG676 | FB676 | FB676 | FF676 |
| Programmable Resources | FPGA | FPGA | FPGA | FPGA | FPGA | FPGA | FPGA |
מבדילים עיקריים
- Matches the target commercial suffix while offering an alternative 676-ball package designation (לעומתXC7K325T-1FBG676C)
- Provides the same listed core resource profile with an industrial temperature-grade designation (לעומתXC7K325T-1FBG676I)
- Maintains the same Kintex-7 325T resource count and terminal count (לעומתXC7K325T-1FFG676C)
- Directly retains the target package designation with only the temperature-grade suffix changed (לעומתXC7K325T-1FB676I)
הערות תכנון
Implement the Kintex-7 power architecture as a complete multi-rail system rather than treating the FPGA as a single-supply component. Follow the manufacturer reference layout for core, auxiliary, I/O, and transceiver rails, including plane separation, local decoupling, via distribution, and filtering. Estimated: total dissipation must be taken from Vivado power estimation under the highest expected transceiver and logic activity, then checked against each rail's permissible current before the PCB is released.
The 676-ball FCBGA concentrates heat at the device junction and requires deliberate heat flow through the package substrate, PCB vias, and board structure. Use the package-specific thermal model to select copper area, via density, airflow, and any heat spreader. Estimated: junction rise equals power dissipation multiplied by the effective board-and-ambient thermal resistance, so validate the worst-case corner against the device temperature limit rather than relying on ambient temperature alone.
Assign every high-speed ball from the AMD package-specific pinout file and preserve continuous reference planes beneath clocks and serial links. Match controlled-impedance routes, avoid stubs and unnecessary vias, and provide low-inductance return paths through the BGA escape region. When comparing FB, FBG, and FFG package variants, check the complete ball map because identical ball counts and package dimensions do not by themselves establish electrical or physical interchangeability.
Do not substitute a 676-ball Kintex-7 suffix solely because the logic-cell count and I/O count match. Speed grade, temperature suffix, package code, power rails, configuration pins, dedicated resources, and transceiver options can differ between order codes. Compare the AMD part tables and package files, then run equivalence checks in Vivado to identify changed ports or attributes before releasing a replacement order.
מידע על תאימות
The indexed comparison record identifies a RoHS comparison field but does not state the target's compliance result. Automotive qualification is not applicable to this commercial-grade FPGA ordering code.