EP1SGX25DF672I7N vs EP1SGX25DF672C5N तुलना
विस्तृत दोनों ओर की तुलना EP1SGX25DF672I7N द्वारा Intel और EP1SGX25DF672C5N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP1SGX25DF672I7N | EP1SGX25DF672C5N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | Obsolete | Obsolete |
| Family | Stratix GX | — |
| Logic Elements | 25,660 | 25,660 LE |
| CLBs | 2,566 | — |
| Maximum Operating Frequency | 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) | — |
| Combinatorial Delay (CLB) | 9.48 ns max | — |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| High-Speed Transceiver Channels | 4 | — |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel | Up to 3.1875 Gbps |
| Core Supply Voltage (VCCINT) | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| पैकेज | 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch | — |
| Logic Family | CMOS | — |
| ऑपरेटिंग तापमान | 0 °C to 85 °C (industrial) | 0 C to 85 C (Commercial) |
| Lead-Free | Yes | — |
| RoHS स्थिति | [DATA_NEEDED: rohs status] | — |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount (FBGA) |
| Terminal Form | Ball (BGA) | — |
| Number of Terminals | 672 | — |
| Series | — | Stratix GX |
| User I/O Count | — | 455 |
| Total RAM Bits | — | 1,944,576 bits |
| Supply Voltage (Core) | — | 1.5 V (1.425 V to 1.575 V) |
| Number of Transceivers | — | 20 |
| DSP Blocks | — | 10 (dedicated 18x18 multipliers) |
| Package Type | — | 672-ball Flip-Chip BGA (FBGA-672) |
| Package Dimensions | — | 27 mm x 27 mm, 1.0 mm pitch |
| Speed Grade | — | C5 |
| Configuration Modes | — | PS, PPS, FPP, JTAG |
| Lead Free / RoHS | — | Lead free per Altera/Intel datasheet |