EP1SGX25DF672I7N vs EP1SGX25DF672C5N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1SGX25DF672I7N sa pamamagitan ng Intel at EP1SGX25DF672C5N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1SGX25DF672I7N | EP1SGX25DF672C5N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | Stratix GX | — |
| Logic Elements | 25,660 | 25,660 LE |
| CLBs | 2,566 | — |
| Maximum Operating Frequency | 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) | — |
| Combinatorial Delay (CLB) | 9.48 ns max | — |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| High-Speed Transceiver Channels | 4 | — |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel | Up to 3.1875 Gbps |
| Core Supply Voltage (VCCINT) | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| Packhaging | 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch | — |
| Logic Family | CMOS | — |
| Temperature na Operasyon | 0 °C to 85 °C (industrial) | 0 C to 85 C (Commercial) |
| Lead-Free | Yes | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (FBGA) |
| Terminal Form | Ball (BGA) | — |
| Number of Terminals | 672 | — |
| Series | — | Stratix GX |
| User I/O Count | — | 455 |
| Total RAM Bits | — | 1,944,576 bits |
| Supply Voltage (Core) | — | 1.5 V (1.425 V to 1.575 V) |
| Number of Transceivers | — | 20 |
| DSP Blocks | — | 10 (dedicated 18x18 multipliers) |
| Package Type | — | 672-ball Flip-Chip BGA (FBGA-672) |
| Package Dimensions | — | 27 mm x 27 mm, 1.0 mm pitch |
| Speed Grade | — | C5 |
| Configuration Modes | — | PS, PPS, FPP, JTAG |
| Lead Free / RoHS | — | Lead free per Altera/Intel datasheet |