EP1SGX25DF672I7N vs EP1SGX25DF672C5N 比較
詳細並排比較 EP1SGX25DF672I7N 由 Intel 與 EP1SGX25DF672C5N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP1SGX25DF672I7N | EP1SGX25DF672C5N |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | Obsolete |
| Family | Stratix GX | — |
| Logic Elements | 25,660 | 25,660 LE |
| CLBs | 2,566 | — |
| Maximum Operating Frequency | 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) | — |
| Combinatorial Delay (CLB) | 9.48 ns max | — |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| High-Speed Transceiver Channels | 4 | — |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel | Up to 3.1875 Gbps |
| Core Supply Voltage (VCCINT) | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| 封裝 | 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch | — |
| Logic Family | CMOS | — |
| 工作溫度 | 0 °C to 85 °C (industrial) | 0 C to 85 C (Commercial) |
| Lead-Free | Yes | — |
| RoHS 狀態 | [DATA_NEEDED: rohs status] | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount (FBGA) |
| Terminal Form | Ball (BGA) | — |
| Number of Terminals | 672 | — |
| Series | — | Stratix GX |
| User I/O Count | — | 455 |
| Total RAM Bits | — | 1,944,576 bits |
| Supply Voltage (Core) | — | 1.5 V (1.425 V to 1.575 V) |
| Number of Transceivers | — | 20 |
| DSP Blocks | — | 10 (dedicated 18x18 multipliers) |
| Package Type | — | 672-ball Flip-Chip BGA (FBGA-672) |
| Package Dimensions | — | 27 mm x 27 mm, 1.0 mm pitch |
| Speed Grade | — | C5 |
| Configuration Modes | — | PS, PPS, FPP, JTAG |
| Lead Free / RoHS | — | Lead free per Altera/Intel datasheet |