EP1SGX25DF672I7N vs EP1SGX25DF672C5N Perbandingan
Perbandingan bersamaan detil EP1SGX25DF672I7N dari Intel dan EP1SGX25DF672C5N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP1SGX25DF672I7N | EP1SGX25DF672C5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Obsolete |
| Family | Stratix GX | — |
| Logic Elements | 25,660 | 25,660 LE |
| CLBs | 2,566 | — |
| Maximum Operating Frequency | 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) | — |
| Combinatorial Delay (CLB) | 9.48 ns max | — |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| High-Speed Transceiver Channels | 4 | — |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel | Up to 3.1875 Gbps |
| Core Supply Voltage (VCCINT) | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| Paket | 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch | — |
| Logic Family | CMOS | — |
| Suhu Kerja | 0 °C to 85 °C (industrial) | 0 C to 85 C (Commercial) |
| Lead-Free | Yes | — |
| Status RoHS | [DATA_NEEDED: rohs status] | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount (FBGA) |
| Terminal Form | Ball (BGA) | — |
| Number of Terminals | 672 | — |
| Series | — | Stratix GX |
| User I/O Count | — | 455 |
| Total RAM Bits | — | 1,944,576 bits |
| Supply Voltage (Core) | — | 1.5 V (1.425 V to 1.575 V) |
| Number of Transceivers | — | 20 |
| DSP Blocks | — | 10 (dedicated 18x18 multipliers) |
| Package Type | — | 672-ball Flip-Chip BGA (FBGA-672) |
| Package Dimensions | — | 27 mm x 27 mm, 1.0 mm pitch |
| Speed Grade | — | C5 |
| Configuration Modes | — | PS, PPS, FPP, JTAG |
| Lead Free / RoHS | — | Lead free per Altera/Intel datasheet |