EP3SE110F1152I2N vs EP3SE110F1152I4 तुलना
विस्तृत दोनों ओर की तुलना EP3SE110F1152I2N द्वारा Intel और EP3SE110F1152I4 द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP3SE110F1152I2N | EP3SE110F1152I4 |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | सक्रिय | Obsolete |
| Series | Stratix III Enhanced (EP3SE110) | — |
| Family | Stratix III | Stratix III E |
| Logic Elements (LE) | 107,500 | 107,500 |
| Logic Array Blocks (LABs) / CLBs | 4,300 | — |
| System Gates | 8,936,448 | — |
| User I/O Pins | 744 | — |
| Number of Terminals | 1,152 | — |
| Package Code | BGA (FCBGA) | — |
| Package Shape | Square | — |
| Ball Pitch | 1.00 mm | — |
| Supply Voltage Range | 1.05 V to 1.15 V (nominal 1.1 V) | — |
| Process Technology | 40 nm low-power CMOS | — |
| Maximum Internal Clock Frequency | 100 MHz (per distributor summary; device supports multi-Gbps transceivers) | — |
| ऑपरेटिंग तापमान | -40C to +100C (industrial) | -40°C to +100°C (Industrial) |
| Speed Grade | I2 | — |
| Lead-Free / RoHS | Yes (suffix N) | — |
| माउंटिंग प्रकार | Surface Mount | Surface Mount (BGA) |
| Logic Array Blocks (LABs) | — | 4300 |
| DSP Blocks | — | 744 |
| Embedded Memory (bits) | — | 8,936,448 |
| User I/Os | — | 744 |
| पैकेज | — | 1152-ball FCBGA (Flip-Chip BGA) |
| Process Node | — | 40 nm |
| Maximum User I/O Speed | — | [DATA_NEEDED: maximum I/O toggle rate MHz] |
| PLLs | — | 24 |
| Configuration Modes | — | JTAG, Passive Serial (PS), Fast Passive Parallel (FPP), Active Serial (AS) |
| Memory Interface Support | — | DDR3, DDR2, QDRII+, RLDRAM II |
| Transceiver Protocol Support | — | PCIe Gen1/Gen2, Gbit Ethernet, XAUI, Serial RapidIO |
| RoHS स्थिति | — | Compliant |
| Lead-Free | — | Yes |
| MSL स्तर | — | [DATA_NEEDED: MSL rating] |