EP3SE110F1152I2N vs EP3SE110F1152I4 比較
詳細並排比較 EP3SE110F1152I2N 由 Intel 與 EP3SE110F1152I4 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP3SE110F1152I2N | EP3SE110F1152I4 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | Obsolete |
| Series | Stratix III Enhanced (EP3SE110) | — |
| Family | Stratix III | Stratix III E |
| Logic Elements (LE) | 107,500 | 107,500 |
| Logic Array Blocks (LABs) / CLBs | 4,300 | — |
| System Gates | 8,936,448 | — |
| User I/O Pins | 744 | — |
| Number of Terminals | 1,152 | — |
| Package Code | BGA (FCBGA) | — |
| Package Shape | Square | — |
| Ball Pitch | 1.00 mm | — |
| Supply Voltage Range | 1.05 V to 1.15 V (nominal 1.1 V) | — |
| Process Technology | 40 nm low-power CMOS | — |
| Maximum Internal Clock Frequency | 100 MHz (per distributor summary; device supports multi-Gbps transceivers) | — |
| 工作溫度 | -40C to +100C (industrial) | -40°C to +100°C (Industrial) |
| Speed Grade | I2 | — |
| Lead-Free / RoHS | Yes (suffix N) | — |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| Logic Array Blocks (LABs) | — | 4300 |
| DSP Blocks | — | 744 |
| Embedded Memory (bits) | — | 8,936,448 |
| User I/Os | — | 744 |
| 封裝 | — | 1152-ball FCBGA (Flip-Chip BGA) |
| Process Node | — | 40 nm |
| Maximum User I/O Speed | — | [DATA_NEEDED: maximum I/O toggle rate MHz] |
| PLLs | — | 24 |
| Configuration Modes | — | JTAG, Passive Serial (PS), Fast Passive Parallel (FPP), Active Serial (AS) |
| Memory Interface Support | — | DDR3, DDR2, QDRII+, RLDRAM II |
| Transceiver Protocol Support | — | PCIe Gen1/Gen2, Gbit Ethernet, XAUI, Serial RapidIO |
| RoHS 狀態 | — | Compliant |
| Lead-Free | — | Yes |
| MSL 等級 | — | [DATA_NEEDED: MSL rating] |