EP3SE110F1152I2N vs EP3SE110F1152I4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F1152I2N disebabkan oleh Intel dan EP3SE110F1152I4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE110F1152I2N | EP3SE110F1152I4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Series | Stratix III Enhanced (EP3SE110) | — |
| Family | Stratix III | Stratix III E |
| Logic Elements (LE) | 107,500 | 107,500 |
| Logic Array Blocks (LABs) / CLBs | 4,300 | — |
| System Gates | 8,936,448 | — |
| User I/O Pins | 744 | — |
| Number of Terminals | 1,152 | — |
| Package Code | BGA (FCBGA) | — |
| Package Shape | Square | — |
| Ball Pitch | 1.00 mm | — |
| Supply Voltage Range | 1.05 V to 1.15 V (nominal 1.1 V) | — |
| Process Technology | 40 nm low-power CMOS | — |
| Maximum Internal Clock Frequency | 100 MHz (per distributor summary; device supports multi-Gbps transceivers) | — |
| Suhu Operasi | -40C to +100C (industrial) | -40°C to +100°C (Industrial) |
| Speed Grade | I2 | — |
| Lead-Free / RoHS | Yes (suffix N) | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Logic Array Blocks (LABs) | — | 4300 |
| DSP Blocks | — | 744 |
| Embedded Memory (bits) | — | 8,936,448 |
| User I/Os | — | 744 |
| Kemasan | — | 1152-ball FCBGA (Flip-Chip BGA) |
| Process Node | — | 40 nm |
| Maximum User I/O Speed | — | [DATA_NEEDED: maximum I/O toggle rate MHz] |
| PLLs | — | 24 |
| Configuration Modes | — | JTAG, Passive Serial (PS), Fast Passive Parallel (FPP), Active Serial (AS) |
| Memory Interface Support | — | DDR3, DDR2, QDRII+, RLDRAM II |
| Transceiver Protocol Support | — | PCIe Gen1/Gen2, Gbit Ethernet, XAUI, Serial RapidIO |
| Status RoHS | — | Compliant |
| Lead-Free | — | Yes |
| Aras MSL | — | [DATA_NEEDED: MSL rating] |