EP3SE110F1152I2N vs EP3SE110F1152I4 Perbandingan
Perbandingan bersamaan detil EP3SE110F1152I2N dari Intel dan EP3SE110F1152I4 dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP3SE110F1152I2N | EP3SE110F1152I4 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Obsolete |
| Series | Stratix III Enhanced (EP3SE110) | — |
| Family | Stratix III | Stratix III E |
| Logic Elements (LE) | 107,500 | 107,500 |
| Logic Array Blocks (LABs) / CLBs | 4,300 | — |
| System Gates | 8,936,448 | — |
| User I/O Pins | 744 | — |
| Number of Terminals | 1,152 | — |
| Package Code | BGA (FCBGA) | — |
| Package Shape | Square | — |
| Ball Pitch | 1.00 mm | — |
| Supply Voltage Range | 1.05 V to 1.15 V (nominal 1.1 V) | — |
| Process Technology | 40 nm low-power CMOS | — |
| Maximum Internal Clock Frequency | 100 MHz (per distributor summary; device supports multi-Gbps transceivers) | — |
| Suhu Kerja | -40C to +100C (industrial) | -40°C to +100°C (Industrial) |
| Speed Grade | I2 | — |
| Lead-Free / RoHS | Yes (suffix N) | — |
| Tipe Mounting | Surface Mount | Surface Mount (BGA) |
| Logic Array Blocks (LABs) | — | 4300 |
| DSP Blocks | — | 744 |
| Embedded Memory (bits) | — | 8,936,448 |
| User I/Os | — | 744 |
| Paket | — | 1152-ball FCBGA (Flip-Chip BGA) |
| Process Node | — | 40 nm |
| Maximum User I/O Speed | — | [DATA_NEEDED: maximum I/O toggle rate MHz] |
| PLLs | — | 24 |
| Configuration Modes | — | JTAG, Passive Serial (PS), Fast Passive Parallel (FPP), Active Serial (AS) |
| Memory Interface Support | — | DDR3, DDR2, QDRII+, RLDRAM II |
| Transceiver Protocol Support | — | PCIe Gen1/Gen2, Gbit Ethernet, XAUI, Serial RapidIO |
| Status RoHS | — | Compliant |
| Lead-Free | — | Yes |
| Level MSL | — | [DATA_NEEDED: MSL rating] |