MPC8247CZQMIBA vs MPC8248ZQMIBA तुलना
विस्तृत दोनों ओर की तुलना MPC8247CZQMIBA द्वारा NXP Semiconductors और MPC8248ZQMIBA द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
NXP Semiconductors
MPC8247CZQMIBA - PowerQUICC II 266MHz MPU | NXP | 516-PBGA
MPC8247CZQMIBA ⚠ अंतिम खरीदNXP Semiconductors
MPC8248ZQMIBA - PowerQUICC II 266MHz MPU | NXP 516-PBGA
MPC8248ZQMIBA ⚠ अंतिम खरीदविशेषता तुलना
| पैरामीटर | MPC8247CZQMIBA | MPC8248ZQMIBA |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | Microcontrollers | Microcontrollers |
| लाइफसाइकिल स्थिति | अंतिम बार खरीदें | अंतिम बार खरीदें |
| Manufacturer | NXP Semiconductors (originally Freescale Semiconductor) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Part Number | MPC8247CZQMIBA | — |
| Core | PowerPC 603e (G2_LE) | — |
| Core Process Technology | 0.13 um (HiP7) | — |
| Number of Cores | 1 | 1 |
| डेटा बस चौड़ाई | 32-bit | 32 bit |
| Maximum Core Frequency | 266 MHz | — |
| Address Bus Width | 32-bit | — |
| Cache | 32 KB instruction + 32 KB data | — |
| Co-Processor | Communications Processor Module (CPM), RISC engine | — |
| Security Acceleration (TALITOS) | Not present (variant "without TALITOS") | — |
| Ethernet Controllers | 2 x 10/100 Mbps Fast Ethernet | — |
| Memory Controller | SDRAM, support up to [DATA_NEEDED: max addressable memory] | — |
| PCI Interface | PCI 2.2 host/agent | — |
| USB Interface | USB 1.1 | — |
| Other Peripherals | UART, I2C, HDLC, ATM, multi-channel serial | — |
| ऑपरेटिंग तापमान | -40C to +105C (industrial) | [DATA_NEEDED: operating temperature range] |
| पैकेज | 516-ball PBGA (27x27 mm) | — |
| माउंटिंग प्रकार | Surface Mount | Surface Mount |
| RoHS स्थिति | Non-compliant (legacy product) | No (non-RoHS legacy product) |
| Series | MPC82xx PowerQUICC II | — |
| Processor Series | — | PowerQUICC II (MPC82xx) |
| Core Architecture | — | PowerPC G2_LE (603e-class) |
| अधिकतम क्लॉक फ़्रीक्वेंसी | — | 266 MHz |
| Process Technology | — | 0.13 µm (HiP7) CMOS |
| सप्लाई वोल्टेज | — | 3.3 V |
| Package Type | — | 516-PBGA (TEBGA) |
| Package Dimensions | — | 27 x 27 mm |
| MSL स्तर | — | [DATA_NEEDED: MSL level] |
| On-chip Features | — | Memory controller, PCI bridge, DMA, dual I2C, dual UART, timers, CPM communications module |
| Instruction Set | — | Power Architecture 32-bit |