MPC8247CZQMIBA vs MPC8248ZQMIBA Perbandingan

Perbandingan bersamaan detil MPC8247CZQMIBA dari NXP Semiconductors dan MPC8248ZQMIBA dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MPC8247CZQMIBA MPC8247CZQMIBA - PowerQUICC II 266MHz MPU | NXP | 516-PBGA

MPC8247CZQMIBA - PowerQUICC II 266MHz MPU | NXP | 516-PBGA

MPC8247CZQMIBA ⚠ Waktu Beli Terakhir
NXP Semiconductors
MPC8248ZQMIBA MPC8248ZQMIBA - PowerQUICC II 266MHz MPU | NXP 516-PBGA

MPC8248ZQMIBA - PowerQUICC II 266MHz MPU | NXP 516-PBGA

MPC8248ZQMIBA ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum MPC8247CZQMIBA MPC8248ZQMIBA
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Waktu Pembelian Terakhir Waktu Pembelian Terakhir
Manufacturer NXP Semiconductors (originally Freescale Semiconductor) NXP Semiconductors (formerly Freescale Semiconductor)
Part Number MPC8247CZQMIBA —
Core PowerPC 603e (G2_LE) —
Core Process Technology 0.13 um (HiP7) —
Number of Cores 1 1
Lebar Bus Data 32-bit 32 bit
Maximum Core Frequency 266 MHz —
Address Bus Width 32-bit —
Cache 32 KB instruction + 32 KB data —
Co-Processor Communications Processor Module (CPM), RISC engine —
Security Acceleration (TALITOS) Not present (variant "without TALITOS") —
Ethernet Controllers 2 x 10/100 Mbps Fast Ethernet —
Memory Controller SDRAM, support up to [DATA_NEEDED: max addressable memory] —
PCI Interface PCI 2.2 host/agent —
USB Interface USB 1.1 —
Other Peripherals UART, I2C, HDLC, ATM, multi-channel serial —
Suhu Kerja -40C to +105C (industrial) [DATA_NEEDED: operating temperature range]
Paket 516-ball PBGA (27x27 mm) —
Tipe Mounting Surface Mount Surface Mount
Status RoHS Non-compliant (legacy product) No (non-RoHS legacy product)
Series MPC82xx PowerQUICC II —
Processor Series — PowerQUICC II (MPC82xx)
Core Architecture — PowerPC G2_LE (603e-class)
Frekuensi Bawah Maximum — 266 MHz
Process Technology — 0.13 µm (HiP7) CMOS
Tegangan Pemuat — 3.3 V
Package Type — 516-PBGA (TEBGA)
Package Dimensions — 27 x 27 mm
Level MSL — [DATA_NEEDED: MSL level]
On-chip Features — Memory controller, PCI bridge, DMA, dual I2C, dual UART, timers, CPM communications module
Instruction Set — Power Architecture 32-bit

Spek dan Sumber

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