MSC8156ESAG1000B vs MSC8144ETVT800A तुलना
विस्तृत दोनों ओर की तुलना MSC8156ESAG1000B द्वारा NXP Semiconductors और MSC8144ETVT800A द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
NXP Semiconductors
MSC8156ESAG1000B - 6x SC3850 1GHz DSP SoC | NXP Semiconductors
MSC8156ESAG1000B ✗ जीवन की समाप्तिNXP Semiconductors
MSC8144ETVT800A - SC3400 Core DSP, 800MHz, 783-FCBGA | NXP
MSC8144ETVT800A Obsoleteविशेषता तुलना
| पैरामीटर | MSC8156ESAG1000B | MSC8144ETVT800A |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | DSP | DSP |
| लाइफसाइकिल स्थिति | उत्पादन बंद | Obsolete |
| DSP Cores | 6x SC3850 StarCore cores | — |
| Core Clock Frequency | 1 GHz per core | — |
| Aggregate Performance | [DATA_NEEDED: aggregate MMACS rating] | — |
| Process Technology | 45 nm CMOS | — |
| Hardware Accelerator | MAPLE-B baseband accelerator (turbo decode) | — |
| Memory Controller | 64-bit DDR2/DDR3, up to 800 MT/s | — |
| SerDes Lanes | 2 lanes, SRIO or PCIe (selectable) | — |
| Ethernet | 1x Gigabit Ethernet MAC | — |
| Packet Engine | QUICC Engine subsystem | — |
| Security Engine | SEC 4.0 (Cryptographic accelerator) | — |
| पैकेज | 783-ball FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) |
| ऑपरेटिंग तापमान | 0C to +105C | -40C to +105C |
| सप्लाई वोल्टेज | [DATA_NEEDED: core and I/O rail voltages] | — |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount |
| RoHS स्थिति | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status not in web data] |
| लाइफसाइकिल स्थिति | End of Life (per NXP PCN) | — |
| Core Architecture | — | SC3400 StarCore (4-core) |
| Number of Cores | — | 4 |
| Core Clock Rate | — | 800 MHz |
| On-Chip RAM | — | 10.5 MB |
| Non-Volatile Memory | — | External (NOR/NAND boot ROM) |
| Core Voltage | — | 1.00 V |
| I/O Voltage | — | 3.30 V |
| Operating Temperature Grade | — | Extended Industrial |
| Terminal Form | — | Ball |
| Number of Terminals | — | 783 |
| Package Code | — | BGA / FCBGA |
| Package Shape | — | Square |
| Interfaces | — | Ethernet (UTOPIA), I2C, SPI, TDM, UART |
| Technology | — | High-performance multi-core DSP, SIMD |