MSC8156ESAG1000B vs MSC8144ETVT800A Karşılaştırma
Ayrıntılı yan yana karşılaştırma MSC8156ESAG1000B tarafından NXP Semiconductors ve MSC8144ETVT800A tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
NXP Semiconductors
MSC8156ESAG1000B - 6x SC3850 1GHz DSP SoC | NXP Semiconductors
MSC8156ESAG1000B ✗ Son Kullanım ZamanıNXP Semiconductors
MSC8144ETVT800A - SC3400 Core DSP, 800MHz, 783-FCBGA | NXP
MSC8144ETVT800A ObsoleteÖzellik Karşılaştırması
| Parametre | MSC8156ESAG1000B | MSC8144ETVT800A |
|---|---|---|
| Marka | NXP Semiconductors | NXP Semiconductors |
| Kategori | DSP | DSP |
| Yaşam Döngüsü Durumu | Hayat Dönemi Sonu | Obsolete |
| DSP Cores | 6x SC3850 StarCore cores | — |
| Core Clock Frequency | 1 GHz per core | — |
| Aggregate Performance | [DATA_NEEDED: aggregate MMACS rating] | — |
| Process Technology | 45 nm CMOS | — |
| Hardware Accelerator | MAPLE-B baseband accelerator (turbo decode) | — |
| Memory Controller | 64-bit DDR2/DDR3, up to 800 MT/s | — |
| SerDes Lanes | 2 lanes, SRIO or PCIe (selectable) | — |
| Ethernet | 1x Gigabit Ethernet MAC | — |
| Packet Engine | QUICC Engine subsystem | — |
| Security Engine | SEC 4.0 (Cryptographic accelerator) | — |
| Paket | 783-ball FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) |
| İşletim Sıcaklığı | 0C to +105C | -40C to +105C |
| Besleme Gerilimi | [DATA_NEEDED: core and I/O rail voltages] | — |
| Montaj Türü | Surface Mount (BGA) | Surface Mount |
| RoHS Durumu | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status not in web data] |
| Yaşam Döngüsü Durumu | End of Life (per NXP PCN) | — |
| Core Architecture | — | SC3400 StarCore (4-core) |
| Number of Cores | — | 4 |
| Core Clock Rate | — | 800 MHz |
| On-Chip RAM | — | 10.5 MB |
| Non-Volatile Memory | — | External (NOR/NAND boot ROM) |
| Core Voltage | — | 1.00 V |
| I/O Voltage | — | 3.30 V |
| Operating Temperature Grade | — | Extended Industrial |
| Terminal Form | — | Ball |
| Number of Terminals | — | 783 |
| Package Code | — | BGA / FCBGA |
| Package Shape | — | Square |
| Interfaces | — | Ethernet (UTOPIA), I2C, SPI, TDM, UART |
| Technology | — | High-performance multi-core DSP, SIMD |