MSC8156ESAG1000B vs MSC8144ETVT800A 比較
詳細並排比較 MSC8156ESAG1000B 由 NXP Semiconductors 與 MSC8144ETVT800A 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
NXP Semiconductors
MSC8156ESAG1000B - 6x SC3850 1GHz DSP SoC | NXP Semiconductors
MSC8156ESAG1000B ✗ 停產NXP Semiconductors
MSC8144ETVT800A - SC3400 Core DSP, 800MHz, 783-FCBGA | NXP
MSC8144ETVT800A Obsolete規格比較
| 參數 | MSC8156ESAG1000B | MSC8144ETVT800A |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | DSP | DSP |
| 生命週期狀態 | 停產終止 | Obsolete |
| DSP Cores | 6x SC3850 StarCore cores | — |
| Core Clock Frequency | 1 GHz per core | — |
| Aggregate Performance | [DATA_NEEDED: aggregate MMACS rating] | — |
| Process Technology | 45 nm CMOS | — |
| Hardware Accelerator | MAPLE-B baseband accelerator (turbo decode) | — |
| Memory Controller | 64-bit DDR2/DDR3, up to 800 MT/s | — |
| SerDes Lanes | 2 lanes, SRIO or PCIe (selectable) | — |
| Ethernet | 1x Gigabit Ethernet MAC | — |
| Packet Engine | QUICC Engine subsystem | — |
| Security Engine | SEC 4.0 (Cryptographic accelerator) | — |
| 封裝 | 783-ball FCBGA (29x29 mm) | 783-FCBGA (29x29 mm) |
| 工作溫度 | 0C to +105C | -40C to +105C |
| 供應電壓 | [DATA_NEEDED: core and I/O rail voltages] | — |
| 安裝類型 | Surface Mount (BGA) | Surface Mount |
| RoHS 狀態 | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status not in web data] |
| 生命週期狀態 | End of Life (per NXP PCN) | — |
| Core Architecture | — | SC3400 StarCore (4-core) |
| Number of Cores | — | 4 |
| Core Clock Rate | — | 800 MHz |
| On-Chip RAM | — | 10.5 MB |
| Non-Volatile Memory | — | External (NOR/NAND boot ROM) |
| Core Voltage | — | 1.00 V |
| I/O Voltage | — | 3.30 V |
| Operating Temperature Grade | — | Extended Industrial |
| Terminal Form | — | Ball |
| Number of Terminals | — | 783 |
| Package Code | — | BGA / FCBGA |
| Package Shape | — | Square |
| Interfaces | — | Ethernet (UTOPIA), I2C, SPI, TDM, UART |
| Technology | — | High-performance multi-core DSP, SIMD |