MSC8256ESAG1000B vs MSC8251SVT1000B तुलना
विस्तृत दोनों ओर की तुलना MSC8256ESAG1000B द्वारा NXP Semiconductors और MSC8251SVT1000B द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
NXP Semiconductors
MSC8256ESAG1000B - 6x 1GHz SC3850 StarCore DSP | NXP
MSC8256ESAG1000B ⚠ अंतिम खरीदविशेषता तुलना
| पैरामीटर | MSC8256ESAG1000B | MSC8251SVT1000B |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | DSP | DSP |
| लाइफसाइकिल स्थिति | अंतिम बार खरीदें | Obsolete |
| Core Architecture | StarCore SC3850 VLIW DSP | SC3850 StarCore, single core |
| Number of Cores | 6 | — |
| Core Frequency | 1 GHz | — |
| DDR Memory Interface | DDR2/DDR3 with ECC | — |
| Serial RapidIO | SRIO (peripheral) | Yes (SERDES-based) |
| PCI Express | PCIe (peripheral) | Yes (integrated controller) |
| Gigabit Ethernet | GbE MACs (peripheral) | — |
| Security Engine | SEC (IPsec/SRTP/SSL) | — |
| Queue Engine | QE (peripheral) | — |
| पैकेज | 783-FCPBGA (29x29 mm) | — |
| माउंटिंग प्रकार | Surface Mount, BGA | Surface Mount |
| ऑपरेटिंग तापमान | 0°C to 105°C | [DATA_NEEDED: operating temperature grade] |
| MSL स्तर | 3 | — |
| Peak Reflow Temperature | 245°C (JEDEC J-STD-020) | — |
| Terminal Finish | Tin Silver Copper (e1, JESD-609) | — |
| TDM Links | Up to 4 independent, 62.5 Mbps each | — |
| RoHS स्थिति | Compliant | Compliant |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Core Revision | — | StarCore R2.1 |
| Maximum Core Clock | — | 1 GHz |
| MIPS | — | [DATA_NEEDED: MIPS rating for 1 GHz SC3850] |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| L2 Unified Cache | — | 512 KB (configurable, SRAM or MAP) |
| On-Chip RAM | — | 576 KB |
| Internal ROM | — | 96 KB |
| TDM Interfaces | — | 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support |
| Ethernet MAC | — | Yes (integrated) |
| DMA Controller | — | Multi-channel DMA |
| Package Type | — | FCBGA (Flip-Chip Ball Grid Array) |
| Package Pin Count | — | 783 balls |
| Package Dimensions | — | 29 mm x 29 mm |
| Lead-Free / Halogen-Free | — | Yes (lead-free, halogen-free package) |