MSC8256ESAG1000B vs MSC8251SVT1000B Karşılaştırma

Ayrıntılı yan yana karşılaştırma MSC8256ESAG1000B tarafından NXP Semiconductors ve MSC8251SVT1000B tarafından NXP SemiconductorsAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.

NXP Semiconductors
MSC8256ESAG1000B MSC8256ESAG1000B - 6x 1GHz SC3850 StarCore DSP | NXP

MSC8256ESAG1000B - 6x 1GHz SC3850 StarCore DSP | NXP

MSC8256ESAG1000B ⚠ Son Satın Alma
NXP Semiconductors
MSC8251SVT1000B MSC8251SVT1000B - SC3850 DSP 1GHz 783-FCBGA | NXP

MSC8251SVT1000B - SC3850 DSP 1GHz 783-FCBGA | NXP

MSC8251SVT1000B Obsolete

Özellik Karşılaştırması

Parametre MSC8256ESAG1000B MSC8251SVT1000B
Marka NXP Semiconductors NXP Semiconductors
Kategori DSP DSP
Yaşam Döngüsü Durumu Son Alış Zamanı Obsolete
Core Architecture StarCore SC3850 VLIW DSP SC3850 StarCore, single core
Number of Cores 6 —
Core Frequency 1 GHz —
DDR Memory Interface DDR2/DDR3 with ECC —
Serial RapidIO SRIO (peripheral) Yes (SERDES-based)
PCI Express PCIe (peripheral) Yes (integrated controller)
Gigabit Ethernet GbE MACs (peripheral) —
Security Engine SEC (IPsec/SRTP/SSL) —
Queue Engine QE (peripheral) —
Paket 783-FCPBGA (29x29 mm) —
Montaj Türü Surface Mount, BGA Surface Mount
İşletim Sıcaklığı 0°C to 105°C [DATA_NEEDED: operating temperature grade]
MSL Seviyesi 3 —
Peak Reflow Temperature 245°C (JEDEC J-STD-020) —
Terminal Finish Tin Silver Copper (e1, JESD-609) —
TDM Links Up to 4 independent, 62.5 Mbps each —
RoHS Durumu Compliant Compliant
Manufacturer — NXP Semiconductors (formerly Freescale Semiconductor)
Core Revision — StarCore R2.1
Maximum Core Clock — 1 GHz
MIPS — [DATA_NEEDED: MIPS rating for 1 GHz SC3850]
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
L2 Unified Cache — 512 KB (configurable, SRAM or MAP)
On-Chip RAM — 576 KB
Internal ROM — 96 KB
TDM Interfaces — 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support
Ethernet MAC — Yes (integrated)
DMA Controller — Multi-channel DMA
Package Type — FCBGA (Flip-Chip Ball Grid Array)
Package Pin Count — 783 balls
Package Dimensions — 29 mm x 29 mm
Lead-Free / Halogen-Free — Yes (lead-free, halogen-free package)

Dökümanlar & Kaynaklar

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