MSC8256ESAG1000B vs MSC8251SVT1000B Perbandingan

Perbandingan bersamaan detil MSC8256ESAG1000B dari NXP Semiconductors dan MSC8251SVT1000B dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

NXP Semiconductors
MSC8256ESAG1000B MSC8256ESAG1000B - 6x 1GHz SC3850 StarCore DSP | NXP

MSC8256ESAG1000B - 6x 1GHz SC3850 StarCore DSP | NXP

MSC8256ESAG1000B ⚠ Waktu Beli Terakhir
NXP Semiconductors
MSC8251SVT1000B MSC8251SVT1000B - SC3850 DSP 1GHz 783-FCBGA | NXP

MSC8251SVT1000B - SC3850 DSP 1GHz 783-FCBGA | NXP

MSC8251SVT1000B Obsolete

Perbandingan Spesifikasi

Parameter Umum MSC8256ESAG1000B MSC8251SVT1000B
Merek NXP Semiconductors NXP Semiconductors
Kategori DSP DSP
Status Lingkungan Hidup Waktu Pembelian Terakhir Obsolete
Core Architecture StarCore SC3850 VLIW DSP SC3850 StarCore, single core
Number of Cores 6 —
Core Frequency 1 GHz —
DDR Memory Interface DDR2/DDR3 with ECC —
Serial RapidIO SRIO (peripheral) Yes (SERDES-based)
PCI Express PCIe (peripheral) Yes (integrated controller)
Gigabit Ethernet GbE MACs (peripheral) —
Security Engine SEC (IPsec/SRTP/SSL) —
Queue Engine QE (peripheral) —
Paket 783-FCPBGA (29x29 mm) —
Tipe Mounting Surface Mount, BGA Surface Mount
Suhu Kerja 0°C to 105°C [DATA_NEEDED: operating temperature grade]
Level MSL 3 —
Peak Reflow Temperature 245°C (JEDEC J-STD-020) —
Terminal Finish Tin Silver Copper (e1, JESD-609) —
TDM Links Up to 4 independent, 62.5 Mbps each —
Status RoHS Compliant Compliant
Manufacturer — NXP Semiconductors (formerly Freescale Semiconductor)
Core Revision — StarCore R2.1
Maximum Core Clock — 1 GHz
MIPS — [DATA_NEEDED: MIPS rating for 1 GHz SC3850]
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
L2 Unified Cache — 512 KB (configurable, SRAM or MAP)
On-Chip RAM — 576 KB
Internal ROM — 96 KB
TDM Interfaces — 4 modules, up to 62.5 Mbps each, with H.110/H-MVIP support
Ethernet MAC — Yes (integrated)
DMA Controller — Multi-channel DMA
Package Type — FCBGA (Flip-Chip Ball Grid Array)
Package Pin Count — 783 balls
Package Dimensions — 29 mm x 29 mm
Lead-Free / Halogen-Free — Yes (lead-free, halogen-free package)

Spek dan Sumber

Buka Semua Produk Buat BOM Ajukan Diskon