S9S08AW60E5MFGE vs MC9S08AW60CFUE तुलना
विस्तृत दोनों ओर की तुलना S9S08AW60E5MFGE द्वारा NXP Semiconductors और MC9S08AW60CFUE द्वारा NXP Semiconductors. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
NXP Semiconductors
S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)
S9S08AW60E5MFGE ✓ सक्रिय
विशेषता तुलना
| पैरामीटर | S9S08AW60E5MFGE | MC9S08AW60CFUE |
|---|---|---|
| ब्रांड | NXP Semiconductors | NXP Semiconductors |
| श्रेणी | Microcontrollers | Microcontrollers |
| लाइफसाइकिल स्थिति | सक्रिय | NRND |
| Core Architecture | HCS08 (S08 enhanced), 8-bit CISC | — |
| CPU Clock (Max) | 40 MHz (20 MHz bus) | — |
| Program Flash | 60 KB (60K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | 4 KB |
| EEPROM / Data Flash | [DATA_NEEDED: data EEPROM size] | — |
| सप्लाई वोल्टेज | 3 V / 3.3 V / 5 V | 2.7 V to 5.5 V |
| पैकेज | 44-pin LQFP (10 x 10 mm) | 64-QFP, 14 x 14 mm |
| I/O Pins | [DATA_NEEDED: GPIO count] | — |
| ADC | Multi-channel 10-bit (per family) | — |
| Communication | SCI (UART), SPI, I2C | — |
| Timers | TPM modules with PWM channels | — |
| Debug Interface | BDM (Background Debug Mode) | Single-wire background debug mode interface |
| ऑपरेटिंग तापमान | -40C to +125C (automotive range) | — |
| माउंटिंग प्रकार | Surface Mount | — |
| Family | S08 / MC9S08AW60 series | — |
| Automotive/Industrial | Dual-targeted | — |
| Lead Free / RoHS | Yes (per suffix "E" = Pb-free, "R" = tape & reel) | — |
| Product Type | — | 8-bit HCS08 microcontroller |
| CPU Frequency | — | 40 MHz |
| Program Memory | — | 60 KB Flash |
| Core | — | Enhanced HCS08 8-bit core |
| Internal Bus Frequency | — | 20 MHz |
| I/O Ports | — | 38 ports |
| Connectivity | — | I2C, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Package Height | — | 1 mm |
| Package Pitch | — | 0.50 mm |
| माउंटिंग स्टाइल | — | Surface mount |
| Instruction Cycle | — | 50 ns minimum at 2.7 V and 20 MHz bus |
| Instruction Set | — | HC08 instruction set with added BGND instruction |
| Application Support | — | Industrial and automotive |
| लाइफसाइकिल स्थिति | — | NRND |
| Supplier Reference | — | NXP USA Inc. |