S9S08AW60E5MFGE vs MC9S08AW60CFUE Perbandingan
Perbandingan bersamaan detil S9S08AW60E5MFGE dari NXP Semiconductors dan MC9S08AW60CFUE dari NXP Semiconductors. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
NXP Semiconductors
S9S08AW60E5MFGE - 60KB Flash 8-Bit MCU 44-LQFP | NXP (Tape & Reel)
S9S08AW60E5MFGE ✓ Aktif
Perbandingan Spesifikasi
| Parameter Umum | S9S08AW60E5MFGE | MC9S08AW60CFUE |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | Aktif | NRND |
| Core Architecture | HCS08 (S08 enhanced), 8-bit CISC | — |
| CPU Clock (Max) | 40 MHz (20 MHz bus) | — |
| Program Flash | 60 KB (60K x 8) | — |
| RAM | [DATA_NEEDED: RAM size] | 4 KB |
| EEPROM / Data Flash | [DATA_NEEDED: data EEPROM size] | — |
| Tegangan Pemuat | 3 V / 3.3 V / 5 V | 2.7 V to 5.5 V |
| Paket | 44-pin LQFP (10 x 10 mm) | 64-QFP, 14 x 14 mm |
| I/O Pins | [DATA_NEEDED: GPIO count] | — |
| ADC | Multi-channel 10-bit (per family) | — |
| Communication | SCI (UART), SPI, I2C | — |
| Timers | TPM modules with PWM channels | — |
| Debug Interface | BDM (Background Debug Mode) | Single-wire background debug mode interface |
| Suhu Kerja | -40C to +125C (automotive range) | — |
| Tipe Mounting | Surface Mount | — |
| Family | S08 / MC9S08AW60 series | — |
| Automotive/Industrial | Dual-targeted | — |
| Lead Free / RoHS | Yes (per suffix "E" = Pb-free, "R" = tape & reel) | — |
| Product Type | — | 8-bit HCS08 microcontroller |
| CPU Frequency | — | 40 MHz |
| Program Memory | — | 60 KB Flash |
| Core | — | Enhanced HCS08 8-bit core |
| Internal Bus Frequency | — | 20 MHz |
| I/O Ports | — | 38 ports |
| Connectivity | — | I2C, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Package Height | — | 1 mm |
| Package Pitch | — | 0.50 mm |
| Gaya Mounting | — | Surface mount |
| Instruction Cycle | — | 50 ns minimum at 2.7 V and 20 MHz bus |
| Instruction Set | — | HC08 instruction set with added BGND instruction |
| Application Support | — | Industrial and automotive |
| Status Lingkungan Hidup | — | NRND |
| Supplier Reference | — | NXP USA Inc. |