10M04DCU324A7G vs 10M02DCU324A7G Perbandingan

Perbandingan bersamaan detil 10M04DCU324A7G dari Intel dan 10M02DCU324A7G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum 10M04DCU324A7G 10M02DCU324A7G
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family MAX 10 MAX 10
Logic Elements (LE) 4,000 2,000
Process Node 55 nm —
Core Voltage 1.2 V 1.15 V to 1.25 V
Embedded Memory (bits) 193,536 —
User Flash Memory Integrated (non-volatile configuration) Integrated (on-chip flash configuration)
Maximum User I/O 246 —
Paket 324-pin UFBGA (U324) —
Tipe Mounting Surface Mount (BGA) Surface Mount
Ball Pitch 0.8 mm —
Speed Grade 7 —
Suhu Kerja [DATA_NEEDED: temperature grade -40C to +100C vs -40C to +125C] —
Configuration Memory On-chip flash (instant-on, no external PROM) —
AEC-Q100 Qualification Yes (A-grade suffix) —
Lead-Free / RoHS Yes (G suffix) —
Integrated ADC Yes (12-bit SAR, multiple channels) 12-bit, 1 Msps+, successive approximation
PLL Count [DATA_NEEDED: PLL count for 10M04] —
Multipliers (18x18) [DATA_NEEDED: multiplier count for 10M04] —
Embedded Memory — 110,592 bits
User I/O Count — 160
Embedded 18x18 Multipliers — 16
PLLs — [DATA_NEEDED: PLL count]
Global Clock Networks — [DATA_NEEDED: global clock count]
Supply Voltage (VCCIO) — [DATA_NEEDED: VCCIO range]
Suhu Hubung Kerja — -40 C to +125 C (TJ)
Package Type — 324-UBGA (Ultra FineLine BGA)
Package Dimensions — 15 x 15 mm
Process Technology — 55 nm embedded flash (TSMC)
Status RoHS — Compliant
Lead-Free / Halogen-Free — [DATA_NEEDED: lead-free status]

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