10M25DAF484I7G vs 10M25DAF484C8G Perbandingan
Perbandingan bersamaan detil 10M25DAF484I7G dari Intel dan 10M25DAF484C8G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M25DAF484I7G | 10M25DAF484C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 25,000 | — |
| Embedded Memory (bits) | 691,200 | — |
| User I/Os | 360 | — |
| Paket | 484-FBGA (FBGA) | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch |
| Core Voltage | 1.2 V | — |
| Speed Grade | I7 | -8 |
| Temperature Grade | Industrial (-40 C to +100 C ambient) | — |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Tray / Reel | Tray | — |
| 18 x 18 Multipliers | 66 | — |
| PLLs | 2 | Yes (up to 4 analog PLLs per device) |
| On-chip Configuration Flash | Dual (instant-on, dual-boot) | — |
| Integrated ADC | 12-bit SAR, up to 17 analog inputs | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 25,000 |
| Embedded Memory (Kbits) | — | 1638 |
| User I/O Count | — | 360 |
| Process Technology | — | 55 nm CMOS |
| Core Supply Voltage (VCCINT) | — | 1.2 V (1.15 V min / 1.25 V max) |
| Suhu Kerja | — | 0 °C to 85 °C (Commercial) |
| Configuration Memory | — | On-chip dual-configuration flash |
| ADC | — | Integrated 12-bit ADC (where enabled) |
| Level MSL | — | MSL3 |
| Number of I/O Banks | — | 8 (per F484 pinout) |