10M25DAF484I7G vs 10M25DAF484C8G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M25DAF484I7G disebabkan oleh Intel dan 10M25DAF484C8G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M25DAF484I7G | 10M25DAF484C8G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 25,000 | — |
| Embedded Memory (bits) | 691,200 | — |
| User I/Os | 360 | — |
| Kemasan | 484-FBGA (FBGA) | 484-ball FineLine BGA (F484), 23 × 23 mm, 1.0 mm pitch |
| Core Voltage | 1.2 V | — |
| Speed Grade | I7 | -8 |
| Temperature Grade | Industrial (-40 C to +100 C ambient) | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| Tray / Reel | Tray | — |
| 18 x 18 Multipliers | 66 | — |
| PLLs | 2 | Yes (up to 4 analog PLLs per device) |
| On-chip Configuration Flash | Dual (instant-on, dual-boot) | — |
| Integrated ADC | 12-bit SAR, up to 17 analog inputs | — |
| Status RoHS | Compliant | Compliant |
| Logic Elements | — | 25,000 |
| Embedded Memory (Kbits) | — | 1638 |
| User I/O Count | — | 360 |
| Process Technology | — | 55 nm CMOS |
| Core Supply Voltage (VCCINT) | — | 1.2 V (1.15 V min / 1.25 V max) |
| Suhu Operasi | — | 0 °C to 85 °C (Commercial) |
| Configuration Memory | — | On-chip dual-configuration flash |
| ADC | — | Integrated 12-bit ADC (where enabled) |
| Aras MSL | — | MSL3 |
| Number of I/O Banks | — | 8 (per F484 pinout) |