10M25DCF484A7G vs 10M50DAF484I7G Perbandingan
Perbandingan bersamaan detil 10M25DCF484A7G dari Intel dan 10M50DAF484I7G dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | 10M25DCF484A7G | 10M50DAF484I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 25,000 | 50,000 |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: total Kbits, blocks count] | — |
| Embedded Block RAM | 1,728 Kbit | — |
| Multipliers (18x18) | 81 | — |
| Maximum User I/O | 360 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Paket | 484-ball FBGA (F484) | 484-ball FBGA (F484) |
| Core Voltage | 1.2 V (internal LDO) | — |
| Suhu Kerja | -40C to +125C (automotive AEC-Q100) | — |
| Speed Grade | -7 | — |
| Configuration Type | Dual flash, internal | — |
| User Flash | 12 Kbit (32 Kbyte user flash; total device flash larger) | — |
| ADC Block | 12-bit, 1 MSPS, 17 channels | — |
| Tipe Mounting | Surface Mount | Surface Mount (FBGA) |
| Status RoHS | Compliant | Compliant |
| Embedded Memory (bits) | — | 1,677,312 |
| Embedded User Flash (bits) | — | 1,677,312 (dual configuration) |
| User I/O Count | — | 360 |
| Package Pitch | — | 1.0 mm |
| Package Body Size | — | 23 x 23 mm |
| Process Technology | — | TSMC 55 nm |
| Supply Voltage - Core | — | 1.2 V |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| On-die Configuration Flash | — | Yes (dual-boot) |
| Integrated ADC | — | 12-bit, 1 MSPS, up to 18 channels |
| DSP Blocks | — | 144 (18x18 multipliers) |
| Configuration Mode | — | Single-chip (no external boot device required) |
| Level MSL | — | 3 (per JEDEC J-STD-020) |
| Lead-free / Halogen-free | — | Yes / Yes |