10M25DCF484A7G vs 10M50DAF484I7G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci 10M25DCF484A7G disebabkan oleh Intel dan 10M50DAF484I7G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | 10M25DCF484A7G | 10M50DAF484I7G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX 10 | MAX 10 |
| Logic Elements (LE) | 25,000 | 50,000 |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: total Kbits, blocks count] | — |
| Embedded Block RAM | 1,728 Kbit | — |
| Multipliers (18x18) | 81 | — |
| Maximum User I/O | 360 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | — |
| Kemasan | 484-ball FBGA (F484) | 484-ball FBGA (F484) |
| Core Voltage | 1.2 V (internal LDO) | — |
| Suhu Operasi | -40C to +125C (automotive AEC-Q100) | — |
| Speed Grade | -7 | — |
| Configuration Type | Dual flash, internal | — |
| User Flash | 12 Kbit (32 Kbyte user flash; total device flash larger) | — |
| ADC Block | 12-bit, 1 MSPS, 17 channels | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (FBGA) |
| Status RoHS | Compliant | Compliant |
| Embedded Memory (bits) | — | 1,677,312 |
| Embedded User Flash (bits) | — | 1,677,312 (dual configuration) |
| User I/O Count | — | 360 |
| Package Pitch | — | 1.0 mm |
| Package Body Size | — | 23 x 23 mm |
| Process Technology | — | TSMC 55 nm |
| Supply Voltage - Core | — | 1.2 V |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| On-die Configuration Flash | — | Yes (dual-boot) |
| Integrated ADC | — | 12-bit, 1 MSPS, up to 18 channels |
| DSP Blocks | — | 144 (18x18 multipliers) |
| Configuration Mode | — | Single-chip (no external boot device required) |
| Aras MSL | — | 3 (per JEDEC J-STD-020) |
| Lead-free / Halogen-free | — | Yes / Yes |