10M50DCF484I7G vs 10M50DAF484I7P Perbandingan

Perbandingan bersamaan detil 10M50DCF484I7G dari Intel dan 10M50DAF484I7P dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum 10M50DCF484I7G 10M50DAF484I7P
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family MAX 10 —
Logic Elements 50,000 —
Embedded SRAM 1,677,312 bits (1.6 Mb) —
User Flash Memory Up to 5,888 Kb (on-chip dual configuration) —
Maximum User I/O Pins 360 —
LVDS Channels (dedicated) 160 (rx + tx) —
PLLs 4 8 (general-purpose, fractional on selected devices)
18x18 Hardware Multipliers 144 —
Paket 484-ball FBGA (F484), 23x23 mm, 1.0 mm pitch 484-ball FineLine BGA (F484)
Core Voltage 1.2 V (internal) —
Process Technology TSMC 55 nm embedded flash —
Suhu Hubung Kerja -40C to +100C (industrial, 'I' suffix) —
Speed Grade 7 (fastest commercial/industrial) 7 (slowest industrial bin, highest margin)
Configuration Mode On-chip flash + JTAG —
Integrated ADC 12-bit, up to 17 channels, 1 MSPS —
Tipe Mounting Surface Mount (BGA) —
Status RoHS Compliant Compliant
Product Family — MAX 10
Logic Elements (LE) — 50,000
Embedded Memory (bits) — 1,677,312
Embedded Memory Blocks — M9K (and M144K)
18x18 Multipliers — 312
User I/O Pins (max) — 360
Pitch — 1.0 mm
Process Node — 55 nm embedded flash (TSMC)
On-die Configuration Flash — Yes (non-volatile, instant-on)
On-die ADC — Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs
Global Clock Networks — 20
Suhu Kerja — -40C to +100C (Tj, industrial)
Configuration Modes — Internal flash, JTAG, dual-boot image support

Spek dan Sumber

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