10M50DCF484I7G vs 10M50DAF484I7P 比較

詳細並排比較 10M50DCF484I7G 由 Intel 與 10M50DAF484I7P 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
10M50DCF484I7G 10M50DCF484I7G - MAX 10 FPGA 50K LE 484-FBGA | Intel

10M50DCF484I7G - MAX 10 FPGA 50K LE 484-FBGA | Intel

10M50DCF484I7G ✓ 啟用中

規格比較

參數 10M50DCF484I7G 10M50DAF484I7P
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 啟用中 啟用中
Family MAX 10 —
Logic Elements 50,000 —
Embedded SRAM 1,677,312 bits (1.6 Mb) —
User Flash Memory Up to 5,888 Kb (on-chip dual configuration) —
Maximum User I/O Pins 360 —
LVDS Channels (dedicated) 160 (rx + tx) —
PLLs 4 8 (general-purpose, fractional on selected devices)
18x18 Hardware Multipliers 144 —
封裝 484-ball FBGA (F484), 23x23 mm, 1.0 mm pitch 484-ball FineLine BGA (F484)
Core Voltage 1.2 V (internal) —
Process Technology TSMC 55 nm embedded flash —
工作接面溫度 -40C to +100C (industrial, 'I' suffix) —
Speed Grade 7 (fastest commercial/industrial) 7 (slowest industrial bin, highest margin)
Configuration Mode On-chip flash + JTAG —
Integrated ADC 12-bit, up to 17 channels, 1 MSPS —
安裝類型 Surface Mount (BGA) —
RoHS 狀態 Compliant Compliant
Product Family — MAX 10
Logic Elements (LE) — 50,000
Embedded Memory (bits) — 1,677,312
Embedded Memory Blocks — M9K (and M144K)
18x18 Multipliers — 312
User I/O Pins (max) — 360
Pitch — 1.0 mm
Process Node — 55 nm embedded flash (TSMC)
On-die Configuration Flash — Yes (non-volatile, instant-on)
On-die ADC — Dual 12-bit SAR, 1 MSPS, up to 16 analog inputs
Global Clock Networks — 20
工作溫度 — -40C to +100C (Tj, industrial)
Configuration Modes — Internal flash, JTAG, dual-boot image support

資料表與資源

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